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Discover 68 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Number of I/O | Speed | RAM Size | Program Memory Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Number of I/O | Speed | RAM Size | Program Memory Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | |
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NXP USA Inc. |
188
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 8MB FLASH 516BGA
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA，LVD，POR，Zipwire | - | 264MHz | 512K x 8 | 8MB (8M x 8) | 3 V ~ 5.5 V | A/D 16b Sigma-Delta，eQADC | Internal | CANbus，EBI/EMI，Ethernet，FlexCANbus，LINbus，SCI，SPI | 32-Bit Tri-Core | ||
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NXP USA Inc. |
727
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 4MB FLASH 516BGA
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Tray | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 516-BBGA | 516-PBGA (27x27) | DMA，POR，PWM | 32 | 264MHz | 256K x 8 | 4MB (4M x 8) | 1.08 V ~ 5.25 V | A/D 64x12b | External | CANbus，EBI/EMI，SCI，SPI | 32-Bit | ||
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NXP USA Inc. |
210
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 8MB FLASH 512BGA
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 512-FBGA | 512-TEPBGA (25x25) | DMA，LVD，POR，Zipwire | - | 300MHz | 404K x 8 | 8.64MB (8M x 8) | 3 V ~ 5.5 V | A/D 12b SAR，16b Sigma-Delta | Internal | CANbus，EBI/EMI，Ethernet，FlexRAY，I2C，LINbus，SPI，PSI，UART/USART | 32-Bit Tri-Core | ||
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NXP USA Inc. |
212
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 8MB FLASH 416BGA
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA，LVD，POR，Zipwire | - | 300MHz | 404K x 8 | 8.64MB (8M x 8) | 3 V ~ 5.5 V | A/D 12b SAR，16b Sigma-Delta | Internal | CANbus，EBI/EMI，Ethernet，FlexRAY，I2C，LINbus，SPI，PSI，UART/USART | 32-Bit Tri-Core | ||
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NXP USA Inc. |
198
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU BATTERY MGMT 416BGA
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA，LVD，POR，Zipwire | 293 | 220MHz | 512K x 8 | 4MB (4M x 8) | 3 V ~ 5.5 V | A/D 40x12b eQADCx2 | External | CANbus，EBI/EMI，Ethernet，FlexCANbus，LINbus，SCI，SPI | 32-Bit Dual-Core | ||
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NXP USA Inc. |
200
|
3 days |
-
|
MOQ: 1 MPQ: 1
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POWER ARCH CORES 8MB FL
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA，LVD，POR，Zipwire | 293 | 264MHz | 512K x 8 | 4MB (4M x 8) | 3 V ~ 5.5 V | A/D 40x12b eQADCx2 | External | CANbus，EBI/EMI，Ethernet，FlexCANbus，LINbus，SCI，SPI | 32-Bit Dual-Core | ||
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NXP USA Inc. |
260
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 8MB FLASH 416BGA
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA，LVD，POR，Zipwire | - | 264MHz | 512K x 8 | 8MB (8M x 8) | 3 V ~ 5.5 V | A/D 16b Sigma-Delta，eQADC | Internal | CANbus，EBI/EMI，Ethernet，FlexCANbus，LINbus，SCI，SPI | 32-Bit Tri-Core | ||
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NXP USA Inc. |
200
|
3 days |
-
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MOQ: 1 MPQ: 1
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NXP 32-BIT MCU POWER ARCH CORES
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA，LVD，POR，Zipwire | - | 264MHz | 512K x 8 | 8MB (8M x 8) | 3 V ~ 5.5 V | A/D 16b Sigma-Delta，eQADC | Internal | CANbus，EBI/EMI，Ethernet，FlexCANbus，LINbus，SCI，SPI | 32-Bit Tri-Core | ||
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NXP USA Inc. |
500
|
3 days |
-
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MOQ: 500 MPQ: 1
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NXP 32-BIT MCU POWER ARCH CORE
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Tape & Reel (TR) | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA，POR，PWM | 32 | 264MHz | 256K x 8 | 4MB (4M x 8) | 1.08 V ~ 5.25 V | A/D 64x12b | External | CANbus，EBI/EMI，SCI，SPI | 32-Bit | ||
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NXP USA Inc. |
194
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 4MB FLASH 416BGA
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Tray | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA，POR，PWM | 32 | 264MHz | 256K x 8 | 4MB (4M x 8) | 1.08 V ~ 5.25 V | A/D 64x12b | External | CANbus，SCI，SPI | 32-Bit | ||
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NXP USA Inc. |
48
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 4MB FLASH 516FBGA
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Tray | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA，POR，PWM | 32 | 264MHz | 256K x 8 | 4MB (4M x 8) | 1.08 V ~ 5.25 V | A/D 64x12b | External | CANbus，EBI/EMI，SCI，SPI | 32-Bit | ||
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NXP USA Inc. |
40
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 3MB FLASH 516FBGA
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Tray | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA，POR，PWM | 32 | 200MHz | 192K x 8 | 3MB (3M x 8) | 1.08 V ~ 5.25 V | A/D 64x12b | External | CANbus，EBI/EMI，SCI，SPI | 32-Bit | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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NXP 32-BIT MCU POWER ARCH CORE
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Tray | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA，POR，PWM | 32 | 264MHz | 256K x 8 | 4MB (4M x 8) | 1.08 V ~ 5.25 V | A/D 64x12b | External | CANbus，EBI/EMI，SCI，SPI | 32-Bit | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 500 MPQ: 1
|
POWER ARCH CORES 8MB FL
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Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA，LVD，POR，Zipwire | 293 | 264MHz | 512K x 8 | 4MB (4M x 8) | 3 V ~ 5.5 V | A/D 40x12b eQADCx2 | External | CANbus，EBI/EMI，Ethernet，FlexCANbus，LINbus，SCI，SPI | 32-Bit Dual-Core | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 500 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORES
|
Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA，LVD，POR，Zipwire | - | 264MHz | 512K x 8 | 8MB (8M x 8) | 3 V ~ 5.5 V | A/D 16b Sigma-Delta，eQADC | Internal | EBI/EMI，Ethernet，FlexCANbus，LINbus，SCI，SPI | 32-Bit Tri-Core | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 500 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORES
|
Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA，LVD，POR，Zipwire | - | 264MHz | 512K x 8 | 8MB (8M x 8) | 3 V ~ 5.5 V | A/D 16b Sigma-Delta，eQADC | Internal | CANbus，EBI/EMI，Ethernet，FlexCANbus，LINbus，SCI，SPI | 32-Bit Tri-Core | ||
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NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORES
|
Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA，LVD，POR，Zipwire | - | 264MHz | 512K x 8 | 8MB (8M x 8) | 3 V ~ 5.5 V | A/D 16b Sigma-Delta，eQADC | Internal | CANbus，EBI/EMI，Ethernet，FlexCANbus，LINbus，SCI，SPI | 32-Bit Tri-Core | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 500 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORES
|
Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA，LVD，POR，Zipwire | - | 264MHz | 512K x 8 | 8MB (8M x 8) | 3 V ~ 5.5 V | A/D 16b Sigma-Delta，eQADC | Internal | CANbus，EBI/EMI，Ethernet，FlexCANbus，LINbus，SCI，SPI | 32-Bit Tri-Core | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 500 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORES
|
Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA，LVD，POR，Zipwire | - | 264MHz | 512K x 8 | 8MB (8M x 8) | 3 V ~ 5.5 V | A/D 16b Sigma-Delta，eQADC | Internal | CANbus，EBI/EMI，Ethernet，FlexCANbus，LINbus，SCI，SPI | 32-Bit Tri-Core | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 200 MPQ: 1
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NXP 32-BIT MCU POWER ARCH CORES
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA，LVD，POR，Zipwire | - | 264MHz | 512K x 8 | 8MB (8M x 8) | 3 V ~ 5.5 V | A/D 16b Sigma-Delta，eQADC | Internal | EBI/EMI，Ethernet，FlexCANbus，LINbus，SCI，SPI | 32-Bit Tri-Core |
