- Series：
-
- Operating Temperature：
-
- Package / Case：
-
- Supplier Device Package：
-
- Peripherals：
-
- Core Processor：
-
- RAM Size：
-
- Program Memory Size：
-
- EEPROM Size：
-
- Voltage - Supply (Vcc/Vdd)：
-
- Data Converters：
-
- Oscillator Type：
-
- Connectivity：
-
- Core Size：
-
- Selected conditions:
Discover 64 products
 |
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | |
|
|
|
NXP USA Inc. |
2,431
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 48LQFP
|
Tray | LPC11Cxx | -40°C ~ 85°C (TA) | 48-LQFP | 48-LQFP (7x7) | Brown-out Detect/Reset，POR，WDT | ARM Cortex-M0 | 50MHz | 8K x 8 | 32KB (32K x 8) | - | 1.8 V ~ 3.6 V | A/D 8x10b | Internal | CANbus，I2C，Microwire，SPI，SSI，SSP，UART/USART | 32-Bit | ||
|
|
|
NXP USA Inc. |
4,940
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 128KB FLASH 48QFN
|
Tray | Kinetis KL2 | -40°C ~ 105°C (TA) | 48-VFQFN Exposed Pad | 48-QFN (7x7) | Brown-out Detect/Reset，DMA，I2S，LVD，POR，PWM，WDT | ARM Cortex-M0+ | 48MHz | 16K x 8 | 128KB (128K x 8) | - | 1.71 V ~ 3.6 V | A/D - 16bit，D/A - 12bit | Internal | I2C，LINbus，SPI，UART/USART，USB，USB OTG | 32-Bit | ||
|
|
|
NXP USA Inc. |
19,692
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 16KB FLASH 44QFP
|
Tray | S08 | -40°C ~ 85°C (TA) | 44-QFP | 44-QFP (10x10) | LVD，POR，PWM，WDT | S08 | 40MHz | 2K x 8 | 16KB (16K x 8) | - | 1.8 V ~ 3.6 V | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
|
|
|
NXP USA Inc. |
2,002
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 32KB FLASH 44QFP
|
Tray | S08 | -40°C ~ 85°C (TA) | 44-QFP | 44-QFP (10x10) | LVD，POR，PWM，WDT | S08 | 40MHz | 2K x 8 | 32KB (32K x 8) | - | 1.8 V ~ 3.6 V | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
|
|
|
NXP USA Inc. |
344
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 60KB FLASH 44QFP
|
Tray | S08 | -40°C ~ 85°C (TA) | 44-QFP | 44-QFP (10x10) | LVD，POR，PWM，WDT | S08 | 40MHz | 4K x 8 | 60KB (60K x 8) | - | 1.8 V ~ 3.6 V | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
|
|
|
NXP USA Inc. |
205
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 64KB FLASH 48QFN
|
Tray | Kinetis KL2 | -40°C ~ 105°C (TA) | 48-VFQFN Exposed Pad | 48-QFN (7x7) | Brown-out Detect/Reset，DMA，I2S，LVD，POR，PWM，WDT | ARM Cortex-M0+ | 48MHz | 8K x 8 | 64KB (64K x 8) | - | 1.71 V ~ 3.6 V | A/D - 16bit，D/A - 12bit | Internal | I2C，LINbus，SPI，UART/USART，USB，USB OTG | 32-Bit | ||
|
|
|
NXP USA Inc. |
874
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 16KB FLASH 48LQFP
|
Tray | LPC11Cxx | -40°C ~ 85°C (TA) | 48-LQFP | 48-LQFP (7x7) | Brown-out Detect/Reset，POR，WDT | ARM Cortex-M0 | 50MHz | 8K x 8 | 16KB (16K x 8) | - | 1.8 V ~ 3.6 V | A/D 8x10b | Internal | CANbus，I2C，Microwire，SPI，SSI，SSP，UART/USART | 32-Bit | ||
|
|
|
NXP USA Inc. |
1,051
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 128KB FLASH 48LQFP
|
Tray | LPC11Exx | -40°C ~ 105°C (TA) | 48-LQFP | 48-LQFP (7x7) | Brown-out Detect/Reset，DMA，POR，PWM，WDT | ARM Cortex-M0+ | 50MHz | 20K x 8 | 128KB (128K x 8) | 4K x 8 | 2.4 V ~ 3.6 V | A/D 8x12b | Internal | I2C，Microwire，SPI，SSI，SSP，UART/USART | 32-Bit | ||
|
|
|
NXP USA Inc. |
1,070
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 256KB FLASH 48QFN
|
Tray | Kinetis KL2 | -40°C ~ 105°C (TA) | 48-UFQFN Exposed Pad | 48-QFN (7x7) | DMA，I2S，LVD，POR，PWM，WDT | ARM Cortex-M0+ | 48MHz | 32K x 8 | 256KB (256K x 8) | - | 1.71 V ~ 3.6 V | A/D 16x16b，D/A 1x12b | Internal | I2C，SPI，UART/USART，USB | 32-Bit | ||
|
|
|
NXP USA Inc. |
2,340
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 128KB FLASH 48QFN
|
Tray | Kinetis KL2 | -40°C ~ 105°C (TA) | 48-VFQFN Exposed Pad | 48-QFN (7x7) | Brown-out Detect/Reset，DMA，LVD，POR，PWM，WDT | ARM Cortex-M0+ | 48MHz | 16K x 8 | 128KB (128K x 8) | - | 1.71 V ~ 3.6 V | A/D 13x16b，D/A 1x12b | Internal | I2C，LINbus，SPI，UART/USART，USB，USB OTG | 32-Bit | ||
|
|
|
NXP USA Inc. |
750
|
3 days |
-
|
MOQ: 750 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 44QFP
|
Tape & Reel (TR) | S08 | -40°C ~ 85°C (TA) | 44-QFP | 44-QFP (10x10) | LVD，POR，PWM，WDT | S08 | 40MHz | 1K x 8 | 8KB (8K x 8) | - | 1.8 V ~ 3.6 V | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
|
|
|
NXP USA Inc. |
998
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 44QFP
|
Cut Tape (CT) | S08 | -40°C ~ 85°C (TA) | 44-QFP | 44-QFP (10x10) | LVD，POR，PWM，WDT | S08 | 40MHz | 1K x 8 | 8KB (8K x 8) | - | 1.8 V ~ 3.6 V | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
|
|
|
NXP USA Inc. |
998
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 44QFP
|
- | S08 | -40°C ~ 85°C (TA) | 44-QFP | 44-QFP (10x10) | LVD，POR，PWM，WDT | S08 | 40MHz | 1K x 8 | 8KB (8K x 8) | - | 1.8 V ~ 3.6 V | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
|
|
|
NXP USA Inc. |
2,250
|
3 days |
-
|
MOQ: 750 MPQ: 1
|
IC MCU 8BIT 16KB FLASH 44QFP
|
Tape & Reel (TR) | S08 | -40°C ~ 85°C (TA) | 44-QFP | 44-QFP (10x10) | LVD，POR，PWM，WDT | S08 | 40MHz | 2K x 8 | 16KB (16K x 8) | - | 1.8 V ~ 3.6 V | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
|
|
|
NXP USA Inc. |
2,587
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 16KB FLASH 44QFP
|
Cut Tape (CT) | S08 | -40°C ~ 85°C (TA) | 44-QFP | 44-QFP (10x10) | LVD，POR，PWM，WDT | S08 | 40MHz | 2K x 8 | 16KB (16K x 8) | - | 1.8 V ~ 3.6 V | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
|
|
|
NXP USA Inc. |
2,587
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 16KB FLASH 44QFP
|
- | S08 | -40°C ~ 85°C (TA) | 44-QFP | 44-QFP (10x10) | LVD，POR，PWM，WDT | S08 | 40MHz | 2K x 8 | 16KB (16K x 8) | - | 1.8 V ~ 3.6 V | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
|
|
|
NXP USA Inc. |
1,778
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 44QFP
|
Tray | S08 | -40°C ~ 85°C (TA) | 44-QFP | 44-QFP (10x10) | LVD，POR，PWM，WDT | S08 | 40MHz | 1K x 8 | 8KB (8K x 8) | - | 1.8 V ~ 3.6 V | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
|
|
|
NXP USA Inc. |
239
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 48QFN
|
Tray | Kinetis KL2 | -40°C ~ 105°C (TA) | 48-VFQFN Exposed Pad | 48-QFN (7x7) | Brown-out Detect/Reset，DMA，LVD，POR，PWM，WDT | ARM Cortex-M0+ | 48MHz | 4K x 8 | 32KB (32K x 8) | - | 1.71 V ~ 3.6 V | A/D 13x12b | Internal | I2C，LINbus，SPI，UART/USART，USB，USB OTG | 32-Bit | ||
|
|
|
NXP USA Inc. |
228
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 48QFN
|
Tray | Kinetis KL2 | -40°C ~ 105°C (TA) | 48-VFQFN Exposed Pad | 48-QFN (7x7) | Brown-out Detect/Reset，DMA，LVD，POR，PWM，WDT | ARM Cortex-M0+ | 48MHz | 4K x 8 | 32KB (32K x 8) | - | 1.71 V ~ 3.6 V | A/D 13x16b，D/A 1x12b | Internal | I2C，LINbus，SPI，UART/USART，USB，USB OTG | 32-Bit | ||
|
|
|
NXP USA Inc. |
245
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 64KB FLASH 48QFN
|
Tray | Kinetis KL2 | -40°C ~ 105°C (TA) | 48-VFQFN Exposed Pad | 48-QFN (7x7) | Brown-out Detect/Reset，DMA，LVD，POR，PWM，WDT | ARM Cortex-M0+ | 48MHz | 8K x 8 | 64KB (64K x 8) | - | 1.71 V ~ 3.6 V | A/D 13x12b | Internal | I2C，LINbus，SPI，UART/USART，USB，USB OTG | 32-Bit |
