- Packaging:
-
- Operating Temperature:
-
- Package / Case:
-
- Supplier Device Package:
-
- Peripherals:
-
- Core Processor:
-
- RAM Size:
-
- Program Memory Size:
-
- Program Memory Type:
-
- EEPROM Size:
-
- Voltage - Supply (Vcc/Vdd):
-
- Data Converters:
-
- Oscillator Type:
-
- Connectivity:
-
- Selected conditions:
Discover 69 products
![]() |
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | RAM Size | Program Memory Size | Program Memory Type | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() |
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | RAM Size | Program Memory Size | Program Memory Type | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | |
![]() |
![]() |
NXP USA Inc. |
1,987
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 100TFBGA
|
Tray | LPC43xx | -40°C ~ 85°C (TA) | 100-TFBGA | 100-TFBGA (9x9) | Brown-out Detect/Reset,DMA,I2S,LCD,POR,PWM,WDT | ARM Cortex-M4/M0/M0 | 204MHz | 282K x 8 | - | ROMless | - | 2.2 V ~ 3.6 V | A/D 3x12b,D/A 1x10b | Internal | CANbus,EBI/EMI,Ethernet,I2C,IrDA,SD, SPI,SSC,UART/USART,USB | 32-Bit Tri-Core | ||
![]() |
![]() |
NXP USA Inc. |
1,448
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 1MB FLASH 100TFBGA
|
Tray | LPC43xx | -40°C ~ 105°C (TA) | 100-TFBGA | 100-TFBGA (9x9) | Brown-out Detect/Reset,DMA,I2S,POR,WDT | ARM Cortex-M4/M0 | 204MHz | 136K x 8 | 1MB (1M x 8) | Flash | 16K x 8 | 2.2 V ~ 3.6 V | A/D 4x10b; D/A 1x10b | Internal | CANbus,EBI/EMI,Ethernet,I2C,IrDA,Microwire,SD,SPI,SSI,SSP,UART/USART,USB,USB OTG | 32-Bit Dual-Core | ||
![]() |
![]() |
NXP USA Inc. |
2,570
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 128LQFP
|
Tray | 56F8xxx | -40°C ~ 125°C (TA) | 128-LQFP | 128-LQFP (14x20) | POR,PWM,Temp Sensor,WDT | 56800E | 60MHz | 6K x 16 | 128KB (64K x 16) | Flash | - | 2.25 V ~ 3.6 V | A/D 16x12b | External | CANbus,EBI/EMI,SCI,SPI | 16-Bit | ||
![]() |
![]() |
NXP USA Inc. |
170
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 100TFBGA
|
Tray | LPC43xx | -40°C ~ 85°C (TA) | 100-TFBGA | 100-TFBGA (9x9) | Brown-out Detect/Reset,DMA,I2S,POR,PWM,WDT | ARM Cortex-M4/M0 | 204MHz | 200K x 8 | - | ROMless | - | 2.2 V ~ 3.6 V | A/D 4x10b; D/A 1x10b | Internal | CANbus,EBI/EMI,I2C,IrDA,Microwire,SD,SPI,SSI,SSP,UART/USART,USB,USB OTG | 32-Bit Dual-Core | ||
![]() |
![]() |
NXP USA Inc. |
277
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 100TFBGA
|
Tray | LPC43xx | -40°C ~ 85°C (TA) | 100-TFBGA | 100-TFBGA (9x9) | Brown-out Detect/Reset,DMA,I2S,POR,PWM,WDT | ARM Cortex-M4/M0 | 204MHz | 264K x 8 | - | ROMless | - | 2.2 V ~ 3.6 V | A/D 4x10b; D/A 1x10b | Internal | CANbus,EBI/EMI,Ethernet,I2C,IrDA,Microwire,SD,SPI,SSI,SSP,UART/USART,USB,USB OTG | 32-Bit Dual-Core | ||
![]() |
![]() |
NXP USA Inc. |
261
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 512KB FLASH 100BGA
|
Tray | LPC18xx | -40°C ~ 105°C (TA) | 100-TFBGA | 100-TFBGA (9x9) | Brown-out Detect/Reset,DMA,I2S,POR,WDT | ARM Cortex-M3 | 180MHz | 136K x 8 | 512KB (512K x 8) | Flash | 16K x 8 | 2.2 V ~ 3.6 V | A/D 4x10b; D/A 1x10b | Internal | CANbus,EBI/EMI,Ethernet,I2C,IrDA,Microwire,SD,SPI,SSI,SSP,UART/USART,USB,USB OTG | 32-Bit | ||
![]() |
![]() |
NXP USA Inc. |
334
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 1MB FLASH 100TFBGA
|
Tray | LPC43xx | -40°C ~ 105°C (TA) | 100-TFBGA | 100-TFBGA (9x9) | Brown-out Detect/Reset,DMA,I2S,POR,WDT | ARM Cortex-M4/M0 | 204MHz | 136K x 8 | 1MB (1M x 8) | Flash | - | 2.2 V ~ 3.6 V | A/D 4x10b; D/A 1x10b | Internal | CANbus,EBI/EMI,Ethernet,I2C,IrDA,Microwire,MMC/SD,SPI,SSI,SSP,UART/USART,USB,USB OTG | 32-Bit Dual-Core | ||
![]() |
![]() |
NXP USA Inc. |
720
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 128LQFP
|
Tray | 56F8xxx | -40°C ~ 105°C (TA) | 128-LQFP | 128-LQFP (14x20) | POR,PWM,Temp Sensor,WDT | 56800E | 60MHz | 6K x 16 | 128KB (64K x 16) | Flash | - | 2.25 V ~ 3.6 V | A/D 16x12b | External | CANbus,EBI/EMI,SCI,SPI | 16-Bit | ||
![]() |
![]() |
NXP USA Inc. |
1,300
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 128LQFP
|
Tray | 56F8xxx | -40°C ~ 105°C (TA) | 128-LQFP | 128-LQFP (14x20) | POR,PWM,Temp Sensor,WDT | 56800E | 60MHz | 18K x 16 | 512KB (256K x 16) | Flash | - | 2.25 V ~ 3.6 V | A/D 16x12b | External | CANbus,EBI/EMI,SCI,SPI | 16-Bit | ||
![]() |
![]() |
NXP USA Inc. |
364
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 128LQFP
|
Tray | 56F8xxx | -40°C ~ 125°C (TA) | 128-LQFP | 128-LQFP (14x20) | POR,PWM,Temp Sensor,WDT | 56800E | 60MHz | 18K x 16 | 512KB (256K x 16) | Flash | - | 2.25 V ~ 3.6 V | A/D 16x12b | External | CANbus,EBI/EMI,SCI,SPI | 16-Bit | ||
![]() |
![]() |
NXP USA Inc. |
258
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 100TFBGA
|
Tray | LPC18xx | -40°C ~ 85°C (TA) | 100-TFBGA | 100-TFBGA (9x9) | Brown-out Detect/Reset,DMA,I2S,POR,WDT | ARM Cortex-M3 | 180MHz | 136K x 8 | - | ROMless | - | 2.2 V ~ 3.6 V | A/D 4x10b; D/A 1x10b | Internal | CANbus,EBI/EMI,I2C,IrDA,Microwire,MMC/SD,SPI,SSI,SSP,UART/USART | 32-Bit | ||
![]() |
![]() |
NXP USA Inc. |
268
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 100TFBGA
|
Tray | LPC43xx | -40°C ~ 85°C (TA) | 100-TFBGA | 100-TFBGA (9x9) | Brown-out Detect/Reset,DMA,I2S,POR,PWM,WDT | ARM Cortex-M4/M0 | 204MHz | 168K x 8 | - | ROMless | - | 2.2 V ~ 3.6 V | A/D 4x10b; D/A 1x10b | Internal | CANbus,EBI/EMI,I2C,IrDA,Microwire,SD,SPI,SSI,SSP,UART/USART | 32-Bit Dual-Core | ||
![]() |
![]() |
NXP USA Inc. |
215
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 1MB FLASH 100TFBGA
|
Tray | LPC18xx | -40°C ~ 105°C (TA) | 100-TFBGA | 100-TFBGA (9x9) | Brown-out Detect/Reset,DMA,I2S,POR,WDT | ARM Cortex-M3 | 180MHz | 136K x 8 | 1MB (1M x 8) | Flash | - | 2.2 V ~ 3.6 V | A/D 4x10b; D/A 1x10b | Internal | CANbus,EBI/EMI,Ethernet,I2C,IrDA,Microwire,MMC/SD,SPI,SSI,SSP,UART/USART,USB | 32-Bit | ||
![]() |
![]() |
NXP USA Inc. |
194
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 64KB FLASH 128LQFP
|
Tray | 56F8xxx | -40°C ~ 105°C (TA) | 128-LQFP | 128-LQFP (14x20) | POR,PWM,Temp Sensor,WDT | 56800E | 60MHz | 6K x 16 | 64KB (32K x 16) | Flash | - | 2.25 V ~ 3.6 V | A/D 16x12b | External | CANbus,EBI/EMI,SCI,SPI | 16-Bit | ||
![]() |
![]() |
NXP USA Inc. |
392
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 128LQFP
|
Tray | 56F8xxx | -40°C ~ 125°C (TA) | 128-LQFP | 128-LQFP (14x20) | POR,PWM,Temp Sensor,WDT | 56800E | 60MHz | 10K x 16 | 256KB (128K x 16) | Flash | - | 2.25 V ~ 3.6 V | A/D 16x12b | External | CANbus,EBI/EMI,SCI,SPI | 16-Bit | ||
![]() |
![]() |
NXP USA Inc. |
800
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 64KB FLASH 64LQFP
|
Tray | HCS12 | -40°C ~ 105°C (TA) | 64-LQFP | 64-LQFP (10x10) | LVD,POR,PWM,WDT | HCS12 | 32MHz | 4K x 8 | 64KB (64K x 8) | Flash | 4K x 8 | 1.72 V ~ 5.5 V | A/D 10x12b | Internal | CANbus,SCI,SPI | 16-Bit | ||
![]() |
![]() |
NXP USA Inc. |
260
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 100TFBGA
|
Tray | LPC43xx | -40°C ~ 85°C (TA) | 100-TFBGA | 100-TFBGA (9x9) | Brown-out Detect/Reset,DMA,I2S,POR,WDT | ARM Cortex-M4/M0 | 204MHz | 264K x 8 | - | ROMless | - | 2.2 V ~ 3.6 V | A/D 4x10b; D/A 1x10b | Internal | CANbus,EBI/EMI,Ethernet,I2C,IrDA,Microwire,SD,SPI,SSI,SSP,UART/USART,USB,USB OTG | 32-Bit Dual-Core | ||
![]() |
![]() |
NXP USA Inc. |
250
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 100TFBGA
|
Tray | LPC43xx | -40°C ~ 85°C (TA) | 100-TFBGA | 100-TFBGA (9x9) | Brown-out Detect/Reset,DMA,I2S,POR,WDT | ARM Cortex-M4/M0 | 204MHz | 282K x 8 | - | ROMless | - | 2.2 V ~ 3.6 V | A/D 16x10b,6x12b,D/A 1x10b | Internal | CANbus,EBI/EMI,Ethernet,I2C,IrDA,Microwire,MMC/SD,SPI,SSI,SSP,UART/USART,USB,USB OTG | 32-Bit Dual-Core | ||
![]() |
![]() |
NXP USA Inc. |
219
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 512KB FLSH 100TFBGA
|
Tray | LPC18xx | -40°C ~ 105°C (TA) | 100-TFBGA | 100-TFBGA (9x9) | Brown-out Detect/Reset,DMA,I2S,POR,WDT | ARM Cortex-M3 | 180MHz | 104K x 8 | 512KB (512K x 8) | Flash | 16K x 8 | 2.2 V ~ 3.6 V | A/D 4x10b; D/A 1x10b | Internal | CANbus,EBI/EMI,I2C,IrDA,Microwire,SD,SPI,SSI,SSP,UART/USART | 32-Bit | ||
![]() |
![]() |
NXP USA Inc. |
260
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 512KB FLASH 100BGA
|
Tray | LPC43xx | -40°C ~ 105°C (TA) | 100-TFBGA | 100-TFBGA (9x9) | Brown-out Detect/Reset,DMA,I2S,POR,WDT | ARM Cortex-M4/M0 | 204MHz | 104K x 8 | 512KB (512K x 8) | Flash | 16K x 8 | 2.2 V ~ 3.6 V | A/D 4x10b; D/A 1x10b | Internal | CANbus,EBI/EMI,I2C,IrDA,Microwire,SD,SPI,SSI,SSP,UART/USART | 32-Bit Dual-Core |