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Discover 69 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Packaging Series Operating Temperature Package / Case Supplier Device Package Peripherals Core Processor Speed RAM Size Program Memory Size Program Memory Type EEPROM Size Voltage - Supply (Vcc/Vdd) Data Converters Oscillator Type Connectivity Core Size
LPC4370FET100E
NXP USA Inc.
1,987
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT ROMLESS 100TFBGA
Tray LPC43xx -40°C ~ 85°C (TA) 100-TFBGA 100-TFBGA (9x9) Brown-out Detect/Reset,DMA,I2S,LCD,POR,PWM,WDT ARM Cortex-M4/M0/M0 204MHz 282K x 8 - ROMless - 2.2 V ~ 3.6 V A/D 3x12b,D/A 1x10b Internal CANbus,EBI/EMI,Ethernet,I2C,IrDA,SD, SPI,SSC,UART/USART,USB 32-Bit Tri-Core
LPC4337JET100E
NXP USA Inc.
1,448
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT 1MB FLASH 100TFBGA
Tray LPC43xx -40°C ~ 105°C (TA) 100-TFBGA 100-TFBGA (9x9) Brown-out Detect/Reset,DMA,I2S,POR,WDT ARM Cortex-M4/M0 204MHz 136K x 8 1MB (1M x 8) Flash 16K x 8 2.2 V ~ 3.6 V A/D 4x10b; D/A 1x10b Internal CANbus,EBI/EMI,Ethernet,I2C,IrDA,Microwire,SD,SPI,SSI,SSP,UART/USART,USB,USB OTG 32-Bit Dual-Core
MC56F8345MFGE
NXP USA Inc.
2,570
3 days
-
MOQ: 1  MPQ: 1
IC MCU 16BIT 128KB FLASH 128LQFP
Tray 56F8xxx -40°C ~ 125°C (TA) 128-LQFP 128-LQFP (14x20) POR,PWM,Temp Sensor,WDT 56800E 60MHz 6K x 16 128KB (64K x 16) Flash - 2.25 V ~ 3.6 V A/D 16x12b External CANbus,EBI/EMI,SCI,SPI 16-Bit
LPC4320FET100,551
NXP USA Inc.
170
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT ROMLESS 100TFBGA
Tray LPC43xx -40°C ~ 85°C (TA) 100-TFBGA 100-TFBGA (9x9) Brown-out Detect/Reset,DMA,I2S,POR,PWM,WDT ARM Cortex-M4/M0 204MHz 200K x 8 - ROMless - 2.2 V ~ 3.6 V A/D 4x10b; D/A 1x10b Internal CANbus,EBI/EMI,I2C,IrDA,Microwire,SD,SPI,SSI,SSP,UART/USART,USB,USB OTG 32-Bit Dual-Core
LPC4330FET100,551
NXP USA Inc.
277
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT ROMLESS 100TFBGA
Tray LPC43xx -40°C ~ 85°C (TA) 100-TFBGA 100-TFBGA (9x9) Brown-out Detect/Reset,DMA,I2S,POR,PWM,WDT ARM Cortex-M4/M0 204MHz 264K x 8 - ROMless - 2.2 V ~ 3.6 V A/D 4x10b; D/A 1x10b Internal CANbus,EBI/EMI,Ethernet,I2C,IrDA,Microwire,SD,SPI,SSI,SSP,UART/USART,USB,USB OTG 32-Bit Dual-Core
LPC1833JET100E
NXP USA Inc.
261
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT 512KB FLASH 100BGA
Tray LPC18xx -40°C ~ 105°C (TA) 100-TFBGA 100-TFBGA (9x9) Brown-out Detect/Reset,DMA,I2S,POR,WDT ARM Cortex-M3 180MHz 136K x 8 512KB (512K x 8) Flash 16K x 8 2.2 V ~ 3.6 V A/D 4x10b; D/A 1x10b Internal CANbus,EBI/EMI,Ethernet,I2C,IrDA,Microwire,SD,SPI,SSI,SSP,UART/USART,USB,USB OTG 32-Bit
LPC43S37JET100E
NXP USA Inc.
334
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT 1MB FLASH 100TFBGA
Tray LPC43xx -40°C ~ 105°C (TA) 100-TFBGA 100-TFBGA (9x9) Brown-out Detect/Reset,DMA,I2S,POR,WDT ARM Cortex-M4/M0 204MHz 136K x 8 1MB (1M x 8) Flash - 2.2 V ~ 3.6 V A/D 4x10b; D/A 1x10b Internal CANbus,EBI/EMI,Ethernet,I2C,IrDA,Microwire,MMC/SD,SPI,SSI,SSP,UART/USART,USB,USB OTG 32-Bit Dual-Core
MC56F8345VFGE
NXP USA Inc.
720
3 days
-
MOQ: 1  MPQ: 1
IC MCU 16BIT 128KB FLASH 128LQFP
Tray 56F8xxx -40°C ~ 105°C (TA) 128-LQFP 128-LQFP (14x20) POR,PWM,Temp Sensor,WDT 56800E 60MHz 6K x 16 128KB (64K x 16) Flash - 2.25 V ~ 3.6 V A/D 16x12b External CANbus,EBI/EMI,SCI,SPI 16-Bit
MC56F8365VFGE
NXP USA Inc.
1,300
3 days
-
MOQ: 1  MPQ: 1
IC MCU 16BIT 512KB FLASH 128LQFP
Tray 56F8xxx -40°C ~ 105°C (TA) 128-LQFP 128-LQFP (14x20) POR,PWM,Temp Sensor,WDT 56800E 60MHz 18K x 16 512KB (256K x 16) Flash - 2.25 V ~ 3.6 V A/D 16x12b External CANbus,EBI/EMI,SCI,SPI 16-Bit
MC56F8365MFGE
NXP USA Inc.
364
3 days
-
MOQ: 1  MPQ: 1
IC MCU 16BIT 512KB FLASH 128LQFP
Tray 56F8xxx -40°C ~ 125°C (TA) 128-LQFP 128-LQFP (14x20) POR,PWM,Temp Sensor,WDT 56800E 60MHz 18K x 16 512KB (256K x 16) Flash - 2.25 V ~ 3.6 V A/D 16x12b External CANbus,EBI/EMI,SCI,SPI 16-Bit
LPC18S10FET100E
NXP USA Inc.
258
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT ROMLESS 100TFBGA
Tray LPC18xx -40°C ~ 85°C (TA) 100-TFBGA 100-TFBGA (9x9) Brown-out Detect/Reset,DMA,I2S,POR,WDT ARM Cortex-M3 180MHz 136K x 8 - ROMless - 2.2 V ~ 3.6 V A/D 4x10b; D/A 1x10b Internal CANbus,EBI/EMI,I2C,IrDA,Microwire,MMC/SD,SPI,SSI,SSP,UART/USART 32-Bit
LPC4310FET100,551
NXP USA Inc.
268
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT ROMLESS 100TFBGA
Tray LPC43xx -40°C ~ 85°C (TA) 100-TFBGA 100-TFBGA (9x9) Brown-out Detect/Reset,DMA,I2S,POR,PWM,WDT ARM Cortex-M4/M0 204MHz 168K x 8 - ROMless - 2.2 V ~ 3.6 V A/D 4x10b; D/A 1x10b Internal CANbus,EBI/EMI,I2C,IrDA,Microwire,SD,SPI,SSI,SSP,UART/USART 32-Bit Dual-Core
LPC18S37JET100E
NXP USA Inc.
215
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT 1MB FLASH 100TFBGA
Tray LPC18xx -40°C ~ 105°C (TA) 100-TFBGA 100-TFBGA (9x9) Brown-out Detect/Reset,DMA,I2S,POR,WDT ARM Cortex-M3 180MHz 136K x 8 1MB (1M x 8) Flash - 2.2 V ~ 3.6 V A/D 4x10b; D/A 1x10b Internal CANbus,EBI/EMI,Ethernet,I2C,IrDA,Microwire,MMC/SD,SPI,SSI,SSP,UART/USART,USB 32-Bit
MC56F8335VFGE
NXP USA Inc.
194
3 days
-
MOQ: 1  MPQ: 1
IC MCU 16BIT 64KB FLASH 128LQFP
Tray 56F8xxx -40°C ~ 105°C (TA) 128-LQFP 128-LQFP (14x20) POR,PWM,Temp Sensor,WDT 56800E 60MHz 6K x 16 64KB (32K x 16) Flash - 2.25 V ~ 3.6 V A/D 16x12b External CANbus,EBI/EMI,SCI,SPI 16-Bit
MC56F8355MFGE
NXP USA Inc.
392
3 days
-
MOQ: 1  MPQ: 1
IC MCU 16BIT 256KB FLASH 128LQFP
Tray 56F8xxx -40°C ~ 125°C (TA) 128-LQFP 128-LQFP (14x20) POR,PWM,Temp Sensor,WDT 56800E 60MHz 10K x 16 256KB (128K x 16) Flash - 2.25 V ~ 3.6 V A/D 16x12b External CANbus,EBI/EMI,SCI,SPI 16-Bit
MC9S12P64VLH
NXP USA Inc.
800
3 days
-
MOQ: 1  MPQ: 1
IC MCU 16BIT 64KB FLASH 64LQFP
Tray HCS12 -40°C ~ 105°C (TA) 64-LQFP 64-LQFP (10x10) LVD,POR,PWM,WDT HCS12 32MHz 4K x 8 64KB (64K x 8) Flash 4K x 8 1.72 V ~ 5.5 V A/D 10x12b Internal CANbus,SCI,SPI 16-Bit
LPC43S30FET100E
NXP USA Inc.
260
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT ROMLESS 100TFBGA
Tray LPC43xx -40°C ~ 85°C (TA) 100-TFBGA 100-TFBGA (9x9) Brown-out Detect/Reset,DMA,I2S,POR,WDT ARM Cortex-M4/M0 204MHz 264K x 8 - ROMless - 2.2 V ~ 3.6 V A/D 4x10b; D/A 1x10b Internal CANbus,EBI/EMI,Ethernet,I2C,IrDA,Microwire,SD,SPI,SSI,SSP,UART/USART,USB,USB OTG 32-Bit Dual-Core
LPC43S70FET100E
NXP USA Inc.
250
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT ROMLESS 100TFBGA
Tray LPC43xx -40°C ~ 85°C (TA) 100-TFBGA 100-TFBGA (9x9) Brown-out Detect/Reset,DMA,I2S,POR,WDT ARM Cortex-M4/M0 204MHz 282K x 8 - ROMless - 2.2 V ~ 3.6 V A/D 16x10b,6x12b,D/A 1x10b Internal CANbus,EBI/EMI,Ethernet,I2C,IrDA,Microwire,MMC/SD,SPI,SSI,SSP,UART/USART,USB,USB OTG 32-Bit Dual-Core
LPC1812JET100E
NXP USA Inc.
219
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT 512KB FLSH 100TFBGA
Tray LPC18xx -40°C ~ 105°C (TA) 100-TFBGA 100-TFBGA (9x9) Brown-out Detect/Reset,DMA,I2S,POR,WDT ARM Cortex-M3 180MHz 104K x 8 512KB (512K x 8) Flash 16K x 8 2.2 V ~ 3.6 V A/D 4x10b; D/A 1x10b Internal CANbus,EBI/EMI,I2C,IrDA,Microwire,SD,SPI,SSI,SSP,UART/USART 32-Bit
LPC4312JET100E
NXP USA Inc.
260
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT 512KB FLASH 100BGA
Tray LPC43xx -40°C ~ 105°C (TA) 100-TFBGA 100-TFBGA (9x9) Brown-out Detect/Reset,DMA,I2S,POR,WDT ARM Cortex-M4/M0 204MHz 104K x 8 512KB (512K x 8) Flash 16K x 8 2.2 V ~ 3.6 V A/D 4x10b; D/A 1x10b Internal CANbus,EBI/EMI,I2C,IrDA,Microwire,SD,SPI,SSI,SSP,UART/USART 32-Bit Dual-Core