- Packaging:
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- Supplier Device Package:
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- Peripherals:
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- Program Memory Size:
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- Voltage - Supply (Vcc/Vdd):
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- Data Converters:
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- Oscillator Type:
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Discover 52 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Number of I/O | RAM Size | Program Memory Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Number of I/O | RAM Size | Program Memory Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | ||
NXP USA Inc. |
188
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 8MB FLASH 516BGA
|
Tray | MPC57xx | -40°C ~ 125°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA,LVD,POR,Zipwire | - | 512K x 8 | 8MB (8M x 8) | 3 V ~ 5.5 V | A/D 16b Sigma-Delta,eQADC | Internal | CANbus,EBI/EMI,Ethernet,FlexCANbus,LINbus,SCI,SPI | 32-Bit Tri-Core | ||||
NXP USA Inc. |
727
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 4MB FLASH 516BGA
|
Tray | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 516-BBGA | 516-PBGA (27x27) | DMA,POR,PWM | 32 | 256K x 8 | 4MB (4M x 8) | 1.08 V ~ 5.25 V | A/D 64x12b | External | CANbus,EBI/EMI,SCI,SPI | 32-Bit | ||||
NXP USA Inc. |
200
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
POWER ARCH CORES 8MB FL
|
Tray | MPC57xx | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA,LVD,POR,Zipwire | 293 | 512K x 8 | 4MB (4M x 8) | 3 V ~ 5.5 V | A/D 40x12b eQADCx2 | External | CANbus,EBI/EMI,Ethernet,FlexCANbus,LINbus,SCI,SPI | 32-Bit Dual-Core | ||||
NXP USA Inc. |
260
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 8MB FLASH 416BGA
|
Tray | MPC57xx | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA,LVD,POR,Zipwire | - | 512K x 8 | 8MB (8M x 8) | 3 V ~ 5.5 V | A/D 16b Sigma-Delta,eQADC | Internal | CANbus,EBI/EMI,Ethernet,FlexCANbus,LINbus,SCI,SPI | 32-Bit Tri-Core | ||||
NXP USA Inc. |
200
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORES
|
Tray | MPC57xx | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA,LVD,POR,Zipwire | - | 512K x 8 | 8MB (8M x 8) | 3 V ~ 5.5 V | A/D 16b Sigma-Delta,eQADC | Internal | CANbus,EBI/EMI,Ethernet,FlexCANbus,LINbus,SCI,SPI | 32-Bit Tri-Core | ||||
NXP USA Inc. |
500
|
3 days |
-
|
MOQ: 500 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tape & Reel (TR) | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA,POR,PWM | 32 | 256K x 8 | 4MB (4M x 8) | 1.08 V ~ 5.25 V | A/D 64x12b | External | CANbus,EBI/EMI,SCI,SPI | 32-Bit | ||||
NXP USA Inc. |
194
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 4MB FLASH 416BGA
|
Tray | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA,POR,PWM | 32 | 256K x 8 | 4MB (4M x 8) | 1.08 V ~ 5.25 V | A/D 64x12b | External | CANbus,SCI,SPI | 32-Bit | ||||
NXP USA Inc. |
48
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 4MB FLASH 516FBGA
|
Tray | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA,POR,PWM | 32 | 256K x 8 | 4MB (4M x 8) | 1.08 V ~ 5.25 V | A/D 64x12b | External | CANbus,EBI/EMI,SCI,SPI | 32-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tray | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA,POR,PWM | 32 | 256K x 8 | 4MB (4M x 8) | 1.08 V ~ 5.25 V | A/D 64x12b | External | CANbus,EBI/EMI,SCI,SPI | 32-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
POWER ARCH CORES 8MB FL
|
Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA,LVD,POR,Zipwire | 293 | 512K x 8 | 4MB (4M x 8) | 3 V ~ 5.5 V | A/D 40x12b eQADCx2 | External | CANbus,EBI/EMI,Ethernet,FlexCANbus,LINbus,SCI,SPI | 32-Bit Dual-Core | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORES
|
Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA,LVD,POR,Zipwire | - | 512K x 8 | 8MB (8M x 8) | 3 V ~ 5.5 V | A/D 16b Sigma-Delta,eQADC | Internal | EBI/EMI,Ethernet,FlexCANbus,LINbus,SCI,SPI | 32-Bit Tri-Core | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORES
|
Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA,LVD,POR,Zipwire | - | 512K x 8 | 8MB (8M x 8) | 3 V ~ 5.5 V | A/D 16b Sigma-Delta,eQADC | Internal | CANbus,EBI/EMI,Ethernet,FlexCANbus,LINbus,SCI,SPI | 32-Bit Tri-Core | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORES
|
Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA,LVD,POR,Zipwire | - | 512K x 8 | 8MB (8M x 8) | 3 V ~ 5.5 V | A/D 16b Sigma-Delta,eQADC | Internal | CANbus,EBI/EMI,Ethernet,FlexCANbus,LINbus,SCI,SPI | 32-Bit Tri-Core | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORES
|
Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA,LVD,POR,Zipwire | - | 512K x 8 | 8MB (8M x 8) | 3 V ~ 5.5 V | A/D 16b Sigma-Delta,eQADC | Internal | CANbus,EBI/EMI,Ethernet,FlexCANbus,LINbus,SCI,SPI | 32-Bit Tri-Core | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORES
|
Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA,LVD,POR,Zipwire | - | 512K x 8 | 8MB (8M x 8) | 3 V ~ 5.5 V | A/D 16b Sigma-Delta,eQADC | Internal | CANbus,EBI/EMI,Ethernet,FlexCANbus,LINbus,SCI,SPI | 32-Bit Tri-Core | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 200 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORES
|
Tray | MPC57xx | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA,LVD,POR,Zipwire | - | 512K x 8 | 8MB (8M x 8) | 3 V ~ 5.5 V | A/D 16b Sigma-Delta,eQADC | Internal | EBI/EMI,Ethernet,FlexCANbus,LINbus,SCI,SPI | 32-Bit Tri-Core | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 200 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORES
|
Tray | MPC57xx | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA,LVD,POR,Zipwire | - | 512K x 8 | 8MB (8M x 8) | 3 V ~ 5.5 V | A/D 16b Sigma-Delta,eQADC | Internal | EBI/EMI,Ethernet,FlexCANbus,LINbus,SCI,SPI | 32-Bit Tri-Core | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORES
|
Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA,LVD,POR,Zipwire | - | 512K x 8 | 8MB (8M x 8) | 3 V ~ 5.5 V | A/D 16b Sigma-Delta,eQADC | Internal | CANbus,EBI/EMI,Ethernet,FlexCANbus,LINbus,SCI,SPI | 32-Bit Tri-Core | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 200 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORES
|
Tray | MPC57xx | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA,LVD,POR,Zipwire | - | 512K x 8 | 8MB (8M x 8) | 3 V ~ 5.5 V | A/D 16b Sigma-Delta,eQADC | Internal | CANbus,EBI/EMI,Ethernet,FlexCANbus,LINbus,SCI,SPI | 32-Bit Tri-Core | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 200 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORES
|
Tray | MPC57xx | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA,LVD,POR,Zipwire | - | 512K x 8 | 8MB (8M x 8) | 3 V ~ 5.5 V | A/D 16b Sigma-Delta,eQADC | Internal | CANbus,EBI/EMI,Ethernet,FlexCANbus,LINbus,SCI,SPI | 32-Bit Tri-Core |