Discover 10 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Packaging Package / Case Supplier Device Package Program Memory Size
SAC57D54HCVLT
NXP USA Inc.
Inquiry
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MOQ: 180  MPQ: 1
IC MCU 32BIT 4MB FLASH 208LQFP
Tray 208-LQFP Exposed Pad 208-LQFP (28x28) 4MB (4M x 8)
SAC57D54HCVMO
NXP USA Inc.
Inquiry
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MOQ: 200  MPQ: 1
IC MCU 32BIT 4MB FLASH 516MAPBGA
Tray 516-BGA 516-MAPBGA (27x27) 4MB (4M x 8)
SAC57D52LCVLT
NXP USA Inc.
Inquiry
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MOQ: 180  MPQ: 1
ARM 32-BIT MCU TRIPLE CORE 2MB
Tray 208-LQFP Exposed Pad 208-LQFP (28x28) 2MB (2M x 8)
SAC57D52LCVLTR
NXP USA Inc.
Inquiry
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MOQ: 180  MPQ: 1
ARM 32-BIT MCU TRIPLE CORE 2MB
Tape & Reel (TR) 208-LQFP Exposed Pad 208-LQFP (28x28) 2MB (2M x 8)
SAC57D53MCVMOR
NXP USA Inc.
Inquiry
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MOQ: 500  MPQ: 1
ARM 32-BIT MCU TRIPLE CORE 3MB
Tape & Reel (TR) 516-BGA 516-MAPBGA (27x27) 3MB (3M x 8)
SAC57D53MCVLT
NXP USA Inc.
Inquiry
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MOQ: 180  MPQ: 1
ARM 32-BIT MCU TRIPLE CORE 3MB
Tray 208-LQFP Exposed Pad 208-LQFP (28x28) 3MB (3M x 8)
SAC57D53MCVLTR
NXP USA Inc.
Inquiry
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MOQ: 180  MPQ: 1
ARM 32-BIT MCU TRIPLE CORE 3MB
Tape & Reel (TR) 208-LQFP Exposed Pad 208-LQFP (28x28) 3MB (3M x 8)
SAC57D54HCVMOR
NXP USA Inc.
Inquiry
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MOQ: 500  MPQ: 1
ARM 32-BIT MCU TRIPLE CORE 4MB
Tape & Reel (TR) 516-BGA 516-MAPBGA (27x27) 4MB (4M x 8)
SAC57D53MCVMO
NXP USA Inc.
Inquiry
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-
MOQ: 200  MPQ: 1
ARM 32-BIT MCU TRIPLE CORE 3MB
Tray 516-BGA 516-MAPBGA (27x27) 3MB (3M x 8)
SAC57D54HCVLTR
NXP USA Inc.
Inquiry
-
-
MOQ: 180  MPQ: 1
ARM 32-BIT MCU TRIPLE CORE 4MB
Tape & Reel (TR) 208-LQFP Exposed Pad 208-LQFP (28x28) 4MB (4M x 8)