- Series：
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- Operating Temperature：
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- Peripherals：
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- Core Processor：
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- Voltage - Supply (Vcc/Vdd)：
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- Data Converters：
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- Oscillator Type：
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- Connectivity：
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- Core Size：
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- Selected conditions:
Discover 715 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | Speed | Program Memory Size | Program Memory Type | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | Speed | Program Memory Size | Program Memory Type | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | |
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NXP USA Inc. |
3,000
|
3 days |
-
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MOQ: 3000 MPQ: 1
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IC MCU 32BIT 32KB FLASH 20WLCSP
|
Tape & Reel (TR) | Kinetis KL02 | -40°C ~ 85°C (TA) | 20-UFBGA，WLCSP | 20-WLCSP (1.99x1.94) | Brown-out Detect/Reset，LVD，POR，PWM，WDT | ARM Cortex-M0+ | 18 | 48MHz | 32KB (32K x 8) | Flash | - | 1.71 V ~ 3.6 V | A/D 10x12b | Internal | I2C，SPI，UART/USART | 32-Bit | ||
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NXP USA Inc. |
5,559
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 20WLCSP
|
Cut Tape (CT) | Kinetis KL02 | -40°C ~ 85°C (TA) | 20-UFBGA，WLCSP | 20-WLCSP (1.99x1.94) | Brown-out Detect/Reset，LVD，POR，PWM，WDT | ARM Cortex-M0+ | 18 | 48MHz | 32KB (32K x 8) | Flash | - | 1.71 V ~ 3.6 V | A/D 10x12b | Internal | I2C，SPI，UART/USART | 32-Bit | ||
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NXP USA Inc. |
5,559
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 20WLCSP
|
- | Kinetis KL02 | -40°C ~ 85°C (TA) | 20-UFBGA，WLCSP | 20-WLCSP (1.99x1.94) | Brown-out Detect/Reset，LVD，POR，PWM，WDT | ARM Cortex-M0+ | 18 | 48MHz | 32KB (32K x 8) | Flash | - | 1.71 V ~ 3.6 V | A/D 10x12b | Internal | I2C，SPI，UART/USART | 32-Bit | ||
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NXP USA Inc. |
14,340
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 16KB FLASH 20TSSOP
|
Tube | LPC81xM | -40°C ~ 105°C (TA) | 20-TSSOP (0.173"，4.40mm Width) | 20-TSSOP | Brown-out Detect/Reset，POR，PWM，WDT | ARM Cortex-M0+ | 18 | 30MHz | 16KB (16K x 8) | Flash | - | 1.8 V ~ 3.6 V | - | Internal | I2C，SPI，UART/USART | 32-Bit | ||
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NXP USA Inc. |
7,743
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 16QFN
|
Tray | Kinetis KL02 | -40°C ~ 105°C (TA) | 16-WFQFN Exposed Pad | 16-QFN (3x3) | Brown-out Detect/Reset，LVD，POR，PWM，WDT | ARM Cortex-M0+ | 14 | 48MHz | 32KB (32K x 8) | Flash | - | 1.71 V ~ 3.6 V | A/D 6x12b | Internal | I2C，SPI，UART/USART | 32-Bit | ||
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NXP USA Inc. |
34,383
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 32QFN
|
Tray | Kinetis KL1 | -40°C ~ 105°C (TA) | 32-VFQFN Exposed Pad | 32-QFN (5x5) | Brown-out Detect/Reset，DMA，I2S，LVD，POR，PWM，WDT | ARM Cortex-M0+ | 28 | 48MHz | 32KB (32K x 8) | Flash | - | 1.71 V ~ 3.6 V | A/D - 16bit，D/A - 12bit | Internal | I2C，LINbus，SPI，TSI，UART/USART | 32-Bit | ||
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|
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NXP USA Inc. |
14,126
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 24QFN
|
Tray | Kinetis KL0 | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | 24-QFN (4x4) | Brown-out Detect/Reset，DMA，LVD，POR，PWM，WDT | ARM Cortex-M0+ | 22 | 48MHz | 32KB (32K x 8) | Flash | - | 1.71 V ~ 3.6 V | A/D 12x12b | Internal | I2C，SPI，UART/USART | 32-Bit | ||
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NXP USA Inc. |
4,237
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 32LQFP
|
Tray | Kinetis KL0 | -40°C ~ 105°C (TA) | 32-LQFP | 32-LQFP (7x7) | Brown-out Detect/Reset，DMA，LVD，POR，PWM，WDT | ARM Cortex-M0+ | 28 | 48MHz | 32KB (32K x 8) | Flash | - | 1.71 V ~ 3.6 V | A/D 14x12b | Internal | I2C，SPI，UART/USART | 32-Bit | ||
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NXP USA Inc. |
2,700
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 64KB FLASH 80LQFP
|
Tray | S08 | -40°C ~ 85°C (TA) | 80-LQFP | 80-LQFP (14x14) | LCD，LVD，POR，PWM，WDT | S08 | 39 | 40MHz | 64KB (64K x 8) | Flash | - | 1.8 V ~ 3.6 V | A/D 10x12b | Internal | I2C，SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
6,369
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 64KB FLASH 32LQFP
|
Tray | S08 | -40°C ~ 85°C (TA) | 32-LQFP | 32-LQFP (7x7) | LVD，PWM，WDT | S08 | 26 | 50MHz | 64KB (64K x 8) | Flash | - | 1.8 V ~ 3.6 V | A/D 10x12b | Internal | I2C，LINbus，SCI，SPI | 8-Bit | ||
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|
|
NXP USA Inc. |
4,000
|
3 days |
-
|
MOQ: 2000 MPQ: 1
|
IC MCU 8BIT 60KB FLASH 48QFN
|
Tape & Reel (TR) | S08 | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | 48-QFN-EP (7x7) | LVD，POR，PWM，WDT | S08 | 39 | 40MHz | 60KB (60K x 8) | Flash | - | 1.8 V ~ 3.6 V | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
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|
|
NXP USA Inc. |
5,938
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 60KB FLASH 48QFN
|
Cut Tape (CT) | S08 | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | 48-QFN-EP (7x7) | LVD，POR，PWM，WDT | S08 | 39 | 40MHz | 60KB (60K x 8) | Flash | - | 1.8 V ~ 3.6 V | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
|
|
|
NXP USA Inc. |
5,938
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 60KB FLASH 48QFN
|
- | S08 | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | 48-QFN-EP (7x7) | LVD，POR，PWM，WDT | S08 | 39 | 40MHz | 60KB (60K x 8) | Flash | - | 1.8 V ~ 3.6 V | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
|
|
|
NXP USA Inc. |
4,564
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 64KB FLASH 64LQFP
|
Tray | S08 | -40°C ~ 85°C (TA) | 64-LQFP | 64-LQFP (10x10) | LVD，PWM，WDT | S08 | 54 | 50MHz | 64KB (64K x 8) | Flash | - | 1.8 V ~ 3.6 V | A/D 22x12b | Internal | I2C，LINbus，SCI，SPI | 8-Bit | ||
|
|
|
NXP USA Inc. |
622
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 60KB FLASH 44LQFP
|
Tray | S08 | -40°C ~ 85°C (TA) | 44-LQFP | 44-LQFP (10x10) | LVD，POR，PWM，WDT | S08 | 33 | 48MHz | 60KB (60K x 8) | Flash | - | 2.7 V ~ 5.5 V | A/D 8x12b | External | I2C，LINbus，SCI，SPI，USB | 8-Bit | ||
|
|
|
NXP USA Inc. |
2,755
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 60KB FLASH 48LQFP
|
Tray | S08 | -40°C ~ 85°C (TA) | 48-LQFP | 48-LQFP (7x7) | LVD，POR，PWM，WDT | S08 | 39 | 40MHz | 60KB (60K x 8) | Flash | 2K x 8 | 2.7 V ~ 5.5 V | A/D 16x12b | External | CANbus，I2C，LINbus，SCI，SPI | 8-Bit | ||
|
|
|
NXP USA Inc. |
462
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 60KB FLASH 64LQFP
|
Tray | S08 | -40°C ~ 85°C (TA) | 64-LQFP | 64-LQFP (10x10) | LVD，POR，PWM，WDT | S08 | 56 | 40MHz | 60KB (60K x 8) | Flash | - | 1.8 V ~ 3.6 V | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
|
|
|
NXP USA Inc. |
344
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 60KB FLASH 44QFP
|
Tray | S08 | -40°C ~ 85°C (TA) | 44-QFP | 44-QFP (10x10) | LVD，POR，PWM，WDT | S08 | 36 | 40MHz | 60KB (60K x 8) | Flash | - | 1.8 V ~ 3.6 V | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
|
|
|
NXP USA Inc. |
1,060
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 80QFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | 80-QFP | 80-QFP (14x14) | PWM，WDT | HCS12 | 59 | 25MHz | 32KB (32K x 8) | Flash | 1K x 8 | 2.35 V ~ 5.25 V | A/D 8x10b | Internal | I2C，SCI，SPI | 16-Bit | ||
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|
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NXP USA Inc. |
2,483
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 64KB FLASH 48LQFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | 48-LQFP | 48-LQFP (7x7) | POR，PWM，WDT | HCS12 | 31 | 25MHz | 64KB (64K x 8) | Flash | - | 2.35 V ~ 5.5 V | A/D 8x10b | Internal | CANbus，EBI/EMI，SCI，SPI | 16-Bit |
