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Discover 600 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | Speed | Program Memory Size | Program Memory Type | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | Speed | Program Memory Size | Program Memory Type | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | |
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NXP USA Inc. |
24,127
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 256KB FLASH 32QFN
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Tray | Kinetis KL1 | -40°C ~ 105°C (TA) | 32-UFQFN Exposed Pad | 32-QFN (5x5) | Brown-out Detect/Reset，DMA，I2S，LVD，POR，PWM，WDT | ARM Cortex-M0+ | 28 | 48MHz | 256KB (256K x 8) | Flash | - | 1.71 V ~ 3.6 V | A/D 11x16b，D/A 1x12b | Internal | I2C，LINbus，SPI，UART/USART | 32-Bit | ||
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NXP USA Inc. |
14,564
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 256KB FLASH 48QFN
|
Tray | Kinetis KL1 | -40°C ~ 105°C (TA) | 48-UFQFN Exposed Pad | 48-QFN (7x7) | Brown-out Detect/Reset，DMA，I2S，LVD，POR，PWM，WDT | ARM Cortex-M0+ | 40 | 48MHz | 256KB (256K x 8) | Flash | - | 1.71 V ~ 3.6 V | A/D 18x16b，D/A 1x12b | Internal | I2C，LINbus，SPI，UART/USART | 32-Bit | ||
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NXP USA Inc. |
1,600
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 256KB FLASH 64LQFP
|
Tray | Kinetis KL1 | -40°C ~ 105°C (TA) | 64-LQFP | 64-LQFP (10x10) | Brown-out Detect/Reset，DMA，I2S，LVD，POR，PWM，WDT | ARM Cortex-M0+ | 54 | 48MHz | 256KB (256K x 8) | Flash | - | 1.71 V ~ 3.6 V | A/D 20x16b，D/A 1x12b | Internal | I2C，LINbus，SPI，UART/USART | 32-Bit | ||
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NXP USA Inc. |
4,100
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 256KB FLASH 64BGA
|
Tray | Kinetis KL2 | -40°C ~ 105°C (TA) | 64-LFBGA | 64-MAPBGA (5x5) | DMA，I2S，LVD，POR，PWM，WDT | ARM Cortex-M0+ | 50 | 48MHz | 256KB (256K x 8) | Flash | - | 1.71 V ~ 3.6 V | A/D 16x16b，D/A 1x12b | Internal | I2C，SPI，UART/USART，USB | 32-Bit | ||
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NXP USA Inc. |
1,368
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 256KB FLASH 32QFN
|
Tray | Kinetis KL2 | -40°C ~ 105°C (TA) | 32-UFQFN Exposed Pad | 32-QFN (5x5) | DMA，I2S，LVD，POR，PWM，WDT | ARM Cortex-M0+ | 23 | 48MHz | 256KB (256K x 8) | Flash | - | 1.71 V ~ 3.6 V | A/D 16x16b，D/A 1x12b | Internal | I2C，SPI，UART/USART，USB | 32-Bit | ||
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NXP USA Inc. |
4,155
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MCU 32BIT 256KB FLASH 64LQFP
|
Tray | Kinetis KL3 | -40°C ~ 105°C (TA) | 64-LQFP | 64-LQFP (10x10) | Brown-out Detect/Reset，DMA，I2S，LCD，LVD，POR，PWM，WDT | ARM Cortex-M0+ | 50 | 48MHz | 256KB (256K x 8) | Flash | - | 1.71 V ~ 3.6 V | A/D - 16bit，D/A - 12bit | Internal | I2C，LINbus，SPI，UART/USART | 32-Bit | ||
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NXP USA Inc. |
22,868
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 256KB FLASH 64LQFP
|
Tray | Kinetis KL2 | -40°C ~ 105°C (TA) | 64-LQFP | 64-LQFP (10x10) | DMA，I2S，LVD，POR，PWM，WDT | ARM Cortex-M0+ | 50 | 48MHz | 256KB (256K x 8) | Flash | - | 1.71 V ~ 3.6 V | A/D 16x16b，D/A 1x12b | Internal | I2C，SPI，UART/USART，USB | 32-Bit | ||
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NXP USA Inc. |
1,320
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 128KB FLASH 100LQFP
|
Tray | LPC17xx | -40°C ~ 85°C (TA) | 100-LQFP | 100-LQFP (14x14) | Brown-out Detect/Reset，DMA，Motor Control PWM，POR，PWM，WDT | ARM Cortex-M3 | 70 | 100MHz | 128KB (128K x 8) | Flash | - | 2.4 V ~ 3.6 V | A/D 8x12b | Internal | CANbus，Ethernet，I2C，IrDA，Microwire，SPI，SSI，UART/USART，USB | 32-Bit | ||
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NXP USA Inc. |
4,090
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 256KB FLASH 80LQFP
|
Tray | LPC17xx | -40°C ~ 85°C (TA) | 80-LQFP | 80-LQFP (12x12) | Brown-out Detect/Reset，DMA，I2S，Motor Control PWM，POR，PWM，WDT | ARM Cortex-M3 | 52 | 100MHz | 256KB (256K x 8) | Flash | - | 2.4 V ~ 3.6 V | A/D 6x12b，D/A 1x10b | Internal | CANbus，I2C，IrDA，Microwire，SPI，SSI，SSP，UART/USART，USB OTG | 32-Bit | ||
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NXP USA Inc. |
1,604
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 256KB FLASH 64LQFP
|
Tray | MCF51AC | -40°C ~ 85°C (TA) | 64-LQFP | 64-LQFP (10x10) | LVD，PWM，WDT | Coldfire V1 | 54 | 50MHz | 256KB (256K x 8) | Flash | - | 2.7 V ~ 5.5 V | A/D 20x12b | External | CANbus，I2C，SCI，SPI | 32-Bit | ||
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NXP USA Inc. |
2,050
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 256KB FLASH 80LQFP
|
Tray | MCF51AC | -40°C ~ 85°C (TA) | 80-LQFP | 80-LQFP (14x14) | LVD，PWM，WDT | Coldfire V1 | 69 | 50MHz | 256KB (256K x 8) | Flash | - | 2.7 V ~ 5.5 V | A/D 24x12b | External | CANbus，I2C，SCI，SPI | 32-Bit | ||
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NXP USA Inc. |
539
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 256KB FLASH 100LQFP
|
Tray | 56F8xxx | -40°C ~ 105°C (TA) | 100-LQFP | 100-LQFP (14x14) | Brown-out Detect/Reset，DMA，LVD，POR，PWM，WDT | 56800EX | 86 | 100MHz | 256KB (256K x 8) | Flash | 2K x 8 | 3 V ~ 3.6 V | A/D 16x12b，16x16b，D/A 1x12b | Internal | CANbus，I2C，LINbus，SCI，SPI | 32-Bit | ||
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NXP USA Inc. |
5,675
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 512KB FLASH 64LQFP
|
Tray | LPC2100 | -40°C ~ 85°C (TA) | 64-LQFP | 64-LQFP (10x10) | Brown-out Detect/Reset，POR，PWM，WDT | ARM7 | 47 | 60MHz | 512KB (512K x 8) | Flash | - | 3 V ~ 3.6 V | A/D 16x10b; D/A 1x10b | Internal | I2C，Microwire，SPI，SSI，SSP，UART/USART | 16/32-Bit | ||
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NXP USA Inc. |
4,083
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 256KB FLASH 80LQFP
|
Tray | MCF5223x | -40°C ~ 85°C (TA) | 80-LQFP | 80-LQFP (14x14) | DMA，LVD，POR，PWM，WDT | Coldfire V2 | 73 | 60MHz | 256KB (256K x 8) | Flash | - | 3 V ~ 3.6 V | A/D 8x12b | Internal | Ethernet，I2C，SPI，UART/USART | 32-Bit | ||
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|
|
NXP USA Inc. |
888
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 80QFP
|
Tray | HCS12X | -40°C ~ 85°C (TA) | 80-QFP | 80-QFP (14x14) | LVD，POR，PWM，WDT | HCS12X | 59 | 50MHz | 512KB (512K x 8) | Flash | 4K x 8 | 1.72 V ~ 5.5 V | A/D 12x12b | External | CANbus，EBI/EMI，I2C，IrDA，SCI，SPI | 16-Bit | ||
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|
|
NXP USA Inc. |
227
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 256KB FLASH 100LQFP
|
Tray | MCF521x | -40°C ~ 85°C (TA) | 100-LQFP | 100-LQFP (14x14) | DMA，LVD，POR，PWM，WDT | Coldfire V2 | 55 | 80MHz | 256KB (256K x 8) | Flash | - | 3 V ~ 3.6 V | A/D 8x12b | Internal | CANbus，I2C，SPI，UART/USART | 32-Bit | ||
|
|
|
NXP USA Inc. |
1,100
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 256MAPBGA
|
Tray | MCF5445x | 0°C ~ 70°C (TA) | 256-LBGA | 256-MAPBGA | DMA，WDT | Coldfire V4 | 132 | 240MHz | - | ROMless | - | 1.35 V ~ 3.6 V | - | Internal | I2C，SPI，SSI，UART/USART，USB OTG | 32-Bit | ||
|
|
|
NXP USA Inc. |
1,348
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 256MAPBGA
|
Tray | MCF532x | -40°C ~ 85°C (TA) | 256-LBGA | 256-MAPBGA | DMA，LCD，PWM，WDT | Coldfire V3 | 94 | 240MHz | - | ROMless | - | 1.4 V ~ 3.6 V | - | External | EBI/EMI，Ethernet，I2C，SPI，SSI，UART/USART，USB，USB OTG | 32-Bit | ||
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|
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NXP USA Inc. |
963
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 112LQFP
|
Tray | HCS12X | -40°C ~ 85°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD，POR，PWM，WDT | HCS12X | 91 | 80MHz | 512KB (512K x 8) | Flash | 4K x 8 | 2.35 V ~ 5.5 V | A/D 16x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | 16-Bit | ||
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NXP USA Inc. |
2,280
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 144LQFP
|
Tray | HCS12X | -40°C ~ 85°C (TA) | 144-LQFP | 144-LQFP (20x20) | LVD，POR，PWM，WDT | HCS12X | 119 | 80MHz | 512KB (512K x 8) | Flash | 4K x 8 | 2.35 V ~ 5.5 V | A/D 24x10b | External | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | 16-Bit |
