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Discover 539 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Type | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | ||
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Type | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | ||
NXP USA Inc. |
19,527
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 64KB FLASH 32QFN
|
Tray | Kinetis KL1 | -40°C ~ 105°C (TA) | 32-UFQFN Exposed Pad | 32-QFN (5x5) | DMA,I2S,PWM,WDT | ARM Cortex-M0+ | 28 | 48MHz | 16K x 8 | Flash | - | 1.71 V ~ 3.6 V | A/D 11x16b | Internal | I2C,FlexIO,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
14,301
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 64KB FLASH 32QFN
|
Tray | Kinetis K02 | -40°C ~ 105°C (TA) | 32-VFQFN Exposed Pad | 32-QFN (5x5) | DMA,LVD,POR,PWM | ARM Cortex-M4 | 26 | 100MHz | 16K x 8 | Flash | - | 1.71 V ~ 3.6 V | A/D 12x16b,D/A 1x12b | Internal | I2C,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
5,609
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 64KB FLASH 32QFN
|
Tray | Kinetis KL1 | -40°C ~ 105°C (TA) | 32-VFQFN Exposed Pad | 32-QFN (5x5) | Brown-out Detect/Reset,DMA,I2S,LVD,POR,PWM,WDT | ARM Cortex-M0+ | 28 | 48MHz | 8K x 8 | Flash | - | 1.71 V ~ 3.6 V | A/D - 16bit,D/A - 12bit | Internal | I2C,LINbus,SPI,TSI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
2,837
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 64KB FLASH 48LQFP
|
Tray | LPC1100XL | -40°C ~ 85°C (TA) | 48-LQFP | 48-LQFP (7x7) | Brown-out Detect/Reset,POR,WDT | ARM Cortex-M0 | 42 | 50MHz | 8K x 8 | Flash | - | 1.8 V ~ 3.6 V | A/D 8x10b | Internal | I2C,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
2,250
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 64KB FLASH 48LQFP
|
Tray | LPC1100XL | -40°C ~ 105°C (TA) | 48-LQFP | 48-LQFP (7x7) | Brown-out Detect/Reset,POR,WDT | ARM Cortex-M0 | 42 | 50MHz | 8K x 8 | Flash | - | 1.8 V ~ 3.6 V | A/D 8x10b | Internal | I2C,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
4,677
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 64KB FLASH 64LQFP
|
Tray | Kinetis KEA | -40°C ~ 125°C (TA) | 64-LQFP | 64-LQFP (10x10) | LVD,POR,PWM,WDT | ARM Cortex-M0+ | 57 | 48MHz | 8K x 8 | Flash | - | 2.7 V ~ 5.5 V | A/D 16x12b | Internal | CANbus,I2C,LINbus,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
3,051
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 64KB FLASH 48LQFP
|
Tray | Kinetis K02 | -40°C ~ 105°C (TA) | 48-LQFP | 48-LQFP (7x7) | DMA,LVD,POR,PWM | ARM Cortex-M4 | 35 | 100MHz | 16K x 8 | Flash | - | 1.71 V ~ 3.6 V | A/D 12x16b,D/A 1x12b | Internal | I2C,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
8,693
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 64KB FLASH 33HVQFN
|
Tray | LPC11Uxx | -40°C ~ 85°C (TA) | 32-VFQFN Exposed Pad | 32-HVQFN (5x5) | Brown-out Detect/Reset,POR,WDT | ARM Cortex-M0 | 26 | 50MHz | 12K x 8 | Flash | 4K x 8 | 1.8 V ~ 3.6 V | A/D 8x10b | Internal | I2C,Microwire,SmartCard,SPI,SSP,UART/USART,USB | 32-Bit | ||||
NXP USA Inc. |
4,438
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 64KB FLASH 48LQFP
|
Tray | LPC11Uxx | -40°C ~ 85°C (TA) | 48-LQFP | 48-LQFP (7x7) | Brown-out Detect/Reset,POR,WDT | ARM Cortex-M0 | 40 | 50MHz | 10K x 8 | Flash | 4K x 8 | 1.8 V ~ 3.6 V | A/D 8x10b | Internal | I2C,Microwire,SmartCard,SPI,SSP,UART/USART,USB | 32-Bit | ||||
NXP USA Inc. |
5,673
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 64KB FLASH 33HVQFN
|
Tray | LPC13xx | -40°C ~ 85°C (TA) | 32-VQFN Exposed Pad | 32-HVQFN (7x7) | Brown-out Detect/Reset,POR,WDT | ARM Cortex-M3 | 26 | 72MHz | 12K x 8 | Flash | 4K x 8 | 2 V ~ 3.6 V | A/D 8x12b | Internal | I2C,Microwire,SPI,SSI,SSP,UART/USART,USB | 32-Bit | ||||
NXP USA Inc. |
1,348
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 64KB FLASH 48LQFP
|
Tray | LPC13xx | -40°C ~ 85°C (TA) | 48-LQFP | 48-LQFP (7x7) | Brown-out Detect/Reset,POR,WDT | ARM Cortex-M3 | 40 | 72MHz | 12K x 8 | Flash | 4K x 8 | 2 V ~ 3.6 V | A/D 8x12b | Internal | I2C,Microwire,SPI,SSI,SSP,UART/USART,USB | 32-Bit | ||||
NXP USA Inc. |
2,700
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 64KB FLASH 80LQFP
|
Tray | S08 | -40°C ~ 85°C (TA) | 80-LQFP | 80-LQFP (14x14) | LCD,LVD,POR,PWM,WDT | S08 | 39 | 40MHz | 4K x 8 | Flash | - | 1.8 V ~ 3.6 V | A/D 10x12b | Internal | I2C,SCI,SPI | 8-Bit | ||||
NXP USA Inc. |
6,369
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 64KB FLASH 32LQFP
|
Tray | S08 | -40°C ~ 85°C (TA) | 32-LQFP | 32-LQFP (7x7) | LVD,PWM,WDT | S08 | 26 | 50MHz | 4K x 8 | Flash | - | 1.8 V ~ 3.6 V | A/D 10x12b | Internal | I2C,LINbus,SCI,SPI | 8-Bit | ||||
NXP USA Inc. |
4,564
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 64KB FLASH 64LQFP
|
Tray | S08 | -40°C ~ 85°C (TA) | 64-LQFP | 64-LQFP (10x10) | LVD,PWM,WDT | S08 | 54 | 50MHz | 4K x 8 | Flash | - | 1.8 V ~ 3.6 V | A/D 22x12b | Internal | I2C,LINbus,SCI,SPI | 8-Bit | ||||
NXP USA Inc. |
1,130
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 64KB FLASH 44QFP
|
Tray | HC08 | -40°C ~ 85°C (TA) | 44-QFP | 44-QFP (10x10) | LED,LVD,POR,PWM | HC08 | 32 | 8MHz | 2K x 8 | Flash | - | 2.7 V ~ 5.5 V | A/D 8x10b | Internal | I2C,IRSCI,SCI,SPI | 8-Bit | ||||
NXP USA Inc. |
2,483
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 64KB FLASH 48LQFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | 48-LQFP | 48-LQFP (7x7) | POR,PWM,WDT | HCS12 | 31 | 25MHz | 4K x 8 | Flash | - | 2.35 V ~ 5.5 V | A/D 8x10b | Internal | CANbus,EBI/EMI,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
296
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 64KB FLASH 80QFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | 80-QFP | 80-QFP (14x14) | POR,PWM,WDT | HCS12 | 60 | 25MHz | 4K x 8 | Flash | - | 2.35 V ~ 2.75 V | A/D 16x10b; D/A 2x8b | Internal | EBI/EMI,I2C,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
894
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 64KB FLASH 112LQFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | 112-LQFP | 112-LQFP (20x20) | POR,PWM,WDT | HCS12 | 92 | 25MHz | 4K x 8 | Flash | - | 2.35 V ~ 2.75 V | A/D 16x10b; D/A 2x8b | Internal | EBI/EMI,I2C,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
2,150
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 64KB FLASH 32QFN
|
Tray | Kinetis KE02 | -40°C ~ 105°C (TA) | 32-VFQFN Exposed Pad | 32-QFN (5x5) | LVD,PWM,WDT | ARM Cortex-M0+ | 28 | 40MHz | 4K x 8 | Flash | 256 x 8 | 2.7 V ~ 5.5 V | A/D 16x12b,D/A 2x6b | Internal | I2C,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
4,822
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 64KB FLASH 32LQFP
|
Tray | Kinetis KE02 | -40°C ~ 105°C (TA) | 32-LQFP | 32-LQFP (7x7) | LVD,PWM,WDT | ARM Cortex-M0+ | 28 | 40MHz | 4K x 8 | Flash | 256 x 8 | 2.7 V ~ 5.5 V | A/D 16x12b,D/A 2x6b | Internal | I2C,SPI,UART/USART | 32-Bit |