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Discover 160 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | |
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NXP USA Inc. |
622
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 3MB FLASH 416BGA
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Tray | MPC55xx Qorivva | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA，POR，PWM，WDT | e200z6 | 256 | 132MHz | 128K x 8 | - | 1.35 V ~ 1.65 V | A/D 40x12b | External | CANbus，EBI/EMI，Ethernet，SCI，SPI | 32-Bit | ||
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NXP USA Inc. |
346
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 3MB FLASH 100MAPBGA
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA，LVD，POR，WDT | e200z2，e200z4 | - | 80MHz/160MHz | 512K x 8 | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | ||
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NXP USA Inc. |
288
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 3MB FLASH 256MAPBGA
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA，LVD，POR，WDT | e200z2，e200z4 | 178 | 80MHz/160MHz | 512K x 8 | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | ||
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NXP USA Inc. |
40
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 3MB FLASH 516FBGA
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Tray | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA，POR，PWM | e200z7 | 32 | 200MHz | 192K x 8 | - | 1.08 V ~ 5.25 V | A/D 64x12b | External | CANbus，EBI/EMI，SCI，SPI | 32-Bit | ||
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NXP USA Inc. |
200
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3 days |
-
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MOQ: 1 MPQ: 1
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DUAL CORE 3M FLASH 384K RAM F
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Tray | MPC57xx | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4 | 129 | 80MHz/160MHz | 512K x 8 | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 3MB FLASH 324TEBGA
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Tray | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 324-BBGA | 324-TEPBGA (23x23) | DMA，POR，PWM，WDT | e200z4 | 151 | 150MHz | 192K x 8 | - | 1.14 V ~ 5.25 V | A/D 40x12b | Internal | CANbus，EBI/EMI，LINbus，SCI，SPI | 32-Bit | ||
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NXP USA Inc. |
180
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 3MB FLASH 208LQFP
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Tray | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 208-LQFP | 208-TQFP (28x28) | DMA，POR，PWM，WDT | e200z4d，e200z0h | 177 | 80MHz/120MHz | 256K x 8 | 64K x 8 | 3 V ~ 5.5 V | A/D 33x10b，10x12b | Internal | CANbus，Ethernet，I2C，LINbus，SCI，SPI | 32-Bit Dual-Core | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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NXP 32-BIT MCU POWER ARCH CORE
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Tray | MPC55xx Qorivva | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA，POR，PWM，WDT | e200z6 | 256 | 132MHz | 128K x 8 | - | 1.35 V ~ 1.65 V | A/D 40x12b | External | CANbus，EBI/EMI，Ethernet，SCI，SPI | 32-Bit | ||
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NXP USA Inc. |
200
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3 days |
-
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MOQ: 1 MPQ: 1
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NXP 32-BIT MCU POWER ARCH CORE
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Tray | MPC55xx Qorivva | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA，POR，PWM，WDT | e200z6 | 256 | 144MHz | 128K x 8 | - | 1.35 V ~ 1.65 V | A/D 40x12b | External | CANbus，EBI/EMI，Ethernet，SCI，SPI | 32-Bit | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 880 MPQ: 1
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SINGLE CORE 3M FLASH 384 RAM
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Tray | MPC57xx | -40°C ~ 105°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA，I2S，POR，WDT | e200z4 | - | 160MHz | 384K x 8 | 64K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b，16x12b | Internal | CANbus，Ethernet，FlexRay，I2C，LINbus，SPI | 32-Bit | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 500 MPQ: 1
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32 BIT SINGLE CORE 3M FLASH 3
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Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，I2S，POR，WDT | e200z4 | 129 | 120MHz | 384K x 8 | 64K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b，16x12b | Internal | CANbus，Ethernet，FlexRay，I2C，LINbus，SPI | 32-Bit | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 880 MPQ: 1
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SINGLE CORE，3M FLASH
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA，I2S，POR，WDT | e200z4 | - | 160MHz | 384K x 8 | 64K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b，16x12b | Internal | CANbus，Ethernet，FlexRay，I2C，LINbus，SPI | 32-Bit | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 500 MPQ: 1
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32 BIT SINGLE CORE 3M FLASH 384
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Tape & Reel (TR) | MPC57xx | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，I2S，POR，WDT | e200z4 | 129 | 120MHz | 384K x 8 | 64K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b，16x12b | Internal | CANbus，Ethernet，FlexRay，I2C，LINbus，SPI | 32-Bit | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 200 MPQ: 1
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SINGLE CORE 3M FLASH 384K RAM
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，I2S，POR，WDT | e200z4 | 129 | 120MHz | 384K x 8 | 64K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b，16x12b | Internal | CANbus，Ethernet，FlexRay，I2C，LINbus，SPI | 32-Bit | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 200 MPQ: 1
|
32 BIT SINGLE CORE 3M FLASH 3
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，I2S，POR，WDT | e200z4 | 129 | 120MHz | 384K x 8 | 64K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b，16x12b | Internal | CANbus，Ethernet，FlexRay，I2C，LINbus，SPI | 32-Bit | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 200 MPQ: 1
|
SINGLE CORE 3M FLASH 384K RAM
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Tray | MPC57xx | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，I2S，POR，WDT | e200z4 | 129 | 120MHz | 384K x 8 | 64K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b，16x12b | Internal | CANbus，Ethernet，FlexRay，I2C，LINbus，SPI | 32-Bit | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 500 MPQ: 1
|
32 BIT DUAL CORE 3M FLASH 384
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Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4 | 129 | 80MHz/160MHz | 512K x 8 | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 1000 MPQ: 1
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NXP 32-BIT MCU DUAL CORE 3MB FLA
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Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA，I2S，POR，WDT | e200z4 | 178 | 160MHz | 384K x 8 | 64K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b，16x12b | Internal | CANbus，Ethernet，FlexRay，I2C，LINbus，SPI | 32-Bit | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 1500 MPQ: 1
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IC MCU 32BIT 3MB FLASH 100MAPBGA
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Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA，LVD，POR，WDT | e200z2，e200z4 | - | 80MHz/160MHz | 512K x 8 | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 500 MPQ: 1
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32 BIT SINGLE CORE 3M FLASH 384
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Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，I2S，POR，WDT | e200z4 | 129 | 120MHz | 384K x 8 | 64K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b，16x12b | Internal | CANbus，Ethernet，FlexRay，I2C，LINbus，SPI | 32-Bit |
