- Packaging:
-
- Operating Temperature:
-
- Package / Case:
-
- Supplier Device Package:
-
- Peripherals:
-
- Core Processor:
-
- RAM Size:
-
- Program Memory Size:
-
- EEPROM Size:
-
- Voltage - Supply (Vcc/Vdd):
-
- Data Converters:
-
- Core Size:
-
- Selected conditions:
Discover 87 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Core Size | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Core Size | ||
NXP USA Inc. |
2,040
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 32LQFP
|
Tray | HC08 | -40°C ~ 85°C (TA) | 32-LQFP | 32-LQFP (7x7) | LVD,POR,PWM | HC08 | 21 | 8MHz | 1K x 8 | 8KB (8K x 8) | - | 3 V ~ 5.5 V | A/D 8x10b | 8-Bit | ||||
NXP USA Inc. |
1,097
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 16KB FLASH 48LQFP
|
Tray | HC08 | -40°C ~ 85°C (TA) | 48-LQFP | 48-LQFP (7x7) | LVD,POR,PWM | HC08 | 37 | 8MHz | 1K x 8 | 16KB (16K x 8) | - | 3 V ~ 5.5 V | A/D 8x10b | 8-Bit | ||||
NXP USA Inc. |
616
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 48LQFP
|
Tray | HC08 | -40°C ~ 85°C (TA) | 48-LQFP | 48-LQFP (7x7) | LVD,POR,PWM | HC08 | 37 | 8MHz | 1K x 8 | 8KB (8K x 8) | - | 3 V ~ 5.5 V | A/D 8x10b | 8-Bit | ||||
NXP USA Inc. |
160
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 192KB FLASH 64LQFP
|
Tray | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 64-LQFP | 64-LQFP (10x10) | DMA,POR,PWM,WDT | e200z0h | 45 | 64MHz | 12K x 8 | 192KB (192K x 8) | 4K x 16 | 3 V ~ 5.5 V | A/D 16x10b | 32-Bit | ||||
NXP USA Inc. |
450
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 256KB FLASH 100LQFP
|
Tray | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 100-LQFP | 100-LQFP (14x14) | DMA,POR,PWM,WDT | e200z0h | 79 | 48MHz | 16K x 8 | 256KB (256K x 8) | 4K x 16 | 3 V ~ 5.5 V | A/D 33x12b | 32-Bit | ||||
NXP USA Inc. |
160
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 256KB FLASH 64LQFP
|
Tray | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 64-LQFP | 64-LQFP (10x10) | DMA,POR,PWM,WDT | e200z0h | 45 | 64MHz | 20K x 8 | 256KB (256K x 8) | 4K x 16 | 3 V ~ 5.5 V | A/D 16x10b | 32-Bit | ||||
NXP USA Inc. |
440
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 256KB FLASH 100LQFP
|
Tray | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 100-LQFP | 100-LQFP (14x14) | DMA,POR,PWM,WDT | e200z0h | 79 | 64MHz | 20K x 8 | 256KB (256K x 8) | 4K x 16 | 3 V ~ 5.5 V | A/D 16x10b | 32-Bit | ||||
NXP USA Inc. |
20
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 16KB FLASH 48LQFP
|
Tray | HC08 | -40°C ~ 125°C (TA) | 48-LQFP | 48-LQFP (7x7) | LVD,POR,PWM | HC08 | 37 | 8MHz | 1K x 8 | 16KB (16K x 8) | - | 3 V ~ 5.5 V | A/D 8x10b | 8-Bit | ||||
NXP USA Inc. |
1,500
|
3 days |
-
|
MOQ: 1500 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 32
|
Tape & Reel (TR) | S12 MagniV | -40°C ~ 105°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | DMA,POR,PWM,WDT | S12Z | 31 | 50MHz | 4K x 8 | 32KB (32K x 8) | 512 x 8 | 3.5 V ~ 40 V | A/D 9x12b | 16-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1500 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
|
Tape & Reel (TR) | MPC56xx Qorivva | -40°C ~ 105°C (TA) | 64-LQFP | 64-LQFP (10x10) | DMA,POR,PWM,WDT | e200z0h | 45 | 48MHz | 16K x 8 | 256KB (256K x 8) | 4K x 16 | 3 V ~ 5.5 V | A/D 16x12b | 32-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 256KB FLASH 100LQFP
|
Tray | MPC56xx Qorivva | -40°C ~ 105°C (TA) | 100-LQFP | 100-LQFP (14x14) | DMA,POR,PWM,WDT | e200z0h | 79 | 48MHz | 16K x 8 | 256KB (256K x 8) | 4K x 16 | 3 V ~ 5.5 V | A/D 33x12b | 32-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1500 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 32
|
Tape & Reel (TR) | S12 MagniV | -40°C ~ 125°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | DMA,POR,PWM,WDT | S12Z | 31 | 50MHz | 4K x 8 | 32KB (32K x 8) | 512 x 8 | 3.5 V ~ 40 V | A/D 9x12b | 16-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1500 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 64
|
Tape & Reel (TR) | S12 MagniV | -40°C ~ 125°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | DMA,POR,PWM,WDT | S12Z | 31 | 50MHz | 4K x 8 | 64KB (64K x 8) | 512 x 8 | 3.5 V ~ 40 V | A/D 9x12b | 16-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1500 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 32
|
Tape & Reel (TR) | S12 MagniV | -40°C ~ 150°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | DMA,POR,PWM,WDT | S12Z | 31 | 50MHz | 4K x 8 | 32KB (32K x 8) | 512 x 8 | 3.5 V ~ 40 V | A/D 9x12b | 16-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1500 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 64
|
Tape & Reel (TR) | S12 MagniV | -40°C ~ 150°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | DMA,POR,PWM,WDT | S12Z | 31 | 50MHz | 4K x 8 | 64KB (64K x 8) | 512 x 8 | 3.5 V ~ 40 V | A/D 9x12b | 16-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 160 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 32
|
Tray | S12 MagniV | -40°C ~ 105°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | DMA,POR,PWM,WDT | S12Z | 31 | 50MHz | 4K x 8 | 32KB (32K x 8) | 512 x 8 | 3.5 V ~ 40 V | A/D 9x12b | 16-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 160 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 32
|
Tray | S12 MagniV | -40°C ~ 125°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | DMA,POR,PWM,WDT | S12Z | 31 | 50MHz | 4K x 8 | 32KB (32K x 8) | 512 x 8 | 3.5 V ~ 40 V | A/D 9x12b | 16-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 160 MPQ: 1
|
S12Z CORE 128K FLASH
|
Tray | S12 MagniV | -40°C ~ 105°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | DMA,POR,PWM,WDT | S12Z | 31 | 50MHz | 4K x 8 | 64KB (64K x 8) | 512 x 8 | 3.5 V ~ 40 V | A/D 9x12b | 16-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 160 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 64
|
Tray | S12 MagniV | -40°C ~ 125°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | DMA,POR,PWM,WDT | S12Z | 31 | 50MHz | 4K x 8 | 64KB (64K x 8) | 512 x 8 | 3.5 V ~ 40 V | A/D 9x12b | 16-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 160 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 32
|
Tray | S12 MagniV | -40°C ~ 150°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | DMA,POR,PWM,WDT | S12Z | 31 | 50MHz | 4K x 8 | 32KB (32K x 8) | 512 x 8 | 3.5 V ~ 40 V | A/D 9x12b | 16-Bit |