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Discover 309 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Ethernet | SATA | USB | Security Features | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Ethernet | SATA | USB | Security Features | ||
NXP USA Inc. |
161
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX51 800MHZ 529BGA
|
Tray | i.MX51 | -20°C ~ 85°C (TC) | 529-LFBGA | 529-BGA (19x19) | ARM® Cortex®-A8 | 1.2V,1.875V,2.775V,3.0V | 800MHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR,DDR2 | No | 10/100 Mbps (1) | - | USB 2.0 (3),USB 2.0 + PHY (1) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC | ||||
NXP USA Inc. |
147
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX53 800MHZ 529TEBGA-2
|
Tray | i.MX53 | -40°C ~ 125°C (TJ) | 529-FBGA | 529-FBGA (19x19) | ARM® Cortex®-A8 | 1.3V,1.8V,2.775V,3.3V | 800MHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,DDR2,DDR3 | Yes | 10/100 Mbps (1) | SATA 1.5Gbps (1) | USB 2.0 (2),USB 2.0 + PHY (2) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
150
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
I.MX 6SL ROM PERF ENHAN
|
Tray | i.MX6SL | 0°C ~ 95°C (TJ) | 432-TFBGA | 432-MAPBGA (13x13) | ARM® Cortex®-A9 | 1.2V,1.8V,3.0V | 1.0GHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | 10/100 Mbps (1) | - | USB 2.0 + PHY (3) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
159
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
I.MX 6SL ROM PERF ENHAN
|
Tray | i.MX6SL | -40°C ~ 105°C (TA) | 432-TFBGA | 432-MAPBGA (13x13) | ARM® Cortex®-A9 | 1.2V,1.8V,3.0V | 1.0GHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | 10/100 Mbps (1) | - | USB 2.0 + PHY (3) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
500
|
3 days |
-
|
MOQ: 500 MPQ: 1
|
IC MPU I.MX6DL 1.0GHZ 624MAPBGA
|
Tape & Reel (TR) | i.MX6DL | 0°C ~ 95°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 1.0GHz | 2 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
500
|
3 days |
-
|
MOQ: 500 MPQ: 1
|
IC MPU I.MX6DL 1.0GHZ 624MAPBGA
|
Tape & Reel (TR) | i.MX6DL | 0°C ~ 95°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 1.0GHz | 2 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
500
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6DL 1.0GHZ 624MAPBGA
|
Cut Tape (CT) | i.MX6DL | 0°C ~ 95°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 1.0GHz | 2 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
500
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6DL 1.0GHZ 624MAPBGA
|
- | i.MX6DL | 0°C ~ 95°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 1.0GHz | 2 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
800
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX51 800MHZ 529BGA
|
Tray | i.MX51 | -20°C ~ 85°C (TC) | 527-LFBGA | 527-BGA (13x13) | ARM® Cortex®-A8 | 1.2V,1.875V,2.775V,3.0V | 800MHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR,DDR2 | Yes | 10/100 Mbps (1) | - | USB 2.0 (3),USB 2.0 + PHY (1) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC | ||||
NXP USA Inc. |
420
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX51 600MHZ 529BGA
|
Tray | i.MX51 | -40°C ~ 95°C (TC) | 529-LFBGA | 529-BGA (19x19) | ARM® Cortex®-A8 | 1.2V,1.875V,2.775V,3.0V | 600MHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR,DDR2 | No | 10/100 Mbps (1) | - | USB 2.0 (3),USB 2.0 + PHY (1) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC | ||||
Texas Instruments |
155
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU OMAP-59XX 150MHZ 289BGA
|
Tray | OMAP-59xx | -40°C ~ 85°C (TC) | 289-TFBGA | 289-BGA (12x12) | ARM9TDMI | 1.8V,2.75V,3.3V | 150MHz | 1 Core,32-Bit | Signal Processing; C55x,System Control; CP15 | SDRAM | No | - | - | USB 2.0 (2) | - | ||||
NXP USA Inc. |
500
|
3 days |
-
|
MOQ: 500 MPQ: 1
|
IC MPU I.MX6Q 1.0GHZ 624FCBGA
|
Tape & Reel (TR) | i.MX6Q | -20°C ~ 105°C (TJ) | 624-LFBGA,FCBGA | 624-FCPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 1.0GHz | 4 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
500
|
3 days |
-
|
MOQ: 500 MPQ: 1
|
IC MPU I.MX6Q 1.0GHZ 624FCBGA
|
Tape & Reel (TR) | i.MX6Q | -40°C ~ 125°C (TJ) | 624-FBGA,FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 1.0GHz | 4 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
60
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6D ENHANCED 624FCBGA
|
Tray | i.MX6D | -20°C ~ 105°C (TJ) | 624-LFBGA,FCBGA | 624-FCPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 1.0GHz | 2 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
66
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6D ENHANCED 624FCBGA
|
Tray | i.MX6D | -40°C ~ 125°C (TJ) | 624-FBGA,FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 1.0GHz | 2 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
89
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU 32BIT I.MX6 800MHZ 400BGA
|
Tray | i.MX6SX | -40°C ~ 105°C (TA) | 400-LFBGA | 400-MAPBGA (17x17) | ARM® Cortex®-A9,ARM® Cortex®-M4 | 1.8V,2.5V,2.8V,3.15V | 200MHz,800MHz | 2 Core,32-Bit | Multimedia; NEON® MPE | LPDDR2,LVDDR3,DDR3 | No | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1),USB 2.0 OTG + PHY (2) | A-HAB,ARM TZ,CAAM,CSU,SNVS,System JTAG,TVDECODE | ||||
Texas Instruments |
79
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU OMAP-59XX 150MHZ 289BGA
|
Tray | OMAP-59xx | -40°C ~ 85°C (TC) | 289-BGA | 289-BGA (19x19) | ARM9TDMI | 1.8V,2.75V,3.3V | 150MHz | 1 Core,32-Bit | Signal Processing; C55x,System Control; CP15 | SDRAM | No | - | - | USB 2.0 (2) | - | ||||
NXP USA Inc. |
90
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SX 1GHZ 400MAPBGA
|
Tray | i.MX6SX | -20°C ~ 105°C (TJ) | 400-LFBGA | 400-MAPBGA (17x17) | ARM® Cortex®-A9,ARM® Cortex®-M4 | 1.8V,2.5V,2.8V,3.15V | 200MHz,1GHz | 2 Core,32-Bit | Multimedia; NEON® MPE | LPDDR2,LVDDR3,DDR3 | Yes | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1),USB 2.0 OTG + PHY (2) | A-HAB,ARM TZ,CAAM,CSU,SNVS,System JTAG,TVDECODE | ||||
NXP USA Inc. |
60
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SX 800MHZ 400MAPBGA
|
Tray | i.MX6SX | -40°C ~ 105°C (TA) | 400-LFBGA | 400-MAPBGA (17x17) | ARM® Cortex®-A9,ARM® Cortex®-M4 | 1.8V,2.5V,2.8V,3.15V | 200MHz,800MHz | 2 Core,32-Bit | Multimedia; NEON® MPE | LPDDR2,LVDDR3,DDR3 | Yes | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1),USB 2.0 OTG + PHY (2) | A-HAB,ARM TZ,CAAM,CSU,SNVS,System JTAG,TVDECODE | ||||
NXP USA Inc. |
39
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX51 600MHZ 529BGA
|
Tray | i.MX51 | -40°C ~ 95°C (TC) | 529-LFBGA | 529-BGA (19x19) | ARM® Cortex®-A8 | 1.2V,1.875V,2.775V,3.0V | 600MHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR,DDR2 | No | 10/100 Mbps (1) | - | USB 2.0 (3),USB 2.0 + PHY (1) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC |