- Manufacturer:
-
- Series:
-
- Operating Temperature:
-
- Package / Case:
-
- Supplier Device Package:
-
- Core Processor:
-
- Voltage - I/O:
-
- Speed:
-
- Number of Cores/Bus Width:
-
- Co-Processors/DSP:
-
- RAM Controllers:
-
- Display & Interface Controllers:
-
- USB:
-
- Selected conditions:
Discover 217 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | USB | Security Features | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | USB | Security Features | ||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 90 MPQ: 1
|
IC MCU 32BIT ROMLESS 364MAPBGA
|
Tray | Vybrid,VF6xx | -40°C ~ 85°C (TA) | 364-LFBGA | 364-LFBGA (17x17) | ARM® Cortex®-A5 + Cortex®-M4 | 3.3V | 500MHz,167MHz | 2 Core,32-Bit | Multimedia; NEON® MPE | LPDDR2,DDR3,DRAM | Yes | DCU,GPU,LCD,VideoADC,VIU | USB 2.0 OTG + PHY (1) | ARM TZ,CAAM,HAB,RTIC,Secure JTAG,SNVS,Tamper,TZ ASC,TZ WDOG | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 90 MPQ: 1
|
IC MCU 32BIT ROMLESS 364MAPBGA
|
Tray | Vybrid,VF6xx | -40°C ~ 85°C (TA) | 364-LFBGA | 364-LFBGA (17x17) | ARM® Cortex®-A5 + Cortex®-M4 | 3.3V | 500MHz,167MHz | 2 Core,32-Bit | Multimedia; NEON® MPE | LPDDR2,DDR3,DRAM | Yes | DCU,GPU,LCD,VideoADC,VIU | USB 2.0 OTG + PHY (1) | - | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 90 MPQ: 1
|
IC MCU 32BIT ROMLESS 364MAPBGA
|
Tray | Vybrid,VF5xxR | -40°C ~ 85°C (TA) | 364-LFBGA | 364-LFBGA (17x17) | ARM® Cortex®-A5 | 3.3V | 400MHz | 1 Core,32-Bit | Multimedia; NEON® MPE | LPDDR2,DDR3,DRAM | No | DCU,GPU,LCD,VideoADC,VIU | USB 2.0 OTG + PHY (1) | ARM TZ,Hashing,RNG,RTC,RTIC,Secure JTAG,SNVS,TZ ASC,TZ WDOG | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 90 MPQ: 1
|
IC MCU 32BIT ROMLESS 364MAPBGA
|
Tray | Vybrid,VF5xxR | -40°C ~ 85°C (TA) | 364-LFBGA | 364-LFBGA (17x17) | ARM® Cortex®-A5 + Cortex®-M4 | 3.3V | 400MHz,133MHz | 2 Core,32-Bit | Multimedia; NEON® MPE | LPDDR2,DDR3,DRAM | No | DCU,GPU,LCD,VideoADC,VIU | USB 2.0 OTG + PHY (1) | ARM TZ,Hashing,RNG,RTC,RTIC,Secure JTAG,SNVS,TZ ASC,TZ WDOG | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 90 MPQ: 1
|
IC MCU 32BIT ROMLESS 364MAPBGA
|
Tray | Vybrid,VF5xxR | -40°C ~ 85°C (TA) | 364-LFBGA | 364-LFBGA (17x17) | ARM® Cortex®-A5 + Cortex®-M4 | 3.3V | 400MHz,133MHz | 2 Core,32-Bit | Multimedia; NEON® MPE | LPDDR2,DDR3,DRAM | No | DCU,GPU,LCD,VideoADC,VIU | USB 2.0 OTG + PHY (1) | ARM TZ,Hashing,RNG,RTC,RTIC,Secure JTAG,SNVS,TZ ASC,TZ WDOG | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 60 MPQ: 1
|
IC MPU MPC8XX 80MHZ 256BGA
|
Tray | MPC8xx | 0°C ~ 95°C (TA) | 256-BBGA | 256-PBGA (23x23) | MPC8xx | 3.3V | 80MHz | 1 Core,32-Bit | Communications; CPM | DRAM | No | - | USB 2.0 (1) | - | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 90 MPQ: 1
|
IC MCU 32BIT ROMLESS 364MAPBGA
|
Tray | Vybrid,VF5xxR | -40°C ~ 85°C (TA) | 364-LFBGA | 364-LFBGA (17x17) | ARM® Cortex®-A5 + Cortex®-M4 | 3.3V | 400MHz,133MHz | 2 Core,32-Bit | Multimedia; NEON® MPE | LPDDR2,DDR3,DRAM | Yes | DCU,GPU,LCD,VideoADC,VIU | USB 2.0 OTG + PHY (1) | ARM TZ,Hashing,RNG,RTC,RTIC,Secure JTAG,SNVS,TZ ASC,TZ WDOG | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 60 MPQ: 1
|
IC MPU MPC8XX 66MHZ 256BGA
|
Tray | MPC8xx | -40°C ~ 100°C (TA) | 256-BBGA | 256-PBGA (23x23) | MPC8xx | 3.3V | 66MHz | 1 Core,32-Bit | Communications; CPM | DRAM | No | - | USB 2.0 (1) | - | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 90 MPQ: 1
|
IC MCU 32BIT ROMLESS 364MAPBGA
|
Tray | Vybrid,VF5xxR | -40°C ~ 85°C (TA) | 364-LFBGA | 364-LFBGA (17x17) | ARM® Cortex®-A5 + Cortex®-M4 | 3.3V | 400MHz,133MHz | 2 Core,32-Bit | Multimedia; NEON® MPE | LPDDR2,DDR3,DRAM | Yes | DCU,GPU,LCD,VideoADC,VIU | USB 2.0 OTG + PHY (1) | ARM TZ,Hashing,RNG,RTC,RTIC,Secure JTAG,SNVS,TZ ASC,TZ WDOG | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 90 MPQ: 1
|
IC MCU 32BIT ROMLESS 364MAPBGA
|
Tray | Vybrid,VF5xxR | -40°C ~ 85°C (TA) | 364-LFBGA | 364-LFBGA (17x17) | ARM® Cortex®-A5 + Cortex®-M4 | 3.3V | 400MHz,133MHz | 2 Core,32-Bit | Multimedia; NEON® MPE | LPDDR2,DDR3,DRAM | Yes | DCU,GPU,LCD,VideoADC,VIU | USB 2.0 OTG + PHY (1) | ARM TZ,Hashing,RNG,RTC,RTIC,Secure JTAG,SNVS,TZ ASC,TZ WDOG | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | 266MHz | 1 Core,32-Bit | Communications; RISC CPM | DRAM,SDRAM | No | - | USB 2.0 (1) | - | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | 266MHz | 1 Core,32-Bit | Communications; RISC CPM,Security; SEC | DRAM,SDRAM | No | - | USB 2.0 (1) | Cryptography,Random Number Generator | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | 266MHz | 1 Core,32-Bit | Communications; RISC CPM | DRAM,SDRAM | No | - | USB 2.0 (1) | - | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | 266MHz | 1 Core,32-Bit | Communications; RISC CPM | DRAM,SDRAM | No | - | USB 2.0 (1) | - | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
Tray | MPC82xx | -40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | 266MHz | 1 Core,32-Bit | Communications; RISC CPM,Security; SEC | DRAM,SDRAM | No | - | USB 2.0 (1) | Cryptography,Random Number Generator | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | 266MHz | 1 Core,32-Bit | Communications; RISC CPM,Security; SEC | DRAM,SDRAM | No | - | USB 2.0 (1) | Cryptography,Random Number Generator | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | 266MHz | 1 Core,32-Bit | Communications; RISC CPM,Security; SEC | DRAM,SDRAM | No | - | USB 2.0 (1) | Cryptography,Random Number Generator | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
Tray | MPC82xx | -40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | 266MHz | 1 Core,32-Bit | Communications; RISC CPM | DRAM,SDRAM | No | - | USB 2.0 (1) | - | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC MPU MPC82XX 300MHZ 516BGA
|
Tray | MPC82xx | -40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | 300MHz | 1 Core,32-Bit | Communications; RISC CPM,Security; SEC | DRAM,SDRAM | No | - | USB 2.0 (1) | Cryptography,Random Number Generator | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
Tray | MPC82xx | -40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | 266MHz | 1 Core,32-Bit | Communications; RISC CPM,Security; SEC | DRAM,SDRAM | No | - | USB 2.0 (1) | Cryptography,Random Number Generator |