- Melting Point：
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- Selected conditions:
Discover 4 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Form | Composition | Melting Point | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Form | Composition | Melting Point | |
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Chip Quik Inc. |
49
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
TWO PART MIX SOLDER PASTE
|
Jar，15g (0.5 oz) | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | 281°F (138°C) | ||
|
|
|
Chip Quik Inc. |
13
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SOLDER PASTE TWO PART MIX
|
Jar，15g (0.5 oz) | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 423 ~ 428°F (217 ~ 220°C) | ||
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|
|
Chip Quik Inc. |
22
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SN42/BI57.6/AG0.4 2-PART MIX 60G
|
Jar，60g (2.1 oz) | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | 281°F (138°C) | ||
|
|
|
Chip Quik Inc. |
20
|
3 days |
-
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MOQ: 1 MPQ: 1
|
SN96.5/AG3.0/CU0.5 2-PRT MIX 60G
|
Jar，60g (2.1 oz) | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 423 ~ 428°F (217 ~ 220°C) |
