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Discover 1,068 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Wire Gauge | Diameter | Form | Composition | Melting Point | Flux Type | Process | Shelf Life | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Wire Gauge | Diameter | Form | Composition | Melting Point | Flux Type | Process | Shelf Life | |
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Chip Quik Inc. |
594
|
3 days |
-
|
MOQ: 1 MPQ: 1
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SLDR PASTE NO-CLN SN63/PB37 50G
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- | Solder Paste | - | - | Jar，50g (1.8 oz) | Sn63Pb37 (63/37) | 361°F (183°C) | No-Clean | Leaded | 12 Months (Date of Manufacture) (Refrigerated) | ||
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Chip Quik Inc. |
1,002
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SOLDER PASTE NO-CLEAN 63/37 5CC
|
- | Solder Paste | - | - | Syringe，5cc，15g (0.5 oz) | Sn63Pb37 (63/37) | 361°F (183°C) | No-Clean | Leaded | 12 Months (Date of Manufacture) (Refrigerated) | ||
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Chip Quik Inc. |
914
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SOLDER PASTE LOW TEMP 5CC W/TIP
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- | Solder Paste | - | - | Syringe，15g (0.5 oz) | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | 281°F (138°C) | No-Clean | Lead Free | 6 Months (Date of Manufacture) (Refrigerated) | ||
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Chip Quik Inc. |
322
|
3 days |
-
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MOQ: 1 MPQ: 1
|
SOLDER PASTE NO-CLEAN LF 5CC SYR
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- | Solder Paste | - | - | Syringe，15g (0.5 oz) | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 423 ~ 428°F (217 ~ 220°C) | No-Clean | Lead Free | 6 Months (Date of Manufacture) (Refrigerated) | ||
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Chip Quik Inc. |
441
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SLDR PASTE NO-CLN SAC305 50G
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- | Solder Paste | - | - | Jar，50g (1.8 oz) | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 423 ~ 428°F (217 ~ 220°C) | No-Clean | Lead Free | 6 Months (Date of Manufacture) (Refrigerated) | ||
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Multicore |
241
|
3 days |
-
|
MOQ: 1 MPQ: 1
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60/40 370 3% .015DIA 27AWG
|
370 | Wire Solder | 27 AWG，28 SWG | 0.015" (0.38mm) | Spool，227g (1/2 lb) | Sn60Pb40 (60/40) | 361 ~ 374°F (183 ~ 190°C) | Rosin Activated (RA) | Leaded | Shelf Life Not Applicable | ||
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Multicore |
483
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
63/37 400 2% .015DIA 27AWG
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C400 | Wire Solder | 27 AWG，28 SWG | 0.015" (0.38mm) | Spool，227g (1/2 lb) | Sn63Pb37 (63/37) | 361°F (183°C) | No-Clean | Leaded | Shelf Life Not Applicable | ||
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Chip Quik Inc. |
713
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SOLDER PASTE NO-CLEAN 63/37 10CC
|
- | Solder Paste | - | - | Syringe，10cc，35g (1.2 oz) | Sn63Pb37 (63/37) | 361°F (183°C) | No-Clean | Leaded | 12 Months (Date of Manufacture) (Refrigerated) | ||
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Chip Quik Inc. |
165
|
3 days |
-
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MOQ: 1 MPQ: 1
|
SLDR PASTE NO-CLN SN42/BI58 50G
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- | Solder Paste | - | - | Jar，50g (1.8 oz) | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | 281°F (138°C) | No-Clean | Lead Free | 6 Months (Date of Manufacture) (Refrigerated) | ||
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Chip Quik Inc. |
311
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SLD WIRE NO-CLEAN 96.5/3/.5 4OZ.
|
- | Wire Solder | 20 AWG，22 SWG | 0.031" (0.79mm) | Spool，113g (1/4 lb) | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 423 ~ 428°F (217 ~ 220°C) | No-Clean | Lead Free | Shelf Life Not Applicable | ||
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Chip Quik Inc. |
356
|
3 days |
-
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MOQ: 1 MPQ: 1
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SOLDER PASTE LOW TEMP 10CC W/TIP
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- | Solder Paste | - | - | Syringe，10cc，35g (1.2 oz) | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | 281°F (138°C) | No-Clean | Lead Free | 6 Months (Date of Manufacture) (Refrigerated) | ||
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Chip Quik Inc. |
315
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SLD WIRE NO-CLEAN 96.5/3/.5 4OZ.
|
- | Wire Solder | 24 AWG，25 SWG | 0.020" (0.51mm) | Spool，113g (1/4 lb) | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 423 ~ 428°F (217 ~ 220°C) | No-Clean | Lead Free | Shelf Life Not Applicable | ||
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Chip Quik Inc. |
123
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SOLDER PASTE WATER SOL 10CC
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- | Solder Paste | - | - | Syringe，10cc，35g (1.2 oz) | Sn63Pb37 (63/37) | 361°F (183°C) | Water Soluble | Leaded | 12 Months (Date of Manufacture) (Refrigerated) | ||
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Chip Quik Inc. |
503
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SOLDER PASTE NO-CLEAN 10CC SYR
|
- | Solder Paste | - | - | Syringe，10cc，35g (1.2 oz) | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 423 ~ 428°F (217 ~ 220°C) | No-Clean | Lead Free | 6 Months (Date of Manufacture) (Refrigerated) | ||
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Chip Quik Inc. |
130
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SOLDER PASTE WATER SOL LF 10CC
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- | Solder Paste | - | - | Syringe，10cc，35g (1.2 oz) | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 423 ~ 428°F (217 ~ 220°C) | Water Soluble | Lead Free | 6 Months (Date of Manufacture) (Refrigerated) | ||
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Chip Quik Inc. |
106
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SOLDER PASTE NO CLEAN T5 10CC
|
- | Solder Paste | - | - | Syringe，10cc，35g (1.2 oz) | Sn63Pb37 (63/37) | 361°F (183°C) | No-Clean | Leaded | 12 Months (Date of Manufacture) (Refrigerated) | ||
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Multicore |
107
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
63/37 400 1% .032DIA 20AWG
|
C400 | Wire Solder | 20 AWG，21 SWG | 0.032" (0.81mm) | Spool，454g (1 lb) | Sn63Pb37 (63/37) | 361°F (183°C) | No-Clean | Leaded | Shelf Life Not Applicable | ||
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Multicore |
127
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
63/37 CRYSL 502 2% .032DIA 20AWG
|
C502 | Wire Solder | 20 AWG，21 SWG | 0.032" (0.81mm) | Spool，454g (1 lb) | Sn63Pb37 (63/37) | 361°F (183°C) | No-Clean | Leaded | Shelf Life Not Applicable | ||
|
|
|
Chip Quik Inc. |
243
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SOLDER PASTE LOW TEMP LF T5 10CC
|
- | Solder Paste | - | - | Syringe，10cc，35g (1.2 oz) | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | 281°F (138°C) | No-Clean | Lead Free | 6 Months (Date of Manufacture) (Refrigerated) | ||
|
|
|
Multicore |
206
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
60/40 370 3% .032DIA 20AWG
|
370 | Wire Solder | 20 AWG，21 SWG | 0.032" (0.81mm) | Spool，454g (1 lb) | Sn60Pb40 (60/40) | 361 ~ 374°F (183 ~ 190°C) | Rosin Activated (RA) | Leaded | Shelf Life Not Applicable |
