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Discover 301 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Form | Composition | Melting Point | Flux Type | Process | Shelf Life | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Form | Composition | Melting Point | Flux Type | Process | Shelf Life | |
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Chip Quik Inc. |
594
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SLDR PASTE NO-CLN SN63/PB37 50G
|
- | Solder Paste | Jar，50g (1.8 oz) | Sn63Pb37 (63/37) | 361°F (183°C) | No-Clean | Leaded | 12 Months (Date of Manufacture) (Refrigerated) | ||
|
|
|
Chip Quik Inc. |
1,002
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SOLDER PASTE NO-CLEAN 63/37 5CC
|
- | Solder Paste | Syringe，5cc，15g (0.5 oz) | Sn63Pb37 (63/37) | 361°F (183°C) | No-Clean | Leaded | 12 Months (Date of Manufacture) (Refrigerated) | ||
|
|
|
Chip Quik Inc. |
914
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SOLDER PASTE LOW TEMP 5CC W/TIP
|
- | Solder Paste | Syringe，15g (0.5 oz) | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | 281°F (138°C) | No-Clean | Lead Free | 6 Months (Date of Manufacture) (Refrigerated) | ||
|
|
|
Chip Quik Inc. |
322
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SOLDER PASTE NO-CLEAN LF 5CC SYR
|
- | Solder Paste | Syringe，15g (0.5 oz) | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 423 ~ 428°F (217 ~ 220°C) | No-Clean | Lead Free | 6 Months (Date of Manufacture) (Refrigerated) | ||
|
|
|
Chip Quik Inc. |
441
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SLDR PASTE NO-CLN SAC305 50G
|
- | Solder Paste | Jar，50g (1.8 oz) | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 423 ~ 428°F (217 ~ 220°C) | No-Clean | Lead Free | 6 Months (Date of Manufacture) (Refrigerated) | ||
|
|
|
Chip Quik Inc. |
713
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SOLDER PASTE NO-CLEAN 63/37 10CC
|
- | Solder Paste | Syringe，10cc，35g (1.2 oz) | Sn63Pb37 (63/37) | 361°F (183°C) | No-Clean | Leaded | 12 Months (Date of Manufacture) (Refrigerated) | ||
|
|
|
Chip Quik Inc. |
165
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SLDR PASTE NO-CLN SN42/BI58 50G
|
- | Solder Paste | Jar，50g (1.8 oz) | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | 281°F (138°C) | No-Clean | Lead Free | 6 Months (Date of Manufacture) (Refrigerated) | ||
|
|
|
Chip Quik Inc. |
356
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SOLDER PASTE LOW TEMP 10CC W/TIP
|
- | Solder Paste | Syringe，10cc，35g (1.2 oz) | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | 281°F (138°C) | No-Clean | Lead Free | 6 Months (Date of Manufacture) (Refrigerated) | ||
|
|
|
Chip Quik Inc. |
123
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SOLDER PASTE WATER SOL 10CC
|
- | Solder Paste | Syringe，10cc，35g (1.2 oz) | Sn63Pb37 (63/37) | 361°F (183°C) | Water Soluble | Leaded | 12 Months (Date of Manufacture) (Refrigerated) | ||
|
|
|
Chip Quik Inc. |
503
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SOLDER PASTE NO-CLEAN 10CC SYR
|
- | Solder Paste | Syringe，10cc，35g (1.2 oz) | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 423 ~ 428°F (217 ~ 220°C) | No-Clean | Lead Free | 6 Months (Date of Manufacture) (Refrigerated) | ||
|
|
|
Chip Quik Inc. |
130
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SOLDER PASTE WATER SOL LF 10CC
|
- | Solder Paste | Syringe，10cc，35g (1.2 oz) | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 423 ~ 428°F (217 ~ 220°C) | Water Soluble | Lead Free | 6 Months (Date of Manufacture) (Refrigerated) | ||
|
|
|
Chip Quik Inc. |
106
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SOLDER PASTE NO CLEAN T5 10CC
|
- | Solder Paste | Syringe，10cc，35g (1.2 oz) | Sn63Pb37 (63/37) | 361°F (183°C) | No-Clean | Leaded | 12 Months (Date of Manufacture) (Refrigerated) | ||
|
|
|
Chip Quik Inc. |
243
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SOLDER PASTE LOW TEMP LF T5 10CC
|
- | Solder Paste | Syringe，10cc，35g (1.2 oz) | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | 281°F (138°C) | No-Clean | Lead Free | 6 Months (Date of Manufacture) (Refrigerated) | ||
|
|
|
Chip Quik Inc. |
123
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SOLDER PASTE LF T5 10CC
|
- | Solder Paste | Syringe，10cc，35g (1.2 oz) | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 423 ~ 428°F (217 ~ 220°C) | No-Clean | Lead Free | 6 Months (Date of Manufacture) (Refrigerated) | ||
|
|
|
Chip Quik Inc. |
272
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SOLDER PASTE SN63/PB37 250G
|
- | Solder Paste | Jar，250g (9 oz) | Sn63Pb37 (63/37) | 361°F (183°C) | No-Clean | Leaded | 12 Months (Date of Manufacture) (Refrigerated) | ||
|
|
|
Chip Quik Inc. |
355
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SOLDER PASTE SAC305 250G T3
|
- | Solder Paste | Jar，250g (9 oz) | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 423 ~ 428°F (217 ~ 220°C) | No-Clean | Lead Free | 6 Months (Date of Manufacture) (Refrigerated) | ||
|
|
|
Chip Quik Inc. |
39
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SOLDER PASTE SN63/PB37 250G T5
|
- | Solder Paste | Jar，250g (9 oz) | Sn63Pb37 (63/37) | 361°F (183°C) | No-Clean | Leaded | 12 Months (Date of Manufacture) (Refrigerated) | ||
|
|
|
Chip Quik Inc. |
92
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SOLDER PASTE SAC305 250G T5
|
- | Solder Paste | Jar，250g (9 oz) | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 423 ~ 428°F (217 ~ 220°C) | No-Clean | Lead Free | 6 Months (Date of Manufacture) (Refrigerated) | ||
|
|
|
Multicore |
208
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
99C BAR SOLDER 2LB +/- 0.2LB
|
- | Bar Solder | Bar，907g (2 lb) | Sn99.3Cu0.7 (99.3/0.7) | 440 ~ 464°F (227 ~ 240°C) | - | Lead Free | Shelf Life Not Applicable | ||
|
|
|
Chip Quik Inc. |
75
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SOLDER PASTE WATER SOL T5 10CC
|
- | Solder Paste | Syringe，10cc，35g (1.2 oz) | Sn63Pb37 (63/37) | 361°F (183°C) | Water Soluble | Leaded | 12 Months (Date of Manufacture) (Refrigerated) |
