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Discover 86 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Diameter | Form | Composition | Melting Point | Flux Type | Process | Shelf Life | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Diameter | Form | Composition | Melting Point | Flux Type | Process | Shelf Life | |
|
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Chip Quik Inc. |
315
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SLD WIRE NO-CLEAN 96.5/3/.5 4OZ.
|
- | 0.020" (0.51mm) | Spool，113g (1/4 lb) | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 423 ~ 428°F (217 ~ 220°C) | No-Clean | Lead Free | Shelf Life Not Applicable | ||
|
|
|
Chip Quik Inc. |
143
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SLD WIRE NO-CLEAN 96.5/3/.5 1OZ.
|
- | 0.020" (0.51mm) | Spool，28g (1 oz) | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 423 ~ 428°F (217 ~ 220°C) | No-Clean | Lead Free | Shelf Life Not Applicable | ||
|
|
|
Chip Quik Inc. |
135
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SOLDER WIRE NO-CLEAN 63/37 4OZ.
|
- | 0.020" (0.51mm) | Spool，113g (1/4 lb) | Sn63Pb37 (63/37) | 361°F (183°C) | No-Clean，Water Soluble | Leaded | Shelf Life Not Applicable | ||
|
|
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Chip Quik Inc. |
61
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SOLDER WIRE NO-CLEAN 63/37 1OZ.
|
- | 0.020" (0.51mm) | Spool，28g (1 oz) | Sn63Pb37 (63/37) | 361°F (183°C) | No-Clean，Water Soluble | Leaded | Shelf Life Not Applicable | ||
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|
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Chip Quik Inc. |
59
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SOLDER WIRE NO-CLEAN 63/37 2OZ.
|
- | 0.020" (0.51mm) | Spool，57g (2 oz) | Sn63Pb37 (63/37) | 361°F (183°C) | No-Clean，Water Soluble | Leaded | Shelf Life Not Applicable | ||
|
|
|
Chip Quik Inc. |
81
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SLD WIRE NO-CLEAN 96.5/3/.5 2OZ.
|
- | 0.020" (0.51mm) | Spool，57g (2 oz) | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 423 ~ 428°F (217 ~ 220°C) | No-Clean | Lead Free | Shelf Life Not Applicable | ||
|
|
|
MG Chemicals |
62
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SOLDER LF SN100E RA FLUX
|
4944 | 0.020" (0.51mm) | Spool，4 oz (113.4 g) | Sn99.5Cu0.5 (99.5/0.5) | 442°F (228°C) | Rosin Activated (RA) | Lead Free | 5 Years (Date of Manufacture) | ||
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|
|
MG Chemicals |
50
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SOLDER LF SN100E NO CLEAN
|
4933 | 0.020" (0.51mm) | Spool，4 oz (113.4 g) | Sn99.5Cu0.5 (99.5/0.5) | 442°F (228°C) | No-Clean | Lead Free | 5 Years (Date of Manufacture) | ||
|
|
|
Chip Quik Inc. |
18
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
LF SOLDER WIRE 99.3/0.7 TIN/COPP
|
SMD2 | 0.020" (0.51mm) | Spool，8 oz (226.8 g) | Sn99.3Cu0.7 (99.3/0.7) | 441°F (227°C) | No-Clean，Water Soluble | Lead Free | Shelf Life Not Applicable | ||
|
|
|
Chip Quik Inc. |
19
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SOLDER WIRE 62/36/2 TIN/LEAD/SIL
|
SMD3 | 0.020" (0.51mm) | Spool，8 oz (226.8 g) | Sn62Pb36Ag2 (62/36/2) | 354°F (179°C) | No-Clean，Water Soluble | Leaded | Shelf Life Not Applicable | ||
|
|
|
Chip Quik Inc. |
27
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
LF SOLDER WIRE 96.5/3/0.5 TIN/SI
|
- | 0.020" (0.51mm) | Spool，8 oz (226.8 g) | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 423 ~ 428°F (217 ~ 220°C) | No-Clean，Water Soluble | Lead Free | Shelf Life Not Applicable | ||
|
|
|
Chip Quik Inc. |
25
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SOLDER WIRE 60/40 TIN/LEAD NO-CL
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SMD2 | 0.020" (0.51mm) | Spool，1 lb (454 g) | Sn60Pb40 (60/40) | 361 ~ 370°F (183 ~ 188°C) | No-Clean，Water Soluble | Leaded | Shelf Life Not Applicable | ||
|
|
|
Chip Quik Inc. |
16
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SOLDER WIRE 63/37 TIN/LEAD NO-CL
|
- | 0.020" (0.51mm) | Spool，1 lb (454 g) | Sn63Pb37 (63/37) | 361°F (183°C) | No-Clean，Water Soluble | Leaded | Shelf Life Not Applicable | ||
|
|
|
Chip Quik Inc. |
19
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
LF SOLDER WIRE 99.3/0.7 TIN/COPP
|
SMD2 | 0.020" (0.51mm) | Spool，1 lb (454 g) | Sn99.3Cu0.7 (99.3/0.7) | 441°F (227°C) | No-Clean，Water Soluble | Lead Free | Shelf Life Not Applicable | ||
|
|
|
MG Chemicals |
25
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SOLDER LF SAC305 NO CLEAN
|
4912 | 0.020" (0.51mm) | Spool，8 oz (226.8 g) | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 423 ~ 430°F (217 ~ 221°C) | No-Clean | Lead Free | Shelf Life Not Applicable | ||
|
|
|
Chip Quik Inc. |
17
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SOLDER WIRE 62/36/2 TIN/LEAD/SIL
|
SMD3 | 0.020" (0.51mm) | Spool，1 lb (454 g) | Sn62Pb36Ag2 (62/36/2) | 354°F (179°C) | No-Clean，Water Soluble | Leaded | Shelf Life Not Applicable | ||
|
|
|
Chip Quik Inc. |
20
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
LF SOLDER WIRE 96.5/3/0.5 TIN/SI
|
- | 0.020" (0.51mm) | Spool，1 lb (454 g) | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 423 ~ 428°F (217 ~ 220°C) | No-Clean，Water Soluble | Lead Free | Shelf Life Not Applicable | ||
|
|
|
Chip Quik Inc. |
15
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SOLDER WIRE 60/40 TIN/LEAD NO-CL
|
SMD2 | 0.020" (0.51mm) | Spool，8 oz (226.8 g) | Sn60Pb40 (60/40) | 361 ~ 370°F (183 ~ 188°C) | No-Clean，Water Soluble | Leaded | Shelf Life Not Applicable | ||
|
|
|
Chip Quik Inc. |
8
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SOLDER WIRE 63/37 TIN/LEAD NO-CL
|
- | 0.020" (0.51mm) | Spool，8 oz (226.8 g) | Sn63Pb37 (63/37) | 361°F (183°C) | No-Clean，Water Soluble | Leaded | Shelf Life Not Applicable | ||
|
|
|
MG Chemicals |
5
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SOLDER LF SN100E NO CLEAN
|
4933 | 0.020" (0.51mm) | Spool，16 oz (453.59 g) | Sn99.5Cu0.5 (99.5/0.5) | 442°F (228°C) | No-Clean | Lead Free | 5 Years (Date of Manufacture) |
