- Manufacturer：
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- Composition：
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- Melting Point：
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- Process：
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Discover 6 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Composition | Melting Point | Process | Shelf Life | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Composition | Melting Point | Process | Shelf Life | |
|
|
|
Chip Quik Inc. |
914
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SOLDER PASTE LOW TEMP 5CC W/TIP
|
- | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | 281°F (138°C) | Lead Free | 6 Months (Date of Manufacture) (Refrigerated) | ||
|
|
|
Chip Quik Inc. |
322
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SOLDER PASTE NO-CLEAN LF 5CC SYR
|
- | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 423 ~ 428°F (217 ~ 220°C) | Lead Free | 6 Months (Date of Manufacture) (Refrigerated) | ||
|
|
|
Chip Quik Inc. |
85
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
THERMALLY STABLE SOLDER PASTE NO
|
- | Sn63Pb37 (63/37) | 361°F (183°C) | Leaded | 12 Months (Date of Manufacture) | ||
|
|
|
Chip Quik Inc. |
184
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
THERMALLY STABLE SOLDER PASTE NO
|
- | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | 281°F (138°C) | Lead Free | 12 Months (Date of Manufacture) | ||
|
|
|
Chip Quik Inc. |
83
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
THERMALLY STABLE SOLDER PASTE NO
|
- | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 423 ~ 428°F (217 ~ 220°C) | Lead Free | 12 Months (Date of Manufacture) | ||
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|
|
MG Chemicals |
27
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
LEAD FREE LOW TEMPERATURE SOLDER
|
4902 | Bi57Sn42Ag1 (57/42/1) | 281°F (138°C) | Lead Free | 6 Months (Date of Manufacture) (Refrigerated) |
