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Discover 14 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Composition | Melting Point | Flux Type | Process | Shelf Life | ||
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Composition | Melting Point | Flux Type | Process | Shelf Life | ||
LOCTITE |
14
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
LOCTITE GC 10 SAC305T3 885 52U
|
LOCTITE GC 10 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 423°F (217°C) | No-Clean | Lead Free | 12 Months (Date of Manufacture) | ||||
LOCTITE |
7
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
LOCTITE GC 3W SAC305T3 895V 52U
|
LOCTITE GC 3W | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 423°F (217°C) | Water Soluble | Lead Free | 6 Months (Date of Manufacture) | ||||
LOCTITE |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
LOCTITE GC 10 SAC305T4 885 52U
|
LOCTITE GC 10 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 423°F (217°C) | No-Clean | Lead Free | 12 Months (Date of Manufacture) | ||||
MG Chemicals |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
LEADED SOLDER PASTE,SN63/PB37,
|
4860 | Sn63Pb37 (63/37) | 361°F (183°C) | No-Clean | Leaded | 24 Months (Date of Manufacture) (Refrigerated) | ||||
Chip Quik Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
SOLDER PASTE SAC305 500G
|
- | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 423 ~ 428°F (217 ~ 220°C) | No-Clean | Lead Free | 6 Months (Date of Manufacture) (Refrigerated) | ||||
Chip Quik Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
SOLDER PASTE SN42/BI58 500G
|
- | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | 281°F (138°C) | No-Clean | Lead Free | 6 Months (Date of Manufacture) (Refrigerated) | ||||
Chip Quik Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
SOLDER PASTE SN63/PB37 500G T5
|
- | Sn63Pb37 (63/37) | 361°F (183°C) | No-Clean | Leaded | 12 Months (Date of Manufacture) (Refrigerated) | ||||
Chip Quik Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
SOLDER PASTE SAC305 500G T5
|
- | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 423 ~ 428°F (217 ~ 220°C) | No-Clean | Lead Free | 6 Months (Date of Manufacture) (Refrigerated) | ||||
Kester Solder |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
SOLDERPASTE NO CLEAN 63/37 500GM
|
Profile,256 | Sn63Pb37 (63/37) | 361°F (183°C) | No-Clean | Leaded | 6 Months (Date of Manufacture) (Refrigerated) | ||||
Kester Solder |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
SOLDER 500G JAR,SN63/PB37
|
HydroMark,531 | Sn63Pb37 (63/37) | 361°F (183°C) | Water Soluble | Leaded | 6 Months (Date of Manufacture) (Refrigerated) | ||||
Kester Solder |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
SOLDERPASTE WATER SOLUABLE 500GM
|
R560 | Sn63Pb37 (63/37) | 361°F (183°C) | Water Soluble | Leaded | 6 Months (Date of Manufacture) (Refrigerated) | ||||
Kester Solder |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
R562 SOLDERPASTE WATER SOL 500G
|
R562 | Sn63Pb37 (63/37) | 361°F (183°C) | Water Soluble | Leaded | 6 Months (Date of Manufacture) (Refrigerated) | ||||
Kester Solder |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
SOLDER 500G JAR,SN96.5 AG3.0
|
R520A | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 423 ~ 424°F (217 ~ 218°C) | Water Soluble | Lead Free | 4 Months (Date of Manufacture) (Refrigerated) | ||||
Kester Solder |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
SOLDER 500G JAR,SN96.5 AG3.0
|
- | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 423 ~ 424°F (217 ~ 218°C) | - | Lead Free | - |