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Discover 14 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Wire Gauge | Diameter | Composition | Melting Point | Flux Type | Process | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Wire Gauge | Diameter | Composition | Melting Point | Flux Type | Process | |
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Chip Quik Inc. |
43
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
LF SOLDER WIRE 99.3/0.7 TIN/COPP
|
SMD2 | 27 AWG，28 SWG | 0.015" (0.38mm) | Sn99.3Cu0.7 (99.3/0.7) | 441°F (227°C) | No-Clean，Water Soluble | Lead Free | ||
|
|
|
Chip Quik Inc. |
24
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
LF SOLDER WIRE 96.5/3/0.5 TIN/SI
|
- | 27 AWG，28 SWG | 0.015" (0.38mm) | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 423 ~ 428°F (217 ~ 220°C) | No-Clean，Water Soluble | Lead Free | ||
|
|
|
Chip Quik Inc. |
25
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
LF SOLDER WIRE 99.3/0.7 TIN/COPP
|
SMD2 | 20 AWG，22 SWG | 0.031" (0.79mm) | Sn99.3Cu0.7 (99.3/0.7) | 441°F (227°C) | No-Clean，Water Soluble | Lead Free | ||
|
|
|
Chip Quik Inc. |
18
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
LF SOLDER WIRE 99.3/0.7 TIN/COPP
|
SMD2 | 24 AWG，25 SWG | 0.020" (0.51mm) | Sn99.3Cu0.7 (99.3/0.7) | 441°F (227°C) | No-Clean，Water Soluble | Lead Free | ||
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|
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Chip Quik Inc. |
9
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SOLDER WIRE 62/36/2 TIN/LEAD/SIL
|
SMD3 | 20 AWG，22 SWG | 0.031" (0.79mm) | Sn62Pb36Ag2 (62/36/2) | 354°F (179°C) | No-Clean，Water Soluble | Leaded | ||
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|
|
Chip Quik Inc. |
19
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SOLDER WIRE 62/36/2 TIN/LEAD/SIL
|
SMD3 | 24 AWG，25 SWG | 0.020" (0.51mm) | Sn62Pb36Ag2 (62/36/2) | 354°F (179°C) | No-Clean，Water Soluble | Leaded | ||
|
|
|
Chip Quik Inc. |
22
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
LF SOLDER WIRE 96.5/3/0.5 TIN/SI
|
- | 20 AWG，22 SWG | 0.031" (0.79mm) | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 423 ~ 428°F (217 ~ 220°C) | No-Clean，Water Soluble | Lead Free | ||
|
|
|
Chip Quik Inc. |
27
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
LF SOLDER WIRE 96.5/3/0.5 TIN/SI
|
- | 24 AWG，25 SWG | 0.020" (0.51mm) | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 423 ~ 428°F (217 ~ 220°C) | No-Clean，Water Soluble | Lead Free | ||
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|
|
MG Chemicals |
25
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SOLDER LF SAC305 NO CLEAN
|
4912 | 24 AWG，25 SWG | 0.020" (0.51mm) | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 423 ~ 430°F (217 ~ 221°C) | No-Clean | Lead Free | ||
|
|
|
MG Chemicals |
9
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SOLDER LF SAC305 NO CLEAN
|
4917 | 14 AWG，16 SWG | 0.062" (1.57mm) | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 423 ~ 430°F (217 ~ 221°C) | No-Clean | Lead Free | ||
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|
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Chip Quik Inc. |
23
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SOLDER WIRE 60/40 TIN/LEAD NO-CL
|
SMD2 | 20 AWG，22 SWG | 0.031" (0.79mm) | Sn60Pb40 (60/40) | 361 ~ 370°F (183 ~ 188°C) | No-Clean，Water Soluble | Leaded | ||
|
|
|
Chip Quik Inc. |
15
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SOLDER WIRE 60/40 TIN/LEAD NO-CL
|
SMD2 | 24 AWG，25 SWG | 0.020" (0.51mm) | Sn60Pb40 (60/40) | 361 ~ 370°F (183 ~ 188°C) | No-Clean，Water Soluble | Leaded | ||
|
|
|
Chip Quik Inc. |
9
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SOLDER WIRE 63/37 TIN/LEAD NO-CL
|
- | 20 AWG，22 SWG | 0.031" (0.79mm) | Sn63Pb37 (63/37) | 361°F (183°C) | No-Clean，Water Soluble | Leaded | ||
|
|
|
Chip Quik Inc. |
8
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SOLDER WIRE 63/37 TIN/LEAD NO-CL
|
- | 24 AWG，25 SWG | 0.020" (0.51mm) | Sn63Pb37 (63/37) | 361°F (183°C) | No-Clean，Water Soluble | Leaded |
