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Discover 255 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Security Features | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Security Features | |
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NXP USA Inc. |
39
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MPU MPC83XX 266MHZ 516BGA
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Tray | MPC83XX | 0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC e300c2 | 1.8V，2.5V，3.3V | 1 Core，32-Bit | Communications; QUICC Engine | DDR，DDR2 | No | - | 10/100 Mbps (3) | - | USB 2.0 (1) | - | ||
|
|
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NXP USA Inc. |
40
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
Tray | MPC82xx | -40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | 1 Core，32-Bit | Communications; RISC CPM | DRAM，SDRAM | No | - | 10/100 Mbps (2) | - | USB 2.0 (1) | - | ||
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|
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NXP USA Inc. |
39
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
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Tray | MPC82xx | 0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | 1 Core，32-Bit | Communications; RISC CPM，Security; SEC | DRAM，SDRAM | No | - | 10/100 Mbps (2) | - | USB 2.0 (1) | Cryptography，Random Number Generator | ||
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NXP USA Inc. |
36
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MPU MPC83XX 266MHZ 620BGA
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Tray | MPC83XX | -40°C ~ 105°C (TA) | 620-BBGA Exposed Pad | 620-PBGA (29x29) | PowerPC e300 | 2.5V，3.3V | 1 Core，32-Bit | - | DDR | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (2) | - | ||
|
|
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NXP USA Inc. |
57
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | 1 Core，32-Bit | Communications; RISC CPM | DRAM，SDRAM | No | - | 10/100 Mbps (2) | - | USB 2.0 (1) | - | ||
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NXP USA Inc. |
58
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 480TBGA
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Tray | MPC82xx | -40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | 3.3V | 1 Core，32-Bit | Communications; RISC CPM | DRAM，SDRAM | No | - | 10/100 Mbps (3) | - | - | - | ||
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NXP USA Inc. |
19
|
3 days |
-
|
MOQ: 1 MPQ: 1
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IC MPU MPC82XX 266MHZ 480TBGA
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Tray | MPC82xx | -40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | 3.3V | 1 Core，32-Bit | Communications; RISC CPM | DRAM，SDRAM | No | - | 10/100 Mbps (3) | - | - | - | ||
|
|
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NXP USA Inc. |
84
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 266MHZ 473MAPBGA
|
Tray | MPC83XX | -40°C ~ 105°C (TA) | 473-LFBGA | 473-MAPBGA (19x19) | PowerPC e300c3 | 1.8V，2.5V，3.3V | 1 Core，32-Bit | - | DDR2 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 (1) | - | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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IC MPU MPC83XX 266MHZ 516BGA
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Tray | MPC83XX | 0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC e300c2 | 1.8V，2.5V，3.3V | 1 Core，32-Bit | Communications; QUICC Engine，Security; SEC 2.2 | DDR，DDR2 | No | - | 10/100 Mbps (3) | - | USB 2.0 (1) | Cryptography | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 450 MPQ: 1
|
IC MPU I.MX21 266MHZ 289MAPBGA
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Tray | i.MX21 | 0°C ~ 70°C (TA) | 289-LFBGA | - | ARM926EJ-S | 1.8V，3.0V | 1 Core，32-Bit | - | SDRAM | No | Keypad，LCD | - | - | USB 1.x (2) | - | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 420 MPQ: 1
|
IC MPU MPC83XX 266MHZ 369BGA
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Tray | MPC83XX | 0°C ~ 105°C (TA) | 369-LFBGA | 369-PBGA (19x19) | PowerPC e300c3 | 1.8V，3.3V | 1 Core，32-Bit | Communications; QUICC Engine | DDR2 | No | - | 10/100 Mbps (3) | - | USB 2.0 (1) | - | ||
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|
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 420 MPQ: 1
|
IC MPU MPC83XX 266MHZ 489BGA
|
Tray | MPC83XX | 0°C ~ 105°C (TA) | 489-LFBGA | 489-PBGA (19x19) | PowerPC e300c3 | 1.8V，3.3V | 1 Core，32-Bit | Communications; QUICC Engine | DDR2 | No | - | 10/100 Mbps (3) | - | USB 2.0 (1) | - | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 1000 MPQ: 1
|
IC MPU I.MX21 266MHZ 289MAPBGA
|
Tape & Reel (TR) | i.MX21 | 0°C ~ 70°C (TA) | 289-LFBGA | - | ARM926EJ-S | 1.8V，3.0V | 1 Core，32-Bit | - | SDRAM | No | Keypad，LCD | - | - | USB 1.x (2) | - | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 450 MPQ: 1
|
IC MPU I.MX21 266MHZ 289MAPBGA
|
Tray | i.MX21 | -40°C ~ 85°C (TA) | 289-LFBGA | - | ARM926EJ-S | 1.8V，3.0V | 1 Core，32-Bit | - | SDRAM | No | Keypad，LCD | - | - | USB 1.x (2) | - | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 450 MPQ: 1
|
IC MPU I.MX21 266MHZ 289MAPBGA
|
Tray | i.MX21 | 0°C ~ 70°C (TA) | 289-LFBGA | - | ARM926EJ-S | 1.8V，3.0V | 1 Core，32-Bit | - | SDRAM | No | Keypad，LCD | - | - | USB 1.x (2) | - | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 450 MPQ: 1
|
IC MPU I.MX21 266MHZ 289MAPBGA
|
Tray | i.MX21 | -30°C ~ 70°C (TA) | 289-LFBGA | - | ARM926EJ-S | 1.8V，3.0V | 1 Core，32-Bit | - | SDRAM | No | Keypad，LCD | - | - | USB 1.x (2) | - | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 84 MPQ: 1
|
IC MPU MPC83XX 266MHZ 473MAPBGA
|
Tray | MPC83XX | 0°C ~ 105°C (TA) | 473-LFBGA | 473-MAPBGA (19x19) | PowerPC e300c3 | 1.8V，2.5V，3.3V | 1 Core，32-Bit | - | DDR2 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 152 MPQ: 1
|
IC MPU I.MX21 266MHZ 289MAPBGA
|
Tray | i.MX21 | 0°C ~ 70°C (TA) | 289-LFBGA | - | ARM926EJ-S | 1.8V，3.0V | 1 Core，32-Bit | - | SDRAM | No | Keypad，LCD | - | - | USB 1.x (2) | - | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC MPU I.MX21 266MHZ 289MAPBGA
|
Tape & Reel (TR) | i.MX21 | -40°C ~ 85°C (TA) | 289-LFBGA | - | ARM926EJ-S | 1.8V，3.0V | 1 Core，32-Bit | - | SDRAM | No | Keypad，LCD | - | - | USB 1.x (2) | - | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC MCU 32BIT ROMLESS 176LQFP
|
Tray | Vybrid，VF3xx | -40°C ~ 85°C (TA) | 176-LQFP Exposed Pad | 176-LQFP-EP (24x24) | ARM® Cortex®-A5 | 3.3V | 1 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，DDR3，DRAM | Yes | DCU，GPU，LCD，VideoADC，VIU | 10/100 Mbps (2) | - | USB 2.0 OTG + PHY (1) | - |
