- Length:
-
- Width:
-
- Attachment Method:
-
- Package Cooled:
-
- Height Off Base (Height of Fin):
-
- Power Dissipation @ Temperature Rise:
-
- Material Finish:
-
Discover 6 products
![]() |
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Material Finish | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() |
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Material Finish | |
![]() |
![]() |
Wakefield-Vette |
2,632
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 40.6MM SQ H=.525"
|
655 | Square, Pin Fins | 1.600" (40.64mm) | 1.600" (40.64mm) | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.522" (13.27mm) | 4.0W @ 40°C | Black Anodized | ||
![]() |
![]() |
Wakefield-Vette |
4,378
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 43MM SQ BLK H=.65"
|
628 | Square, Pin Fins | 1.750" (44.45mm) | 1.700" (43.18mm) | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.650" (16.51mm) | 3.0W @ 20°C | Black Anodized | ||
![]() |
![]() |
Ohmite |
137
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FOR TO-247 TO-264 BLK
|
M | Rectangular, Fins | 2.170" (55.12mm) | 1.350" (34.30mm) | Clip and PC Pin | TO-247, TO-264 | 1.520" (38.61mm) | 16.0W @ 43°C | Black Anodized | ||
![]() |
![]() |
Ohmite |
159
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FOR TO-247 TO-264
|
M | Rectangular, Fins | 2.170" (55.12mm) | 1.350" (34.30mm) | Clip and PC Pin | TO-247, TO-264 | 1.520" (38.61mm) | 16.0W @ 43°C | Degreased | ||
![]() |
![]() |
Aavid, Thermal Division of Boyd Corporation |
7
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
66365 EXTRUSION 0.63X1.5"X4
|
- | Rectangular, Pin Fins | 48.000" (1219.20mm) | 1.500" (38.10mm) | Adhesive | - | 0.630" (16.00mm) | - | - | ||
![]() |
![]() |
Wakefield-Vette |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 43MM SQ BLK H=.65"
|
628 | Square, Pin Fins | 1.750" (44.45mm) | 1.700" (43.18mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.650" (16.51mm) | 3.0W @ 20°C | Black Anodized |