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- Thermal Resistance @ Natural：
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Discover 33 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Aavid, Thermal Division of Boyd Corporation |
12,250
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK D2PAK .4" HIGH SMD
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- | Copper | Rectangular, Fins | 0.500" (12.70mm) | 1.030" (26.16mm) | - | SMD Pad | TO-263 (D2Pak) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
12,300
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK D2PAK .4" HIGH SMD
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- | Copper | Rectangular, Fins | 0.500" (12.70mm) | 1.030" (26.16mm) | - | SMD Pad | TO-263 (D2Pak) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
12,300
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK D2PAK .4" HIGH SMD
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- | Copper | Rectangular, Fins | 0.500" (12.70mm) | 1.030" (26.16mm) | - | SMD Pad | TO-263 (D2Pak) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
16,283
|
3 days |
-
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MOQ: 1 MPQ: 1
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TOP MOUNT HEATSINK .4" D2PAK
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- | Copper | Rectangular, Fins | 0.500" (12.70mm) | 1.030" (26.16mm) | - | SMD Pad | TO-263 (D2Pak) | 1.3W @ 30°C | 8.00°C/W @ 300 LFM | 18.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
9,699
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3 days |
-
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MOQ: 1 MPQ: 1
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TOP MOUNT HEATSINK .4" D-PAK
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- | Copper | Rectangular, Fins | 0.315" (8.00mm) | 0.900" (22.86mm) | - | SMD Pad | TO-252 (DPAK) | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
4,750
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK SMT D-PAK/TO-252 TIN
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- | Copper | Rectangular, Fins | 0.315" (8.00mm) | 0.900" (22.86mm) | - | SMD Pad | TO-252 (DPAK) | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
4,764
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK SMT D-PAK/TO-252 TIN
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- | Copper | Rectangular, Fins | 0.315" (8.00mm) | 0.900" (22.86mm) | - | SMD Pad | TO-252 (DPAK) | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | Tin | ||
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Ohmite |
9,471
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK FOR TO-263 BLACK
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D | Aluminum | Rectangular, Fins | 0.500" (12.70mm) | 1.020" (25.91mm) | - | Solderable Feet | TO-263 (D2Pak) | 2.0W @ 30°C | 8.00°C/W @ 500 LFM | - | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
9,436
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-5 .4" BLK
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- | Aluminum | Cylindrical | - | - | 0.315" (8.00mm) ID, 0.750" (19.05mm) OD | Press Fit | TO-5 | 0.5W @ 30°C | 15.00°C/W @ 400 LFM | 56.00°C/W | Black Anodized | ||
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Ohmite |
3,336
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK FOR TO-263
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D | Aluminum | Rectangular, Fins | 0.500" (12.70mm) | 1.020" (25.91mm) | - | Solderable Feet | TO-263 (D2Pak) | 2.0W @ 30°C | 8.00°C/W @ 500 LFM | - | Degreased | ||
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Wakefield-Vette |
4,209
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK 100PQFP COMPOSITE
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Deltem | Composite | Square, Pin Fins | 0.650" (16.51mm) | 0.650" (16.51mm) | - | Thermal Tape, Adhesive (Not Included) | BGA | 2.0W @ 40°C | 25.00°C/W @ 350 LFM | - | - | ||
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Wakefield-Vette |
900
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK 128PQFP COMPOSITE
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Deltem | Composite | Square, Pin Fins | 0.850" (21.59mm) | 0.850" (21.59mm) | - | Thermal Tape, Adhesive (Not Included) | BGA | 2.5W @ 90°C | 20.00°C/W @ 100 LFM | - | - | ||
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Ohmite |
1,763
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK FOR TO-268 BLACK
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D | Aluminum | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | - | Solderable Feet | TO-268 | 5.0W @ 35°C | 6.00°C/W @ 600 LFM | - | Black Anodized | ||
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Advanced Thermal Solutions Inc. |
938
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-252 D-PAK COPPER
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- | Copper | Rectangular, Fins | 0.315" (8.00mm) | 0.842" (21.40mm) | - | - | TO-252 (DPAK) | - | 21.00°C/W @ 200 LFM | 28.00°C/W | Tin | |||
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Wakefield-Vette |
562
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 43MM SQ BLK H=.4"
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628 | Aluminum | Square, Pin Fins | 1.750" (44.45mm) | 1.700" (43.18mm) | - | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 2.5W @ 30°C | 4.00°C/W @ 300 LFM | - | Black Anodized | ||
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Apex Microtechnology |
31
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK SMT
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Apex Precision Power | Copper | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | - | SMD Pad | SMD | - | 16.00°C/W @ 600 LFM | 50.00°C/W | Solderable | ||
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Ohmite |
5
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK FOR TO-268
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D | Aluminum | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | - | Solderable Feet | TO-268 | 5.0W @ 35°C | 6.00°C/W @ 600 LFM | - | Degreased | ||
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CUI Inc. |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK, STAMPING, TO-252, 8 X
|
- | Copper | Rectangular, Fins | 0.315" (8.00mm) | 0.900" (22.86mm) | - | - | TO-252 (DPAK) | 2.1W @ 75°C | 10.05°C/W @ 200 LFM | 35.71°C/W | Tin | ||
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Wakefield-Vette |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK ALUM BLACK SMD
|
218 | Copper | Rectangular, Fins | 0.320" (8.13mm) | 0.900" (22.86mm) | - | SMD Pad | SMD | 2.0W @ 62°C | 21.00°C/W @ 200 LFM | 31.00°C/W | Tin | ||
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Wakefield-Vette |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK ALUM NATURAL SMD
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218 | Copper | Rectangular, Fins | 0.500" (12.70mm) | 1.030" (26.16mm) | - | SMD Pad | SMD | 2.3W @ 40°C | 5.00°C/W @ 600 LFM | 31.00°C/W | Tin |
