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Discover 437 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | SATA | USB | Security Features | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | SATA | USB | Security Features | |
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Microchip Technology |
500
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3 days |
-
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MOQ: 500 MPQ: 1
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IC MCU 32BIT 160KB ROM 324LFBGA
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Tape & Reel (TR) | SAMA5D3 | -40°C ~ 85°C (TA) | 324-LFBGA | 324-LFBGA (15x15) | ARM® Cortex®-A5 | 1.2V，1.8V，3.3V | 536MHz | 1 Core，32-Bit | - | LPDDR，LPDDR2，DDR2 | No | LCD，Touchscreen | - | USB 2.0 (3) | AES，SHA，TDES，TRNG | ||
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Microchip Technology |
1,192
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 160KB ROM 324LFBGA
|
Cut Tape (CT) | SAMA5D3 | -40°C ~ 85°C (TA) | 324-LFBGA | 324-LFBGA (15x15) | ARM® Cortex®-A5 | 1.2V，1.8V，3.3V | 536MHz | 1 Core，32-Bit | - | LPDDR，LPDDR2，DDR2 | No | LCD，Touchscreen | - | USB 2.0 (3) | AES，SHA，TDES，TRNG | ||
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Microchip Technology |
1,192
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MCU 32BIT 160KB ROM 324LFBGA
|
- | SAMA5D3 | -40°C ~ 85°C (TA) | 324-LFBGA | 324-LFBGA (15x15) | ARM® Cortex®-A5 | 1.2V，1.8V，3.3V | 536MHz | 1 Core，32-Bit | - | LPDDR，LPDDR2，DDR2 | No | LCD，Touchscreen | - | USB 2.0 (3) | AES，SHA，TDES，TRNG | ||
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Microchip Technology |
813
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 160KB ROM 324LFBGA
|
Tray | SAMA5D3 | -40°C ~ 85°C (TA) | 324-LFBGA | 324-LFBGA (15x15) | ARM® Cortex®-A5 | 1.2V，1.8V，3.3V | 536MHz | 1 Core，32-Bit | - | LPDDR，LPDDR2，DDR2 | No | Touchscreen | - | USB 2.0 (3) | AES，SHA，TDES，TRNG | ||
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|
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Microchip Technology |
468
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 160KB ROM 324LFBGA
|
Tray | SAMA5D3 | -40°C ~ 85°C (TA) | 324-LFBGA | 324-LFBGA (15x15) | ARM® Cortex®-A5 | 1.2V，1.8V，3.3V | 536MHz | 1 Core，32-Bit | - | LPDDR，LPDDR2，DDR2 | No | LCD，Touchscreen | - | USB 2.0 (3) | AES，SHA，TDES，TRNG | ||
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Texas Instruments |
220
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MPU SITARA 800MHZ 684FCBGA
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Tray | Sitara | -40°C ~ 105°C (TJ) | 684-BFBGA，FCBGA | 684-FCBGA (23x23) | ARM® Cortex®-A8 | 1.8V，3.3V | 800MHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | DDR2，DDR3 | Yes | HDMI，HDVPSS | SATA 3Gbps (1) | USB 2.0 (2) | - | ||
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NXP USA Inc. |
1,129
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MPU I.MX6S 1.0GHZ 624MAPBGA
|
Tray | i.MX6S | 0°C ~ 95°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | - | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
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NXP USA Inc. |
230
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MPU I.MX6S 1.0GHZ 624MAPBGA
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Tray | i.MX6S | 0°C ~ 95°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | - | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
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NXP USA Inc. |
1,173
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MPU I.MX6S 1.0GHZ 624MAPBGA
|
Tray | i.MX6S | -20°C ~ 105°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | - | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
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NXP USA Inc. |
1,825
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6S 800MHZ 624MAPBGA
|
Tray | i.MX6S | -40°C ~ 105°C (TA) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 800MHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | - | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
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NXP USA Inc. |
446
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6S 800MHZ 624MAPBGA
|
Tray | i.MX6S | -40°C ~ 125°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 800MHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | - | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
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NXP USA Inc. |
911
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6DL 1.0GHZ 624MAPBGA
|
Tray | i.MX6DL | 0°C ~ 95°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 2 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | - | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
292
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6DL 1.0GHZ 624MAPBGA
|
Tray | i.MX6DL | -20°C ~ 105°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 2 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | - | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
499
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6DL 800MHZ 624MAPBGA
|
Tray | i.MX6DL | -40°C ~ 105°C (TA) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 800MHz | 2 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | - | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
420
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6DL 1.0GHZ 624MAPBGA
|
Tray | i.MX6DL | -40°C ~ 125°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1GHz | 2 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | - | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
936
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6D 800MHZ 624FCBGA
|
Tray | i.MX6D | -40°C ~ 105°C (TA) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 800MHz | 2 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | SATA 3Gbps (1) | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
Texas Instruments |
529
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SITARA PROCESSOR
|
Tray | Sitara | -40°C ~ 105°C (TJ) | 760-BFBGA，FCBGA | 760-FCBGA (23x23) | ARM® Cortex®-A15 | 1.8V，3.3V | 1.5GHz | 1 Core，32-Bit | Multimedia; GPU，IPU，VFP | DDR3，SRAM | Yes | HDMI | SATA 3Gbps (1) | USB 2.0 (1)，USB 3.0 (1) | - | ||
|
|
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NXP USA Inc. |
770
|
3 days |
-
|
MOQ: 1 MPQ: 1
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IC MPU I.MX6Q 1.0GHZ 624FCBGA
|
Tray | i.MX6Q | -20°C ~ 105°C (TJ) | 624-LFBGA，FCBGA | 624-FCPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 4 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | SATA 3Gbps (1) | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
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|
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NXP USA Inc. |
395
|
3 days |
-
|
MOQ: 1 MPQ: 1
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IC MPU I.MX6Q 1.0GHZ 624FCBGA
|
Tray | i.MX6Q | -20°C ~ 105°C (TJ) | 624-LFBGA，FCBGA | 624-FCPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 4 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | SATA 3Gbps (1) | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
888
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6D 1.0GHZ 624FCBGA
|
Tray | i.MX6D | -40°C ~ 125°C (TJ) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 2 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | SATA 3Gbps (1) | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection |
