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Discover 437 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | SATA | USB | Security Features | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | SATA | USB | Security Features | |
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NXP USA Inc. |
Inquiry
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MOQ: 189 MPQ: 1
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ARIK-Q POP ROM PERF ENHA
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Tray | i.MX6Q | -40°C ~ 105°C (TA) | 569-LFBGA | 569-MAPBGA (12x12) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 800MHz | 4 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | SATA 3Gbps (1) | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
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NXP USA Inc. |
Inquiry
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MOQ: 500 MPQ: 1
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I.MX6Q ROM PERF ENHAN
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Tape & Reel (TR) | i.MX6Q | -40°C ~ 125°C (TJ) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 4 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | SATA 3Gbps (1) | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
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NXP USA Inc. |
Inquiry
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MOQ: 60 MPQ: 1
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I.MX6Q ROM PERF ENHAN
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Tray | i.MX6Q | -40°C ~ 125°C (TJ) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 852MHZ | 4 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | SATA 3Gbps (1) | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 60 MPQ: 1
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I.MX6Q ROM PERF ENHAN
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Tray | i.MX6Q | -40°C ~ 125°C (TJ) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 4 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | SATA 3Gbps (1) | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 60 MPQ: 1
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I.MX 6QP ROM PERF ENHAN
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Tray | i.MX6QP | -20°C ~ 105°C (TJ) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.2GHz | 4 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，DDR3L，DDR3 | Yes | HDMI，Keypad，LCD，LVDS，MIPI/DSI，Parallel | SATA 3Gbps (1) | USB 2.0 + PHY (3)，USB 2.0 OTG + PHY (1) | ARM TZ，A-HAB，CAAM，CSU，SJC，SNVS | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 60 MPQ: 1
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I.MX 6QP ROM PERF ENHAN
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Tray | i.MX6QP | -40°C ~ 125°C (TJ) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 4 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，DDR3L，DDR3 | Yes | HDMI，Keypad，LCD，LVDS，MIPI/DSI，Parallel | SATA 3Gbps (1) | USB 2.0 + PHY (3)，USB 2.0 OTG + PHY (1) | ARM TZ，A-HAB，CAAM，CSU，SJC，SNVS | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 500 MPQ: 1
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I.MX 6 SERIES 32-BIT MPU QUAD A
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Tape & Reel (TR) | i.MX6QP | -40°C ~ 125°C (TJ) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 4 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，DDR3L，DDR3 | Yes | HDMI，Keypad，LCD，LVDS，MIPI/DSI，Parallel | SATA 3Gbps (1) | USB 2.0 + PHY (3)，USB 2.0 OTG + PHY (1) | ARM TZ，A-HAB，CAAM，CSU，SJC，SNVS | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 60 MPQ: 1
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I.MX 6QP ROM PERF ENHAN
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Tray | i.MX6QP | -40°C ~ 125°C (TJ) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 852MHZ | 4 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，DDR3L，DDR3 | Yes | HDMI，Keypad，LCD，LVDS，MIPI/DSI，Parallel | SATA 3Gbps (1) | USB 2.0 + PHY (3)，USB 2.0 OTG + PHY (1) | ARM TZ，A-HAB，CAAM，CSU，SJC，SNVS | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 60 MPQ: 1
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I.MX 6QP ROM PERF ENHAN
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Tray | i.MX6QP | -40°C ~ 125°C (TJ) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 4 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，DDR3L，DDR3 | Yes | HDMI，Keypad，LCD，LVDS，MIPI/DSI，Parallel | SATA 3Gbps (1) | USB 2.0 + PHY (3)，USB 2.0 OTG + PHY (1) | ARM TZ，A-HAB，CAAM，CSU，SJC，SNVS | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 60 MPQ: 1
|
I.MX 6QP ROM PERF ENHAN
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Tray | i.MX6QP | -40°C ~ 125°C (TJ) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 4 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，DDR3L，DDR3 | Yes | HDMI，Keypad，LCD，LVDS，MIPI/DSI，Parallel | SATA 3Gbps (1) | USB 2.0 + PHY (3)，USB 2.0 OTG + PHY (1) | ARM TZ，A-HAB，CAAM，CSU，SJC，SNVS | ||
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Microchip Technology |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 160KB ROM 324LFBGA
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Cut Tape (CT) | SAMA5D3 | -40°C ~ 105°C (TA) | 324-LFBGA | 324-LFBGA (15x15) | ARM® Cortex®-A5 | 1.2V，1.8V，3.3V | 536MHz | 1 Core，32-Bit | - | LPDDR，LPDDR2，DDR2 | No | LCD，Touchscreen | - | USB 2.0 (3) | AES，SHA，TDES，TRNG | |||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 60 MPQ: 1
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I.MX6 SOLO ROM PERFENHAN
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Tray | i.MX6S | -40°C ~ 105°C (TA) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 800MHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | - | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | |||
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NXP USA Inc. |
152
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3 days |
-
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MOQ: 1 MPQ: 1
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I.MX 7SOLO: REV 1.3
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Tray | i.MX7S | -20°C ~ 105°C (TJ) | 488-TFBGA | 488-FBGA (12x12) | ARM® Cortex®-A7，ARM® Cortex®-M4 | 1.8V，3.3V | 800MHz | 1 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，LPDDR3，DDR3，DDR3L | No | Keypad，LCD，MIPI | - | USB 2.0 + PHY (1)，USB 2.0 OTG + PHY (1) | A-HAB，ARM TZ，CAAM，CSU，SJC，SNVS | |||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 152 MPQ: 1
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I.MX 7SOLO: REV 1.3
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Tray | i.MX7S | 0°C ~ 95°C (TJ) | 488-TFBGA | 488-FBGA (12x12) | ARM® Cortex®-A7，ARM® Cortex®-M4 | 1.8V，3.3V | 800MHz | 1 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，LPDDR3，DDR3，DDR3L | No | Keypad，LCD，MIPI | - | USB 2.0 + PHY (1)，USB 2.0 OTG + PHY (1) | A-HAB，ARM TZ，CAAM，CSU，SJC，SNVS | |||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 152 MPQ: 1
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I.MX 7SOLO: REV 1.3
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Tray | i.MX7S | -20°C ~ 105°C (TJ) | 488-TFBGA | 488-FBGA (12x12) | ARM® Cortex®-A7，ARM® Cortex®-M4 | 1.8V，3.3V | 800MHz | 1 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，LPDDR3，DDR3，DDR3L | No | Keypad，LCD，MIPI | - | USB 2.0 + PHY (1)，USB 2.0 OTG + PHY (1) | A-HAB，ARM TZ，CAAM，CSU，SJC，SNVS | |||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 60 MPQ: 1
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I.MX 6DUALPLUS MPU 2X ARM CORTE
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Tray | i.MX6DP | -20°C ~ 105°C (TJ) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.2GHz | 2 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，DDR3L，DDR3 | Yes | HDMI，Keypad，LCD，LVDS，MIPI/DSI，Parallel | SATA 3Gbps (1) | USB 2.0 + PHY (3)，USB 2.0 OTG + PHY (1) | ARM TZ，A-HAB，CAAM，CSU，SJC，SNVS | |||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 60 MPQ: 1
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I.MX 6QUADPLUS MPU 4X ARM CORTE
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Tray | i.MX6QP | -20°C ~ 105°C (TJ) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.2GHz | 4 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，DDR3L，DDR3 | Yes | HDMI，Keypad，LCD，LVDS，MIPI/DSI，Parallel | SATA 3Gbps (1) | USB 2.0 + PHY (3)，USB 2.0 OTG + PHY (1) | ARM TZ，A-HAB，CAAM，CSU，SJC，SNVS |
