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Discover 1,068 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Wire Gauge | Diameter | Form | Composition | Melting Point | Flux Type | Process | Shelf Life | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Wire Gauge | Diameter | Form | Composition | Melting Point | Flux Type | Process | Shelf Life | |
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Chip Quik Inc. |
81
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SLD WIRE NO-CLEAN 96.5/3/.5 2OZ.
|
- | Wire Solder | 24 AWG，25 SWG | 0.020" (0.51mm) | Spool，57g (2 oz) | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 423 ~ 428°F (217 ~ 220°C) | No-Clean | Lead Free | Shelf Life Not Applicable | ||
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Chip Quik Inc. |
85
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
THERMALLY STABLE SOLDER PASTE NO
|
- | Solder Paste | - | - | Syringe，15g (0.5 oz) | Sn63Pb37 (63/37) | 361°F (183°C) | No-Clean | Leaded | 12 Months (Date of Manufacture) | ||
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|
|
Chip Quik Inc. |
184
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
THERMALLY STABLE SOLDER PASTE NO
|
- | Solder Paste | - | - | Syringe，15g (0.5 oz) | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | 281°F (138°C) | No-Clean | Lead Free | 12 Months (Date of Manufacture) | ||
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Chip Quik Inc. |
83
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
THERMALLY STABLE SOLDER PASTE NO
|
- | Solder Paste | - | - | Syringe，15g (0.5 oz) | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 423 ~ 428°F (217 ~ 220°C) | No-Clean | Lead Free | 12 Months (Date of Manufacture) | ||
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MG Chemicals |
62
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SOLDER LF SN100E RA FLUX
|
4944 | Wire Solder | 24 AWG，25 SWG | 0.020" (0.51mm) | Spool，4 oz (113.4 g) | Sn99.5Cu0.5 (99.5/0.5) | 442°F (228°C) | Rosin Activated (RA) | Lead Free | 5 Years (Date of Manufacture) | ||
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|
|
MG Chemicals |
34
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SOLDER LF SN100E NO CLEAN
|
4935 | Wire Solder | 20 AWG，21 SWG | 0.032" (0.81mm) | Spool，4 oz (113.4 g) | Sn99.5Cu0.5 (99.5/0.5) | 442°F (228°C) | No-Clean | Lead Free | 5 Years (Date of Manufacture) | ||
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|
|
Chip Quik Inc. |
49
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
TWO PART MIX SOLDER PASTE
|
- | Solder Paste，Two Part Mix | - | - | Jar，15g (0.5 oz) | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | 281°F (138°C) | No-Clean | Lead Free | 24 Months (Date of Manufacture) (Unmixed) | ||
|
|
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Chip Quik Inc. |
13
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SOLDER PASTE TWO PART MIX
|
- | Solder Paste，Two Part Mix | - | - | Jar，15g (0.5 oz) | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 423 ~ 428°F (217 ~ 220°C) | No-Clean | Lead Free | 24 Months (Date of Manufacture) (Unmixed) | ||
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Multicore |
70
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
63/37 HYDRO-X 2% .022DIA 23AWG
|
Hydro-X | Wire Solder | 23 AWG，24 SWG | 0.022" (0.56mm) | Spool，227g (1/2 lb) | Sn63Pb37 (63/37) | 361°F (183°C) | Water Soluble | Leaded | Shelf Life Not Applicable | ||
|
|
|
MG Chemicals |
50
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SOLDER LF SN100E NO CLEAN
|
4933 | Wire Solder | 24 AWG，25 SWG | 0.020" (0.51mm) | Spool，4 oz (113.4 g) | Sn99.5Cu0.5 (99.5/0.5) | 442°F (228°C) | No-Clean | Lead Free | 5 Years (Date of Manufacture) | ||
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|
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Chip Quik Inc. |
43
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
LF SOLDER WIRE 99.3/0.7 TIN/COPP
|
SMD2 | Wire Solder | 27 AWG，28 SWG | 0.015" (0.38mm) | Spool，8 oz (226.8 g) | Sn99.3Cu0.7 (99.3/0.7) | 441°F (227°C) | No-Clean，Water Soluble | Lead Free | Shelf Life Not Applicable | ||
|
|
|
Chip Quik Inc. |
22
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
THERMALLY STABLE SOLDER PASTE NO
|
- | Solder Paste | - | - | Jar，50g (1.8 oz) | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | 281°F (138°C) | No-Clean | Lead Free | 12 Months (Date of Manufacture) | ||
|
|
|
MG Chemicals |
90
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SOLDER LF SN99 21GAUGE .25LBS
|
4901 | Wire Solder | 20 AWG，21 SWG | 0.032" (0.81mm) | Spool，113g (1/4 lb) | Sn99.3Cu0.7 (99.3/0.7) | 442°F (227°C) | No-Clean | Lead Free | Shelf Life Not Applicable | ||
|
|
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Chip Quik Inc. |
41
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SLDR PST NO-CLEAN 63/37 T4 10CC
|
- | Solder Paste | - | - | Syringe，10cc，35g (1.2 oz) | Sn63Pb37 (63/37) | 361°F (183°C) | No-Clean | Leaded | 12 Months (Date of Manufacture) (Refrigerated) | ||
|
|
|
Chip Quik Inc. |
38
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SOLDER PASTE LOW TEMP T4 10CC
|
- | Solder Paste | - | - | Syringe，10cc，35g (1.2 oz) | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | 281°F (138°C) | No-Clean | Lead Free | 6 Months (Date of Manufacture) (Refrigerated) | ||
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|
|
Chip Quik Inc. |
19
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
THERMALLY STABLE SOLDER PASTE NO
|
- | Solder Paste | - | - | Syringe，35g (1.18 oz) | Sn63Pb37 (63/37) | 361°F (183°C) | No-Clean | Leaded | 12 Months (Date of Manufacture) | ||
|
|
|
Chip Quik Inc. |
21
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SLDR PST WATR SOL 63/37 T4 10CC
|
- | Solder Paste | - | - | Syringe，10cc，35g (1.2 oz) | Sn63Pb37 (63/37) | 361°F (183°C) | Water Soluble | Leaded | 12 Months (Date of Manufacture) (Refrigerated) | ||
|
|
|
MG Chemicals |
57
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SOLDER RA 60/40 .032" 1/2 LB
|
4890 | Wire Solder | 20 AWG，21 SWG | 0.032" (0.81mm) | Spool，227g (1/2 lb) | Sn60Pb40 (60/40) | 361 ~ 376°F (183 ~ 191°C) | Rosin Activated (RA) | Leaded | Shelf Life Not Applicable | ||
|
|
|
MG Chemicals |
43
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SOLDER RA 63/37 .025" 1/2 LBS
|
4880 | Wire Solder | 22 AWG，23 SWG | 0.025" (0.64mm) | Spool，227g (1/2 lb) | Sn63Pb37 (63/37) | 361°F (183°C) | Rosin Activated (RA) | Leaded | Shelf Life Not Applicable | ||
|
|
|
MG Chemicals |
39
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SOLDER RA 60/40 .040" 1/2 LB
|
4890 | Wire Solder | 18 AWG，19 SWG | 0.040" (1.02mm) | Spool，227g (1/2 lb) | Sn60Pb40 (60/40) | 361 ~ 376°F (183 ~ 191°C) | Rosin Activated (RA) | Leaded | Shelf Life Not Applicable |
