- Manufacturer：
-
- Series：
-
- Type：
-
- Wire Gauge：
-
- Diameter：
-
- Form：
-
- Composition：
-
- Melting Point：
-
- Flux Type：
-
- Process：
-
- Shelf Life：
-
- Selected conditions:
Discover 1,068 products
 |
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Wire Gauge | Diameter | Form | Composition | Melting Point | Flux Type | Process | Shelf Life | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Wire Gauge | Diameter | Form | Composition | Melting Point | Flux Type | Process | Shelf Life | |
|
|
|
MG Chemicals |
38
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SOLDER RA 60/40 .025" 1/2 LB
|
4890 | Wire Solder | 22 AWG，23 SWG | 0.025" (0.64mm) | Spool，227g (1/2 lb) | Sn60Pb40 (60/40) | 361 ~ 376°F (183 ~ 191°C) | Rosin Activated (RA) | Leaded | Shelf Life Not Applicable | ||
|
|
|
MG Chemicals |
29
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SOLDER NO-CLEAN 60/40 1/2 LB
|
4870 | Wire Solder | 20 AWG，21 SWG | 0.032" (0.81mm) | Spool，227g (1/2 lb) | Sn60Pb40 (60/40) | 361 ~ 376°F (183 ~ 191°C) | No-Clean | Leaded | Shelf Life Not Applicable | ||
|
|
|
MG Chemicals |
31
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SOLDER RA 63/37 .040" 1/2 LBS
|
4880 | Wire Solder | 18 AWG，19 SWG | 0.040" (1.02mm) | Spool，227g (1/2 lb) | Sn63Pb37 (63/37) | 361°F (183°C) | Rosin Activated (RA) | Leaded | Shelf Life Not Applicable | ||
|
|
|
MG Chemicals |
22
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SOLDER RA 63/37 .032" 1/2 LBS
|
4880 | Wire Solder | 20 AWG，21 SWG | 0.032" (0.81mm) | Spool，227g (1/2 lb) | Sn63Pb37 (63/37) | 361°F (183°C) | Rosin Activated (RA) | Leaded | Shelf Life Not Applicable | ||
|
|
|
MG Chemicals |
19
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SOLDER RA 60/40 .062" 1/2 LB
|
4890 | Wire Solder | 14 AWG，16 SWG | 0.062" (1.57mm) | Spool，227g (1/2 lb) | Sn60Pb40 (60/40) | 361 ~ 376°F (183 ~ 191°C) | Rosin Activated (RA) | Leaded | Shelf Life Not Applicable | ||
|
|
|
MG Chemicals |
16
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SOLDER NO-CLEAN 63/37 1/2 LB
|
4860 | Wire Solder | 20 AWG，21 SWG | 0.032" (0.81mm) | Spool，227g (1/2 lb) | Sn63Pb37 (63/37) | 361°F (183°C) | No-Clean | Leaded | Shelf Life Not Applicable | ||
|
|
|
Chip Quik Inc. |
61
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SLDR PST NO-CLEAN SAC305 T4 10CC
|
- | Solder Paste | - | - | Syringe，10cc，35g (1.2 oz) | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 423 ~ 428°F (217 ~ 220°C) | No-Clean | Lead Free | 6 Months (Date of Manufacture) (Refrigerated) | ||
|
|
|
Multicore |
52
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HMP 366 3% .050DIA 16AWG
|
366 | Wire Solder | 16 AWG，18 SWG | 0.050" (1.27mm) | Spool，454g (1 lb) | Pb93.5Sn5Ag1.5 (93.5/5/1.5) | 565 ~ 574°F (296 ~ 301°C) | Rosin Activated (RA) | Leaded | Shelf Life Not Applicable | ||
|
|
|
Chip Quik Inc. |
2
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SLDR PST WATR SOL SAC305 T4 10CC
|
- | Solder Paste | - | - | Syringe，10cc，35g (1.2 oz) | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 423 ~ 428°F (217 ~ 220°C) | Water Soluble | Lead Free | 6 Months (Date of Manufacture) (Refrigerated) | ||
|
|
|
Multicore |
55
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
63/37 400 1% .064DIA 14AWG
|
C400 | Wire Solder | 14 AWG，16 SWG | 0.064" (1.63mm) | Spool，454g (1 lb) | Sn63Pb37 (63/37) | 361°F (183°C) | No-Clean | Leaded | Shelf Life Not Applicable | ||
|
|
|
Multicore |
75
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
63/37 HYDRO-X 2% .032DIA 20AWG
|
Hydro-X | Wire Solder | 20 AWG，21 SWG | 0.032" (0.81mm) | Spool，454g (1 lb) | Sn63Pb37 (63/37) | 361°F (183°C) | Water Soluble | Leaded | Shelf Life Not Applicable | ||
|
|
|
Multicore |
27
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
63/37 370 3% .032DIA 20AWG
|
370 | Wire Solder | 20 AWG，21 SWG | 0.032" (0.81mm) | Spool，454g (1 lb) | Sn63Pb37 (63/37) | 361°F (183°C) | Rosin Activated (RA) | Leaded | Shelf Life Not Applicable | ||
|
|
|
Multicore |
34
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
63/37 400 3% .032DIA 20AWG
|
C400 | Wire Solder | 20 AWG，21 SWG | 0.032" (0.81mm) | Spool，454g (1 lb) | Sn63Pb37 (63/37) | 361°F (183°C) | No-Clean | Leaded | Shelf Life Not Applicable | ||
|
|
|
Multicore |
86
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
60/40 370 3% .064DIA. 14AWG
|
370 | Wire Solder | 14 AWG，16 SWG | 0.064" (1.63mm) | Spool，454g (1 lb) | Sn60Pb40 (60/40) | 361 ~ 374°F (183 ~ 190°C) | Rosin Activated (RA) | Leaded | Shelf Life Not Applicable | ||
|
|
|
MG Chemicals |
99
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SOLDER LF SN96 21GAUGE .25LBS
|
4900 | Wire Solder | 20 AWG，21 SWG | 0.032" (0.81mm) | Spool，113g (1/4 lb) | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 423 ~ 430°F (217 ~ 221°C) | No-Clean | Lead Free | Shelf Life Not Applicable | ||
|
|
|
MG Chemicals |
12
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SOLDER LF SAC305 NO CLEAN
|
4916 | Wire Solder | 16 AWG，18 SWG | 0.050" (1.27mm) | Spool，4 oz (113.4 g) | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 423 ~ 430°F (217 ~ 221°C) | No-Clean | Lead Free | Shelf Life Not Applicable | ||
|
|
|
Multicore |
72
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
63/37 400 2% .048DIA 16AWG
|
C400 | Wire Solder | 16 AWG，18 SWG | 0.048" (1.22mm) | Spool，454g (1 lb) | Sn63Pb37 (63/37) | 361°F (183°C) | No-Clean | Leaded | Shelf Life Not Applicable | ||
|
|
|
Multicore |
87
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
63/37 CRYSL 502 3% .064DIA 14AWG
|
C502 | Wire Solder | 14 AWG，16 SWG | 0.064" (1.63mm) | Spool，454g (1 lb) | Sn63Pb37 (63/37) | 361°F (183°C) | No-Clean | Leaded | Shelf Life Not Applicable | ||
|
|
|
Chip Quik Inc. |
24
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
LF SOLDER WIRE 96.5/3/0.5 TIN/SI
|
- | Wire Solder | 27 AWG，28 SWG | 0.015" (0.38mm) | Spool，8 oz (226.8 g) | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 423 ~ 428°F (217 ~ 220°C) | No-Clean，Water Soluble | Lead Free | Shelf Life Not Applicable | ||
|
|
|
Multicore |
61
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
60/40 370 3% .024DIA 22AWG
|
370 | Wire Solder | 22 AWG，23 SWG | 0.024" (0.61mm) | Spool，454g (1 lb) | Sn60Pb40 (60/40) | 361 ~ 374°F (183 ~ 190°C) | Rosin Activated (RA) | Leaded | Shelf Life Not Applicable |
