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Discover 11,371 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Comair Rotron |
Inquiry
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 22.9X8X10.2MM
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- | Top Mount | Copper | 0.315" (8.00mm) | 0.900" (22.86mm) | - | SMD Pad | TO-252 (DPAK) | 0.400" (10.16mm) | 2.5W @ 35°C | 17.50°C/W @ 300 LFM | - | Tin | ||
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Comair Rotron |
Inquiry
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 6.4X13.2X19.1MM
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- | Board Level | Aluminum | 0.750" (19.05mm) | 0.520" (13.21mm) | - | Bolt On | TO-220 | 0.250" (6.35mm) | 1.5W @ 50°C | 10.00°C/W @ 500 LFM | - | Black Anodized | ||
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Comair Rotron |
Inquiry
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 19X12.8X12.7MM
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- | Board Level | Aluminum | 0.750" (19.05mm) | 0.504" (12.80mm) | - | Clip | TO-220, TO-262 | 0.500" (12.70mm) | 1.0W @ 30°C | 8.00°C/W @ 300 LFM | - | Black Anodized | ||
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Comair Rotron |
Inquiry
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 19X12.7X12.7MM
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- | Board Level, Vertical | Aluminum | 0.750" (19.05mm) | 0.500" (12.70mm) | - | Clip and PC Pin | TO-220, TO-262 | 0.500" (12.70mm) | 1.0W @ 40°C | 16.00°C/W @ 200 LFM | - | Black Anodized | ||
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Comair Rotron |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 19X12.8X12.7MM
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- | Board Level, Vertical | Aluminum | 0.750" (19.05mm) | 0.504" (12.80mm) | - | Clip and PC Pin | TO-220, TO-262 | 0.500" (12.70mm) | 1.0W @ 30°C | 7.00°C/W @ 400 LFM | - | Black Anodized | ||
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Comair Rotron |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK STAMP 19X12.8X12.7MM
|
- | Board Level, Vertical | Aluminum | 0.750" (19.05mm) | 0.504" (12.80mm) | - | Clip and PC Pin | TO-220, TO-262 | 0.500" (12.70mm) | 1.0W @ 30°C | 7.00°C/W @ 400 LFM | - | Black Anodized | ||
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Comair Rotron |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 19X12.8X12.7MM
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- | Board Level, Vertical | Aluminum | 0.750" (19.05mm) | 0.504" (12.80mm) | - | Clip and PC Pin | TO-220, TO-262 | 0.500" (12.70mm) | 1.0W @ 30°C | 7.00°C/W @ 400 LFM | - | Black Anodized | ||
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Comair Rotron |
Inquiry
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-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 22.2X5.4X30.3MM
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- | Board Level, Vertical | Aluminum | 1.193" (30.30mm) | 0.874" (22.20mm) | - | Bolt On and PC Pin | TO-220 | 0.211" (5.35mm) | 1.0W @ 30°C | 10.00°C/W @ 200 LFM | - | Black Anodized | ||
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Comair Rotron |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 19X12.8X12.7MM
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- | Board Level | Aluminum | 0.750" (19.05mm) | 0.504" (12.80mm) | - | Clip and PC Pin | TO-220, TO-262 | 0.500" (12.70mm) | 1.0W @ 30°C | 7.00°C/W @ 400 LFM | - | Black Anodized | ||
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Comair Rotron |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 6.4X13.3X19.1MM
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- | Board Level, Vertical | Aluminum | 0.750" (19.05mm) | 0.520" (13.21mm) | - | Bolt On and PC Pin | TO-220 | 0.250" (6.35mm) | 1.5W @ 50°C | 16.00°C/W @ 200 LFM | - | Black Anodized | ||
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Comair Rotron |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 26.2X12.7X9.9MM
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- | Top Mount | Copper | 0.500" (12.70mm) | 1.031" (26.20mm) | - | SMD Pad | TO-263 (D2Pak) | 0.390" (9.91mm) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | - | Tin |
