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Discover 109,560 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Advanced Thermal Solutions Inc. |
975
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEAT SINK 15MM X 15MM X 7.5MM
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maxiFLOW | Aluminum | Square, Angled Fins | 0.590" (14.99mm) | 0.590" (14.99mm) | - | Thermal Tape, Adhesive (Included) | BGA | 0.295" (7.50mm) | - | 19.70°C/W @ 200 LFM | - | Blue Anodized | |||
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CTS Thermal Management Products |
3,861
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3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
|
APF | Aluminum | Square, Fins | 0.748" (19.00mm) | 0.748" (19.00mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.250" (6.35mm) | - | 7.10°C/W @ 200 LFM | - | Black Anodized | ||
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CTS Thermal Management Products |
1,900
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK FORGED W/ADHESIVE TAPE
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APF | Aluminum | Square, Fins | 0.748" (19.00mm) | 0.748" (19.00mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.370" (9.40mm) | - | 5.30°C/W @ 200 LFM | - | Black Anodized | ||
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Advanced Thermal Solutions Inc. |
222
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEAT SINK 25MM X 25MM X 7.5MM
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maxiFLOW | Aluminum | Square, Angled Fins | 0.984" (25.00mm) | 0.984" (25.00mm) | - | Thermal Tape, Adhesive (Included) | BGA | 0.295" (7.50mm) | - | 8.60°C/W @ 200 LFM | - | Blue Anodized | |||
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|
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CTS Thermal Management Products |
3,956
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
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APF | Aluminum | Square, Fins | 1.181" (30.00mm) | 1.181" (30.00mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.500" (12.70mm) | - | 2.50°C/W @ 200 LFM | - | Black Anodized | ||
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|
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CTS Thermal Management Products |
475
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK FORGED W/ADHESIVE TAPE
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APF | Aluminum | Square, Fins | 1.181" (30.00mm) | 1.181" (30.00mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.250" (6.35mm) | - | 4.40°C/W @ 200 LFM | - | Black Anodized | ||
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Wakefield-Vette |
1,155
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK 40X40X23MM PIN
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910 | Aluminum | Square, Pin Fins | 1.575" (40.01mm) | 1.575" (40.01mm) | - | Clip | BGA | 0.892" (22.65mm) | - | 2.00°C/W @ 200 LFM | 8.30°C/W | Black Anodized | ||
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Advanced Thermal Solutions Inc. |
231
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 15MM X 15MM X 19.5MM
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- | Aluminum | Square, Fins | 0.590" (14.99mm) | 0.590" (14.99mm) | - | Thermal Tape, Adhesive (Included) | BGA | 0.768" (19.50mm) | - | 13.40°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
1,137
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 37.5 X 37.5 X 7.5MM
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maxiFLOW | Aluminum | Square, Angled Fins | 1.476" (37.50mm) | 1.476" (37.50mm) | - | Thermal Tape, Adhesive (Included) | BGA | 0.295" (7.50mm) | - | 4.90°C/W @ 200 LFM | - | Blue Anodized | |||
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|
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CTS Thermal Management Products |
199
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK LOW-PROFILE FORGED
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APF | Aluminum | Square, Fins | 1.575" (40.01mm) | 1.575" (40.01mm) | - | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.250" (6.35mm) | - | 3.30°C/W @ 200 LFM | - | Black Anodized | ||
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|
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CTS Thermal Management Products |
969
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK LOW-PROFILE FORGED
|
APF | Aluminum | Square, Fins | 1.575" (40.01mm) | 1.575" (40.01mm) | - | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.370" (9.40mm) | - | 2.50°C/W @ 200 LFM | - | Black Anodized | ||
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|
|
CTS Thermal Management Products |
657
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
|
APF | Aluminum | Square, Fins | 1.575" (40.01mm) | 1.575" (40.01mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.250" (6.35mm) | - | 3.30°C/W @ 200 LFM | - | Black Anodized | ||
|
|
Advanced Thermal Solutions Inc. |
1,318
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 15MM X 15MM X 24.5MM
|
- | Aluminum | Square, Fins | 0.590" (14.99mm) | 0.590" (14.99mm) | - | Thermal Tape, Adhesive (Included) | BGA | 0.964" (24.50mm) | - | 10.50°C/W @ 200 LFM | - | Black Anodized | |||
|
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Advanced Thermal Solutions Inc. |
3,361
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK 25.4MM X 25.4MM X 4MM
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maxiFLOW | Aluminum | Square, Angled Fins | 0.984" (25.00mm) | 0.984" (25.00mm) | - | Thermal Tape, Adhesive (Included) | ASIC | 0.157" (4.00mm) | - | 9.00°C/W @ 200 LFM | - | Black Anodized | |||
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Advanced Thermal Solutions Inc. |
712
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 15MM X 15MM X 17.5MM
|
maxiFLOW | Aluminum | Square, Angled Fins | 0.590" (14.99mm) | 0.590" (14.99mm) | - | Thermal Tape, Adhesive (Included) | BGA | 0.689" (17.50mm) | - | 8.70°C/W @ 200 LFM | - | Blue Anodized | |||
|
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Advanced Thermal Solutions Inc. |
2,619
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 27MM X 27MM X 24.5MM
|
- | Aluminum | Square, Pin Fins | 1.063" (27.00mm) | 1.063" (27.00mm) | - | Thermal Tape, Adhesive (Included) | BGA | 0.964" (24.50mm) | - | 4.50°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
1,018
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 23MM X 23MM X 17.5MM
|
maxiFLOW | Aluminum | Square, Angled Fins | 0.900" (23.00mm) | 0.906" (23.01mm) | - | Thermal Tape, Adhesive (Included) | BGA | 0.689" (17.50mm) | - | 5.10°C/W @ 200 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
745
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 25.2MM X 25.2MM X 4MM
|
blueICE | Aluminum | Square, Angled Fins | 0.992" (25.20mm) | 0.992" (25.20mm) | - | Thermal Tape, Adhesive (Included) | BGA | 0.157" (4.00mm) | - | 14.80°C/W @ 200 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
1,092
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 19MM X 19MM X 9.5MM
|
maxiGRIP, maxiFLOW | Aluminum | Square, Angled Fins | 0.748" (19.00mm) | 0.748" (19.00mm) | - | Clip, Thermal Material | BGA | 0.374" (9.50mm) | - | 16.70°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
306
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 70X70X25MM XCUT CP
|
pushPIN | Aluminum | Square, Fins | 2.756" (70.00mm) | 2.756" (70.00mm) | - | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.984" (25.00mm) | - | 2.18°C/W @ 100 LFM | - | Blue Anodized |
