- Manufacturer：
-
- Series：
-
- Material：
-
- Shape：
-
- Length：
-
- Width：
-
- Diameter：
-
- Attachment Method：
-
- Package Cooled：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Selected conditions:
Discover 109,560 products
 |
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|
|
|
CTS Thermal Management Products |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED WITH MEDIUM CLIP
|
APR | Aluminum | Square, Pin Fins | 1.461" (37.10mm) | 1.461" (37.10mm) | - | Clip | Assorted (BGA, LGA, CPU, ASIC...) | 0.457" (11.60mm) | - | 3.30°C/W @ 200 LFM | - | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED WITH TALL CLIP
|
APR | Aluminum | Square, Pin Fins | 1.461" (37.10mm) | 1.461" (37.10mm) | - | Clip | Assorted (BGA, LGA, CPU, ASIC...) | 0.457" (11.60mm) | - | 3.30°C/W @ 200 LFM | - | Black Anodized | ||
|
|
|
Wakefield-Vette |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 25MM SQUARE W/TAPE
|
624 | Aluminum | Square, Pin Fins | 0.827" (21.00mm) | 0.827" (21.00mm) | - | Thermal Tape, Adhesive (Included) | BGA | 0.350" (8.89mm) | - | 15.00°C/W @ 400 LFM | - | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FAN TOP PRESSON TO8
|
Fan Top | Brass | Cylindrical | - | - | 1.250" (31.75mm) OD | Press Fit | TO-8 | 0.330" (8.38mm) | - | - | 41.00°C/W | - | ||
|
|
CTS Thermal Management Products |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK PRESS ON WO/HRDWR TO-8
|
- | Brass | Cylindrical | - | - | - | Press Fit | TO-5 | 0.250" (6.35mm) | 0.5W @ 41°C | - | - | Dull Nickel | |||
|
|
|
CTS Thermal Management Products |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK PRESS ON NICKEL TO-18
|
- | Brass | Cylindrical | 0.340" (8.64mm) | 0.220" (5.59mm) | 0.220" (5.59mm) OD | Bolt On | TO-18 | - | - | - | - | Dull Nickel | ||
|
|
|
CTS Thermal Management Products |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
THERMAL LINK PRESSON TO-18
|
Fan Top | Beryllium Copper | Cylindrical | - | - | 0.500" (12.70mm) OD | Press Fit | TO-18 | 0.250" (6.35mm) | - | - | 150.00°C/W | - | ||
|
|
|
CTS Thermal Management Products |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
THERMAL LINK PRESSON NKL TO-5
|
- | Brass | Cylindrical | 0.370" (9.40mm) | 0.380" (9.65mm) | 0.380" (9.65mm) OD | Press Fit, Bolt On | TO-5 | - | - | - | 82.00°C/W | Dull Nickel | ||
|
|
|
CTS Thermal Management Products |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
THERMAL LINK PRESSON TO-5
|
Fan Top | Beryllium Copper | Cylindrical | - | - | 0.750" (19.05mm) OD | Press Fit | TO-5 | 0.250" (6.35mm) | - | - | 81.10°C/W | - | ||
|
|
|
CTS Thermal Management Products |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED 35X35X12MM
|
APR | Aluminum | Square, Pin Fins | 1.366" (34.70mm) | 1.366" (34.70mm) | - | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.457" (11.60mm) | - | 3.50°C/W @ 200 LFM | - | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED 40X40X12MM
|
APR | Aluminum | Square, Pin Fins | 1.560" (39.62mm) | 1.560" (39.62mm) | - | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.457" (11.60mm) | - | 2.80°C/W @ 200 LFM | - | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
|
APR | Aluminum | Square, Pin Fins | 1.560" (39.62mm) | 1.560" (39.62mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.457" (11.60mm) | - | 2.80°C/W @ 200 LFM | - | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED 43X43X15MM
|
APR | Aluminum | Square, Pin Fins | 1.657" (42.10mm) | 1.657" (42.10mm) | - | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.575" (14.60mm) | - | 2.00°C/W @ 200 LFM | - | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
|
APR | Aluminum | Square, Pin Fins | 1.657" (42.10mm) | 1.657" (42.10mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.575" (14.60mm) | - | 2.00°C/W @ 200 LFM | - | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK LOW-PROFILE FORGED
|
APF | Aluminum | Square, Fins | 0.748" (19.00mm) | 0.748" (19.00mm) | - | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.500" (12.70mm) | - | 4.00°C/W @ 200 LFM | - | Black Anodized | ||
|
|
|
Comair Rotron |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 22.9X8X10.2MM
|
- | Copper | Rectangular, Fins | 0.315" (8.00mm) | 0.900" (22.86mm) | - | SMD Pad | TO-252 (DPAK) | 0.400" (10.16mm) | 2.5W @ 35°C | 17.50°C/W @ 300 LFM | - | Tin | ||
|
|
|
Comair Rotron |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 26.2X12.7X9.9MM
|
- | Copper | Rectangular, Fins | 0.500" (12.70mm) | 1.031" (26.20mm) | - | SMD Pad | TO-263 (D2Pak) | 0.390" (9.91mm) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | - | Tin | ||
|
|
Advanced Thermal Solutions Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 35MM X 35MM X 17.5MM
|
maxiFLOW | Aluminum | Square, Angled Fins | 1.378" (35.00mm) | 1.378" (35.00mm) | - | Thermal Tape, Adhesive (Included) | BGA | 0.689" (17.50mm) | - | 2.30°C/W @ 200 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 40X40X25MM L-TAB
|
pushPIN | Aluminum | Square, Fins | 1.575" (40.01mm) | 1.575" (40.01mm) | - | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.984" (25.00mm) | - | 4.11°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 35X35X30MM R-TAB
|
pushPIN | Aluminum | Square, Fins | 1.378" (35.00mm) | 1.378" (35.00mm) | - | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 1.181" (30.00mm) | - | 3.90°C/W @ 100 LFM | - | Blue Anodized |
