- Manufacturer：
-
- Series：
-
- Type：
-
- Material：
-
- Shape：
-
- Length：
-
- Width：
-
- Diameter：
-
- Attachment Method：
-
- Package Cooled：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
- Selected conditions:
Discover 112,204 products
 |
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|
|
|
Aavid, Thermal Division of Boyd Corporation |
4,750
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK SMT D-PAK/TO-252 TIN
|
- | Top Mount | Copper | Rectangular, Fins | 0.315" (8.00mm) | 0.900" (22.86mm) | - | SMD Pad | TO-252 (DPAK) | 0.400" (10.16mm) | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | Tin | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
4,764
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK SMT D-PAK/TO-252 TIN
|
- | Top Mount | Copper | Rectangular, Fins | 0.315" (8.00mm) | 0.900" (22.86mm) | - | SMD Pad | TO-252 (DPAK) | 0.400" (10.16mm) | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | Tin | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
16,627
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEATSINK .5" TO-220
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.180" (29.97mm) | 1.000" (25.40mm) | - | Clip and Board Locks | TO-220 | 0.500" (12.70mm) | 1.0W @ 20°C | 6.00°C/W @ 300 LFM | 13.40°C/W | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
6,015
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 W/PINS 1.5"TALL
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.500" (38.10mm) | 1.375" (34.93mm) | - | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 8.0W @ 80°C | 3.00°C/W @ 500 LFM | 11.00°C/W | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
4,325
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 W/PINS 1" TALL
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.000" (25.40mm) | 1.375" (34.93mm) | - | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 2.0W @ 30°C | 4.00°C/W @ 400 LFM | 13.40°C/W | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
5,395
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 CLIP-ON BLACK
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 0.700" (17.78mm) | 0.520" (13.21mm) | - | Clip | TO-220 | 0.510" (12.95mm) | 2.0W @ 50°C | 12.00°C/W @ 300 LFM | 25.00°C/W | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
6,570
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 W/PINS 1" TALL
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.000" (25.40mm) | 1.375" (34.93mm) | - | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 2.0W @ 30°C | 4.00°C/W @ 400 LFM | 13.40°C/W | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
1,343
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-218/TO-247 W/PINS 2"
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 2.000" (50.80mm) | 1.375" (34.93mm) | - | Bolt On and PC Pin | TO-218, TO-247 | 0.500" (12.70mm) | 2.0W @ 20°C | 3.00°C/W @ 400 LFM | 8.30°C/W | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
6,500
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220
|
- | Top Mount | Copper | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | - | SMD Pad | TO-263 (D2Pak) | 0.450" (11.43mm) | 2.0W @ 30°C | 3.00°C/W @ 300 LFM | 11.00°C/W | Tin | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
6,648
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220
|
- | Top Mount | Copper | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | - | SMD Pad | TO-263 (D2Pak) | 0.450" (11.43mm) | 2.0W @ 30°C | 3.00°C/W @ 300 LFM | 11.00°C/W | Tin | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
6,648
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220
|
- | Top Mount | Copper | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | - | SMD Pad | TO-263 (D2Pak) | 0.450" (11.43mm) | 2.0W @ 30°C | 3.00°C/W @ 300 LFM | 11.00°C/W | Tin | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
8,391
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 PWR BLK W/PINS
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.000" (25.40mm) | 0.640" (16.26mm) | - | Bolt On and PC Pin | TO-220 | 0.640" (16.26mm) | 2.5W @ 50°C | 4.00°C/W @ 500 LFM | 17.40°C/W | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
2,678
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 4.3W H=1.0 BLK
|
- | Board Level | Aluminum | Rectangular, Fins | 1.000" (25.40mm) | 0.640" (16.26mm) | - | Bolt On | TO-220 | 0.640" (16.26mm) | 2.5W @ 50°C | 4.00°C/W @ 500 LFM | - | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
12,216
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
TOP MOUNT HEATSINK .45" D2PAK
|
- | Top Mount | Copper | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | - | SMD Pad | TO-263 (D2Pak) | 0.450" (11.43mm) | 2.0W @ 30°C | 3.00°C/W @ 300 LFM | 11.00°C/W | Tin | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
5,710
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEATSINK 1" TO-220
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.000" (25.40mm) | 1.650" (41.91mm) | - | Bolt On and PC Pin | TO-220 | 1.000" (25.40mm) | 4.0W @ 30°C | 4.00°C/W @ 200 LFM | 5.50°C/W | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
11,699
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEATSINK .375" D2PAK
|
- | Top Mount | Copper | Rectangular, Fins | 0.590" (14.99mm) | 1.020" (25.91mm) | - | SMD Pad | TO-263 (D2Pak), PowerSO-10 (MO-184), SO-10 | 0.375" (9.52mm) | 2.0W @ 40°C | 5.00°C/W @ 400 LFM | - | Tin | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
7,326
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 DUAL MNT W/TABS
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.000" (25.40mm) | 1.480" (37.59mm) | - | Bolt On and PC Pin | TO-220 (Dual) | 0.500" (12.70mm) | 2.0W @ 30°C | 3.00°C/W @ 700 LFM | 13.20°C/W | Black Anodized | ||
|
|
|
Wakefield-Vette |
38,100
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK BGA/PGA 16.5X16.5X8.9
|
Penguin | Board Level | Aluminum | Square, Fins | 0.650" (16.51mm) | 0.653" (16.59mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.350" (8.89mm) | - | 8.00°C/W @ 500 LFM | - | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
6,071
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 W/PINS 1.5"TALL
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.000" (25.40mm) | 1.650" (41.91mm) | - | Bolt On and PC Pin | TO-220 | 1.500" (38.10mm) | 10.0W @ 50°C | 3.00°C/W @ 200 LFM | 3.70°C/W | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
1,969
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-218/TO-220 PIN
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.000" (25.40mm) | 1.650" (41.91mm) | - | Bolt On and PC Pin | TO-220, TO-218 | 1.000" (25.40mm) | 4.0W @ 30°C | 1.50°C/W @ 600 LFM | 5.60°C/W | Black Anodized |
